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Copper reversion

S Copper, reverse treated electrodeposited, high temperature elongation... [Pg.129]

However, closer examination showed that the Cu-Ni system, immediately after the interruption of current, acquires an open circuit potential (or a mixed potential) which hes above the nickel reversible potential and below the copper reversible potential. In addition, the pH of these solutions, i.e. pH = 4, does not allow the formation of nickel oxides on the surface of the nickel. Therefore, in accordance with the mixed potential theory, copper continues to deposit at the expense of nickel dissolution, forming a classic galvanic corrosion cell. This process does not... [Pg.28]

The rather low value obtained with the copper phthalocyanine, a low-energy solid (line (v)), is probably explicable by some reversible capillary condensation in the crevices of the aggregate, the effect of which would be to increase the uptake at a given relative pressure the plausibility of this explanation is supported by the fact that very low values of s, 1-47-1-77, were obtained with certain other phthalocyanines known to be meso-porous (cf. Chapter 3). [Pg.90]

Butyrolactone reacts rapidly and reversibly with ammonia or an amine forming 4-hydroxybutyramides (175), which dissociate to the starting materials when heated. At high temperatures and pressures the hydroxybutyramides slowly and irreversibly dehydrate to pyrroHdinones (176). A copper-exchanged Y-2eohte (177) or magnesium siUcate (178) is said to accelerate this dehydration. [Pg.111]

Tables 1 and 2, respectively, Hst the properties of manganese and its aHotropic forms. The a- and P-forms are brittle. The ductile y-form is unstable and quickly reverses to the a-form unless it is kept at low temperature. This form when quenched shows tensile strength 500 MPa (72,500 psi), yield strength 250 MPa (34,800 psi), elongation 40%, hardness 35 Rockwell C (see Hardness). The y-phase may be stabilized usiag small amounts of copper and nickel. Additional compilations of properties and phase diagrams are given ia References 1 and 2. Tables 1 and 2, respectively, Hst the properties of manganese and its aHotropic forms. The a- and P-forms are brittle. The ductile y-form is unstable and quickly reverses to the a-form unless it is kept at low temperature. This form when quenched shows tensile strength 500 MPa (72,500 psi), yield strength 250 MPa (34,800 psi), elongation 40%, hardness 35 Rockwell C (see Hardness). The y-phase may be stabilized usiag small amounts of copper and nickel. Additional compilations of properties and phase diagrams are given ia References 1 and 2.
Electrorefining. Electrolytic refining is a purification process in which an impure metal anode is dissolved electrochemicaHy in a solution of a salt of the metal to be refined, and then recovered as a pure cathodic deposit. Electrorefining is a more efficient purification process than other chemical methods because of its selectivity. In particular, for metals such as copper, silver, gold, and lead, which exhibit Htfle irreversibHity, the operating electrode potential is close to the reversible potential, and a sharp separation can be accompHshed, both at the anode where more noble metals do not dissolve and at the cathode where more active metals do not deposit. [Pg.175]

Polyunsaturated fatty acids in vegetable oils, particularly finolenic esters in soybean oil, are especially sensitive to oxidation. Even a slight degree of oxidation, commonly referred to as flavor reversion, results in undesirable flavors, eg, beany, grassy, painty, or fishy. Oxidation is controlled by the exclusion of metal contaminants, eg, iron and copper addition of metal inactivators such as citric acid minimum exposure to air, protection from light, and selective hydrogenation to decrease the finolenate content to ca 3% (74). Careful quality control is essential for the production of acceptable edible soybean oil products (75). [Pg.302]

Copper sulfate, in small amounts, activates the zinc dust by forming zinc—copper couples. Arsenic(III) and antimony(TTT) oxides are used to remove cobalt and nickel they activate the zinc and form intermetaUic compounds such as CoAs (49). Antimony is less toxic than arsenic and its hydride, stibine, is less stable than arsine and does not form as readily. Hydrogen, formed in the purification tanks, may give these hydrides and venting and surveillance is mandatory. The reverse antimony procedure gives a good separation of cadmium and cobalt. [Pg.403]

Even very small amounts of transition-metal ions like cobalt, nickel, and copper cause rapid decomposition. They form reactive intermediates that can decrease the stabiUty of oxidizable compounds in the bleach solution and increase the damage to substrates. Hypochlorite is also decomposed by uv light (24,25). Acidic solutions also lose available chlorine by the reverse of equations 1 and 2. [Pg.143]

Current density can be increased without impairing the quaUty of the copper by polishing the cathode surface by brief periodic current reversals (PCR). Reversed current electrolysis, first developed for electroplating, was tested in 1952 for copper refining. Although good results were obtained, no suitable electrical equipment for current reversal was available. The thyristor-controUed siUcon rectifier, introduced in the 1960s, provided a means for... [Pg.204]

The first commercial boards usiag electroless plating for connection between the sides were made by Motorola ia 1953 (41). An unclad plastic board was coated with electroless silver, a reverse resist appHed, and copper electroplated to the required circuit thickness. The resist and excess silver were removed. This semi-additive process is stiU used, with copper replacing the silver. [Pg.111]

SemiadditiveMethod. The semiadditive method was developed to reduce copper waste. Thin 5.0 lm (4.5 mg/cm ) copper foil laminates are used, or the whole surface may be plated with a thin layer of electroless copper. Hole forming, catalysis, and electroless copper plating are done as for subtractive circuitry. A strippable reverse—resist coating is then appHed. Copper is electroplated to 35 p.m or more, followed by tin or tin—lead plating to serve as an etch resist. The resist is removed, and the whole board is etched. The original thin copper layer is quickly removed to leave the desired circuit. This method wastes less than 10% of the copper. [Pg.112]

For a given amplitude of the quasi-elastic release wave, the more the release wave approaches the ideal elastic-plastic response the greater the strength at pressure of the material. The lack of an ideally elastic-plastic release wave in copper appears to suggest a limited reversal component, however, this is much less than in the silicon bronze. Collectively, the differences in wave profiles between these two materials are consistent with a micro-structurally controlled Bauschinger component as supported by the shock-recovery results. Further study is required to quantify these findings and... [Pg.209]

Rubbers are exceptional in behaving reversibly, or almost reversibly, to high strains as we said, almost all materials, when strained by more than about 0.001 (0.1%), do something irreversible and most engineering materials deform plastically to change their shape permanently. If we load a piece of ductile metal (like copper), for example in tension, we get the following relationship between the load and the extension (Fig. 8.4). This can be... [Pg.79]


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See also in sourсe #XX -- [ Pg.617 ]




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