Cobalt/copper electrodeposited

The multilayered Cu/Co systems discussed here can be grown as described next (6b). Electrolyte composition is based on a cobalt/copper ratio of 100 1 and consists of a solution of 0.34 M cobalt sulfate, 0.003 M copper sulfate, and 30g/L boric acid. The pH is fixed around 3.0, and there is no forced convection while deposition is carried out. The electrodeposition may usually be carried out potentiostatically at 45°C between —1.40 V versus SCE for the cobalt and —0.65 V versus SCE for the copper with an 3 cell potential interrupt between the cobalt-to-copper transition to avoid cobalt dissolution, which can occur when there is no interrupt. 

This is of course not the case when working with room temperature ionic liquid systems. Electrochemical and spectroscopic studies of cobalt, copper, and nickel, have been carried out in the AlClj-butylpyridinium chloride molten salt system. The direct current and pulsed current electrodeposition of Ni-Al alloys has also been shown in acidic AlCls-butylpyridinium chloride ionic liquids. This particular alloy has also been shown to be successful in AlCl3-[C2-mim]Cl ashave Co-Al andCu-Al. Electrochemical techniques can also be used to calculate the diffusion coefficients of metal ions. Table 21.2.6 shows the calculated diffusion coefficients and stokes-Einstein products of cobalt(II), copper(I), nickel(II) and zinc(II) in the 40-60 mol% [Cj-mimlCl-AlClj ionic liquid. 

Dulal, S. M. S. L, Charles, E. A. and Roy, S. (2004b), Dissolution from electrodeposited copper-cobalt-copper sandwiches , J. Appl. Electrochem., 34,151-8. 

Solvent for Electrolytic Reactions. Dimethyl sulfoxide has been widely used as a solvent for polarographic studies and a more negative cathode potential can be used in it than in water. In DMSO, cations can be successfully reduced to metals that react with water. Thus, the following metals have been electrodeposited from their salts in DMSO cerium, actinides, iron, nickel, cobalt, and manganese as amorphous deposits zinc, cadmium, tin, and bismuth as crystalline deposits and chromium, silver, lead, copper, and titanium (96—103). Generally, no metal less noble than zinc can be deposited from DMSO. 

The influence of benzylidene acetone on the electrodeposition mechanism of Zn-Co alloy was investigated [436]. A relationship between corrosion resistance, microstructure, and cobalt content in Zn-Co alloys was investigated [437] using X-ray photoelectron spectroscopy (XPS) and Auger spectroscopy [438]. The role of vitreous carbon, copper, and nickel substrates in Zn-Co deposition from chloride bath was analyzed [439]. 

It is interesting to conclude this section with an example that, in a sense, brings the chapter full circle. The metallization of plastic materials used as metal substitutes is a process with actual and future commercial potential. Usually, plastics are plated after appropriate sensitization by an electroless process which involves reduction of metal ions (e.g. Ni2+, Cu2+) by chemical rather than electrical means.19 There seems no reason why the reducing agent should not be incorporated in the polymer and Murray and his collaborators101 have demonstrated that copper, silver, cobalt and nickel may each be electrodeposited on to films of [poly-Ru(bipy)2(4-vinylpyridine)2]2+ coated on to platinum electrodes. The metal reductions are mediated by the Ru1 and Ru° states of the polymer. 

We will present some results obtained by electrodepositing thin films of Cu, Co and Ni on silicon. Emphasis will be given to different aspects on each case, namely, the morphology and growth rate of copper thin layers, hydrogen evolution during cobalt deposition and structure and electrical properties of nickel layers. 

Many alloys may be electrodeposited, including copper-zinc, copper-tin, lead-tin, cobalt-tin, nickel-cobalt, nickel-iron, and nickel-tin. The copper-zinc alloys are used to coat steel wire used in tire-cord. Lead-tin alloys are known as terneplate and have many corrosion resistant applications. 

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