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Chemical circuits

The four above-mentioned methods all utilize chemical oxidants to remove charge from the graphite. Whether the oxidant is the halide itself, an added halogen or the solvent, a reduced chemical is produced. This possible complication can be eliminated by use of anodic oxidation, in which an external chemical circuit serves as an oxidant . [Pg.377]

Let the pellets be placed in a flowing stream of reactants inside a tubular reactor. Restricting our attention now to a single pellet and its immediate environment, the various steps involved in the overall process are shown in Figure 7.1. This physical-chemical circuit is built in analogy with the electrical circuit shown at the bottom of the figure. Clearly, the overall process is a complex combination... [Pg.171]

Beider, D. (2009) Towards an Integrated Chemical Circuit. Angew. Chem. Int. Ed. 48 3736-3737. [Pg.212]

It turns out that there is another branch of mathematics, closely related to tire calculus of variations, although historically the two fields grew up somewhat separately, known as optimal control theory (OCT). Although the boundary between these two fields is somewhat blurred, in practice one may view optimal control theory as the application of the calculus of variations to problems with differential equation constraints. OCT is used in chemical, electrical, and aeronautical engineering where the differential equation constraints may be chemical kinetic equations, electrical circuit equations, the Navier-Stokes equations for air flow, or Newton s equations. In our case, the differential equation constraint is the TDSE in the presence of the control, which is the electric field interacting with the dipole (pemianent or transition dipole moment) of the molecule [53, 54, 55 and 56]. From the point of view of control theory, this application presents many new features relative to conventional applications perhaps most interesting mathematically is the admission of a complex state variable and a complex control conceptually, the application of control teclmiques to steer the microscopic equations of motion is both a novel and potentially very important new direction. [Pg.268]

Modelling plasma chemical systems is a complex task, because these system are far from thennodynamical equilibrium. A complete model includes the external electric circuit, the various physical volume and surface reactions, the space charges and the internal electric fields, the electron kinetics, the homogeneous chemical reactions in the plasma volume as well as the heterogeneous reactions at the walls or electrodes. These reactions are initiated primarily by the electrons. In most cases, plasma chemical reactors work with a flowing gas so that the flow conditions, laminar or turbulent, must be taken into account. As discussed before, the electron gas is not in thennodynamic equilibrium... [Pg.2810]

Chemicals used in the manufacture of integrated circuits (qv) need to be controlled to even mote stringent levels of purity than either USP or ACS grades. [Pg.446]

Plating Processes, Tin-Tead Solder Mlloy Fluoborate Plating Process for Printed Circuit Applications, HTPP3N 0272, Harshaw Chemical Co., Solon, Ohio. [Pg.170]

Molybdenum hexafluoride is used in the manufacture of thin films (qv) for large-scale integrated circuits (qv) commonly known as LSIC systems (3,4), in the manufacture of metallised ceramics (see MetaL-MATRIX COMPOSITES) (5), and chemical vapor deposition of molybdenum and molybdenum—tungsten alloys (see Molybdenumand molybdenum alloys) (6,7). The latter process involves the reduction of gaseous metal fluorides by hydrogen at elevated temperatures to produce metals or their alloys such as molybdenum—tungsten, molybdenum—tungsten—rhenium, or molybdenum—rhenium alloys. [Pg.212]

Sulfur hexafluoride [2551-62-4] 6 molecular weight 146.07, is a colorless, odorless, tasteless gas. It is not flammable and not particularly reactive. Its high chemical stabiUty and excellent electrical characteristics have led to widespread use in various kinds of electrical and electronic equipment such as circuit breakers, capacitors, transformers, microwave components, etc (see Electronic materials). Other properties of the gas have led to limited usage in a variety of unique appHcations ranging from medical appHcations to space research. [Pg.240]

Silicon Epitaxy. A critical step ia IC fabricatioa is the epitaxial depositioa of sdicoa oa an iategrated circuit. Epitaxy is defined as a process whereby a thin crystalline film is grown on a crystalline substrate. Silicon epitaxy is used ia bipolar ICs to create a high resistivity layer oa a low resistivity substrate. Most epitaxial depositioas are doae either by chemical vapor depositioa (CVD) or by molecular beam epitaxy (MBE) (see Thin films). CVD is the mainstream process. [Pg.346]

Deposition of Thin Films. Laser photochemical deposition has been extensively studied, especially with respect to fabrication of microelectronic stmctures (see Integrated circuits). This procedure could be used in integrated circuit fabrication for the direct generation of patterns. Laser-aided chemical vapor deposition, which can be used to deposit layers of semiconductors, metals, and insulators, could define the circuit features. The deposits can have dimensions in the micrometer regime and they can be produced in specific patterns. Laser chemical vapor deposition can use either of two approaches. [Pg.19]

Conformal coatings are protective coatings appHed to circuit board assembHes. They protect the interconnect conductors, solder joints, components, and the board itself they reduce permeabiHty to moisture, hostile chemical vapors, and solvents in the coating. Use of conformal coatings eliminates dendritic growth between conductors, conductor bridging from moisture condensation, and reduction in insulation resistance by water absorption. [Pg.532]

Properties desired in cable insulation and flexible circuit substrate materials include mechanical flexibiUty, fatigue endurance, and resistance to chemicals, water absorption, and abrasion. Both thermoplasts and thermosets are used as cable-insulating materials. Thermoplastic materials possess excellent electrical characteristics and are available at relatively low cost. [Pg.534]


See other pages where Chemical circuits is mentioned: [Pg.28]    [Pg.28]    [Pg.141]    [Pg.210]    [Pg.380]    [Pg.159]    [Pg.28]    [Pg.28]    [Pg.141]    [Pg.210]    [Pg.380]    [Pg.159]    [Pg.204]    [Pg.212]    [Pg.484]    [Pg.1944]    [Pg.2722]    [Pg.2804]    [Pg.65]    [Pg.9]    [Pg.118]    [Pg.204]    [Pg.245]    [Pg.440]    [Pg.401]    [Pg.253]    [Pg.49]    [Pg.290]    [Pg.67]    [Pg.72]    [Pg.304]    [Pg.451]    [Pg.324]    [Pg.390]    [Pg.512]    [Pg.68]    [Pg.132]    [Pg.394]    [Pg.397]    [Pg.190]    [Pg.532]   


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