Integrated circuit manufacturing, chemical

The determination of the lateral distributions of chemical species on surfaces is of constandy increasing technological importance in many applications, such as integrated circuit manufacturing. The two major tools that have been available are... 

Landis H, Burke P, Cote W, Hill W, Hoffman C, Kaanta C, Koburger C, Lange W, Leach M, Luce S. Integration of chemical-mechanical polishing into CMOS integrated circuit manufacturing. Thin Solid Films 1992 220(l-2) p 1-7. 

The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry. 

Particle removal is an imp>ortant fector in a number of technologies including integrated circuit manufacture and optical component manufecture. The small size of the relevant particles allows for strong chemical enhancements, despite the low crack velocities associated with chemical effects. Combined chemical anid mechanical attack is most effective for particle removal. 

Chemical Mechanical Planarization in Integrated Circuit Manufacturing... 

In some cases, the design of processing equipment is the key to product design, for example, in the chemical vapor deposition of polysilicon for integrated circuit manufacture, as discussed in Section 19.6. 

Epitaxial ItcHNOLOGY for Integrated Circuit Manufacturing Excitons, Semiconductor Lasers Lasers, Optical Fiber Lasers, Solid-State Light Emitting Diodes Metalorganic Chemical Vapor Deposition (MOCVD) Molecular Beam Epitaxy, Semiconductors Optical Amplifiers (Semiconductor) Semiconductor Alloys... 

Hocheng, H., Huang, Y.L., 2002. A comprehensive review of end point detection in chemical mechanical polishing for deep-submicron integrated circuits manufacturing. Int. J. Nano Technol. 1, 1—18. 

There are many different types of facility configurations in the industry. Table 1 highlights t3 ical chemicals present at a semiconductor/ integrated circuit manufacturing facility. It is not intended to be a complete or exhaustive listing. 

Chemicals used in the manufacture of integrated circuits (qv) need to be controlled to even mote stringent levels of purity than either USP or ACS grades. 

Molybdenum hexafluoride is used in the manufacture of thin films (qv) for large-scale integrated circuits (qv) commonly known as LSIC systems (3,4), in the manufacture of metallised ceramics (see MetaL-MATRIX COMPOSITES) (5), and chemical vapor deposition of molybdenum and molybdenum—tungsten alloys (see Molybdenumand molybdenum alloys) (6,7). The latter process involves the reduction of gaseous metal fluorides by hydrogen at elevated temperatures to produce metals or their alloys such as molybdenum—tungsten, molybdenum—tungsten—rhenium, or molybdenum—rhenium alloys. 

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