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Ceramic powder filler

TMA has been reviewed by many researchers including Riga [1] and Cebe and coworkers [2]. Subobh and co-workers [3] observed that the incorporation of ceramic powder filler into PTFE composites had no effect on polymer melting point but as the filler level increased the coefficient of thermal expansion reduced whilst the thermal... [Pg.57]

The thermal expansion of plastics can be increased by the incorporation of reinforcing agents or fillers into the formulation. Thns, the incorporation of ceramic powder filler into polytetraflnroethylene (PTFE) rednces the coefficient of thermal expansion. On the other hand, the incorporation of 20% glass fiber into epoxy resins will increase the coefficient of cubical expansion from 0.5 mn/mn/°C x 10" to 2.0 mn/mn/°C x 10. Reinforcanent of perfluoroalkoxyethylene improved the heat distortion temperature at 0.45 MPa from 24 C to lOO C and at 1.8 MPa from 30°C to 58°C. This was accompanied by a nominal increase in tensile strength. [Pg.1]

Firstly it can be used for obtaining layers with a thickness of several mono-layers to introduce and to distribute uniformly very low amounts of admixtures. This may be important for the surface of sorption and catalytic, polymeric, metal, composition and other materials. Secondly, the production of relatively thick layers, on the order of tens of nm. In this case a thickness of nanolayers is controlled with an accuracy of one monolayer. This can be important in the optimization of layer composition and thickness (for example when kernel pigments and fillers are produced). Thirdly the ML method can be used to influence the matrix surface and nanolayer phase transformation in core-shell systems. It can be used for example for intensification of chemical solid reactions, and in sintering of ceramic powders. Fourthly, the ML method can be used for the formation of multicomponent mono- and nanolayers to create surface nanostructures with uniformly varied thicknesses (for example optical applications), or with synergistic properties (for example flame retardants), or with a combination of various functions (polyfunctional coatings). Nanoelectronics can also utilize multicomponent mono- and nanolayers. [Pg.40]

Figure 3. Sintering of doped ceramic powders on doping of ceramics powder by using (a) the ML method and (b) mixing of components (1) filler and (2) nanolayer. Figure 3. Sintering of doped ceramic powders on doping of ceramics powder by using (a) the ML method and (b) mixing of components (1) filler and (2) nanolayer.
Use Ceramics, fireproofing filler for rubber and plastic compositions exposed to flame temperature, cosmetics and lotions, pharmaceuticals (ointments, dusting powders), zinc salts, medicine (topical antiseptic). [Pg.1344]

Typical fillers wood flour, glass fiber, carbon fiber, mica, wollastonite, mineral wool, talc, magnesium hydroxide, graphite, molybdenum sulfide, carbon black, cashew shell particles, alumina, chromium oxide, brass and copper powder, iron particles, steel fiber, ceramic powder, rubber particles, aramid, wollastonite, cellulosic fiber, lignin... [Pg.625]

The primary focus of this chapter is to describe the factors that influence flow behavior and mix homogeneity of a plastic mixture containing a high volume fraction of ceramic powder as a filler and a relatively small volume fraction of organic polymeric binder. The emphasis is placed on mixes in which flowability is achieved only above the ambient temperature. [Pg.239]

Another area in which preceramic polymers can be utilized effectively is as binders for ceramic powders in near net shaping fabrication processes, such as compression or injection molding with subsequent sintering. Alternatively, an active filler and a polymer [67,68], as reported by Greil and Seibold, can be used in such fabrication. Other potential applications of preceramic polymers is in the general area of coatings, especially for carbon-carbon composites [69], and in the synthesis of nanostructured ceramic particles and composites [70-73]. [Pg.372]

In Figure 5 the UV-Vis spectra of a radical photoinitiator and the BaTiOs (BT) filler that was used in an acrylic formulation are presented. It is evident that there is a competitive absorption between the photo-initiator and the ceramic powder in the UV region between 200 and 400 nm. That leads to a linear decrease of acrylic double bond during UV irradiation by increasing the filler content in the photocurable formulation [Lombardi et al, 2011],... [Pg.330]

Filler (e.g., metal or ceramic powders, particulate, beads)... [Pg.1020]

Organic-ceramic composites may use an epoxy as the matrix and glass or ceramic powder as the filler. A common example is the fiberglass-reinforced epoxy used as a printed circuit laminate. An epoxy substrate filled with alumina and carbon black has also been developed. By weight, the composition is 10.8 percent epoxy resin, 89 percent alumina, and 0.2 percent carbon black. This material has a thermal conductivity of 3.0 to 4.0 W/(m K), compared to both glass-epoxy printed circuit material [0.2 W/(m K)] and glass-alumina low temperature cofired substrates [2.5 W/(m K)]. The TCE (17 ppm/°C) is substantially below that... [Pg.280]

In the case of ferroelectric ceramic powders dispersed in a polymer matrix, the ceramic inclusions are heterogeneous by themselves, exhibit high, nondispersive permittivities, and. usually, not very high conductivities. Such systems can be easily treated by the dielectric mixture formulas sununarized in Ref. 30. The only criterion is that the volume fraction of the inclusions is known and also something about their shape. The size distribution is not important. The dielectric dispersion of the competsite is determined by that of the nutrix, which can be measured separately. The usual effect of the high-permittivity. nondispersive, ceramic filler is to raise the permittivity level of the dispersion bands. Sometimes new MWS transitions are created, which ate not connected to molecular mobilities of the matrix. [Pg.941]

Ceramics can often be bonded with epoxy or acrylic adhesives, but there are limitations in their use at high temperatures. Few organic adhesives can perform >250 °C, and inorganic adhesives have been developed for ceramics that offer a service temperature of >2000 °C. These are based on inorganic binding compounds such as sodium silicates and various metal phosphates, with carbon, alumina, silica, magnesia or zirconia powder fillers. Ceramic adhesives can be... [Pg.125]

The aims of the addition of inert ceramic filler to the electrospun polymer fiber matrix to form polymer/ceramic composite fiber membrane for separator in LIB were on one hand to prevent dimensional changes by thermal deformation at high temperature because of the frame structure of the heat-resistant ceramic powder and on the other hand to increase the ionic conductivity of the membrane due to the intrinsic ionic conductivity of the ceramics. Various ceramic fillers had been incorporated into the electrospun polymer membranes to make composite separators, including aluminum oxide (AI2O3) [61], fumed silica (SiOa) [29,48,62], titanium dioxide (Ti02) [50, 63-65], lithium lanthanum titanate oxide (LLTO) [51], and lithium aluminum titanium phosphate (LATP) [52],... [Pg.104]


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See also in sourсe #XX -- [ Pg.57 ]




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