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Cadmium property

Lead—tin (1.8—2.5 wt %) is used both as a cable sheathing ahoy (BS 801 ahoy A and DIN 17640) and as a battery connector ahoy ia sealed lead—calcium—tin batteries (15). Tia is generahy added to lead—arsenic cable ahoys ia smah amounts. The arsenic ahoys have excehent creep resistance and mechanical properties, but are unstable and lose arsenic readily by oxidation. The addition of smah amounts of tin (0.10—0.20 wt %) eliminates arsenic loss. Lead ahoys having 0.4 wt % tin and 0.15 % cadmium, which are used for cable sheathing, do not age harden, show excehent corrosion and creep resistance, and are very ductile. [Pg.62]

A third group includes silver—nickel, silver—cadmium oxide, and silver—graphite combinations. These materials are characterized by low contact resistance, some resistance to arc erosion, and excellent non sticking characteristics. They can be considered intermediate in overall properties between silver alloys and silver or copper—refractory compositions. Silver—cadmium oxide compositions, the most popular of this class, have wide appHcation in aircraft relays, motor controllers, and line starters and controls. [Pg.190]

Solders are alloys that have melting temperatures below 300°C, formed from elements such as tin, lead, antimony, bismuth, and cadmium. Tin—lead solders are commonly used for electronic appHcations, showing traces of other elements that can tailor the solder properties for specific appHcations. [Pg.532]

Heterogeneous Photocatalysis. Heterogeneous photocatalysis is a technology based on the irradiation of a semiconductor (SC) photocatalyst, for example, titanium dioxide [13463-67-7] Ti02, zinc oxide [1314-13-2] ZnO, or cadmium sulfide [1306-23-6] CdS. Semiconductor materials have electrical conductivity properties between those of metals and insulators, and have narrow energy gaps (band gap) between the filled valence band and the conduction band (see Electronic materials Semiconductors). [Pg.400]

J. Brice and P. Capper, eds.. Properties oJhAercury Cadmium Te//uride Institution of Electrical Engineers (INSPEC), London, 1987. [Pg.385]

Other complex thiosulfates have been prepared to study crystal properties, eg, cadmium ammonium thiosulfates (90), NaAgS202 H2O [37954-66-8] (91), I C2Mg(S203)2 -6H20 [64153-76-0] (92), and (NH 2[Ag(S203)JCl2 [12040-89-0] (93). [Pg.32]

Antimony is also used as a dopant in n-ty e semiconductors. It is a common additive in dopants for siHcon crystals with impurities, to alter the electrical conductivity. Interesting semiconductor properties have been reported for cadmium antimonide [12050-27-0] CdSb, and zinc antimonide [12039-35-9] ZnSb. The latter has good thermoelectric properties. Antimony with a purity as low as 99.9+% is an important alloying ingredient in the bismuth teUuride [1304-82-17, Bi Te, class of alloys which are used for thermoelectric cooling. [Pg.198]

Additions of cadmium (0.05—1.3%) to copper raise the recrystallization temperature and improve the mechanical properties, especially in cold-worked conditions, with relatively Htde reduction in conductivity. Copper containing 0.07% cadmium is used in automotive cooling fins, heavy-duty radiators, motor commutators, and electric terminals. [Pg.389]

The intermetallic compounds with Group 16 (VIA) elements including CdS, CdSe, and CdTe have interesting semiconductor properties for photoconductors, photovoltaic cells, and ir windows. Cadmium sulfide is widely used as a phosphor in television tubes. [Pg.389]

Table 1. Physical and Chemical Properties of Selected Cadmium Compounds ... Table 1. Physical and Chemical Properties of Selected Cadmium Compounds ...
These are known as chemically pure (CP) cadmiums. With the development of other uses for cadmium and selenium, costs have risen substantially in recent years. Some cost reduction may be obtained by use of the cadmium Hthopones. These have the same relative shades but have been coprecipitated onto about 60% barium sulfate. The resulting extensions give better money value, if the higher pigment loading can be tolerated, with no loss in properties. [Pg.459]

Copper. The physical properties of pure copper are given in Table 11. The mechanical properties of pure copper are essentially the same as those for ClOl and CllO. The coppers represent a series of alloys ranging from the commercially pure copper, ClOl, to the dispersion hardened alloy C157. The difference within this series is the specification of small additions of phosphoms, arsenic, cadmium, tellurium, sulfur, zirconium, as well as oxygen. To be classified as one of the coppers, the alloy must contain at least 99.3% copper. [Pg.229]

Solders. Modem dental solders are made from mostly corrosion-resistant, nontoxic metals. Minimal quantities of tin and other elements are often added, some of which could produce toxic effects in the unalloyed state. Each solder is used for specific appHcations (180—188) typical compositions and properties of solders used in dentistry are presented in Table 11. Most of the ingredients of solders are resistant to corrosion, and alloying them with other ingredients renders the alloy safe for use in appHances placed in the oral environment. Silver solders corrode, but are used only for temporary appHances. Available products do not contain cadmium, although cadmium was an ingredient of some silver solders up to ca 1980. [Pg.487]

Zinc—Nickel. Steel has the best salt spray resistance when the nickel is 12—13% of the alloy. At increasing nickel contents, the deposit becomes more difficult to chromate and more noble, eventually becoming cathodic to steel. At those levels and above, corrosion resistance usually decreases and is dependent on a complete lack of porosity for protection of the steel. In efforts to replace cadmium and nickel—ca dmium diffused coatings in the aircraft industry, 2inc—nickel has insufficient wear properties for some appHcation, but is under study as an undercoat to various electroless nickel top coats (153). [Pg.165]

Effective metal ion adsorbent has been prepai ed by the immobilization of propylthioethyleamine ligand onto the surface of silica gel (SN-SiO,).The effectiveness of this material to bind metal ions has been attributed to the complexation chemistry between the ligand and the metal. We are investigating properties of propylthioethyleamine grafted on the surface of silica and possibility of application of the obtained surface for preconcentration of heavy metals such as zinc, lead, cadmium, copper, etc. from water solutions. [Pg.274]

Substances which possess carcinogenic properties Mercury and its compounds Cadmium and its compounds... [Pg.516]


See other pages where Cadmium property is mentioned: [Pg.314]    [Pg.2907]    [Pg.13]    [Pg.13]    [Pg.65]    [Pg.114]    [Pg.146]    [Pg.59]    [Pg.382]    [Pg.383]    [Pg.6]    [Pg.554]    [Pg.220]    [Pg.334]    [Pg.337]    [Pg.86]    [Pg.65]    [Pg.412]    [Pg.556]    [Pg.2]    [Pg.384]    [Pg.391]    [Pg.395]    [Pg.395]    [Pg.396]    [Pg.396]    [Pg.457]    [Pg.283]    [Pg.148]    [Pg.164]    [Pg.165]    [Pg.34]    [Pg.68]   
See also in sourсe #XX -- [ Pg.374 , Pg.375 ]

See also in sourсe #XX -- [ Pg.600 ]

See also in sourсe #XX -- [ Pg.503 , Pg.506 ]




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Cadmium atomic properties

Cadmium compounds properties

Cadmium compounds thermal properties

Cadmium electronic properties

Cadmium isotopes and their properties

Cadmium optical properties

Cadmium oxide properties

Cadmium oxide thermal properties

Cadmium physical properties

Cadmium selenide properties

Cadmium sulfide thermal properties

Cadmium sulfide, properties

Cadmium telluride properties

Cadmium thermal properties

Cadmium thermodynamic propertie

Cadmium thermodynamic properties

Cadmium transport properties

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