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Borides aluminum

Aluminum Block Expansion Test is similar to the Lead Block Expansion Test,but superior to it when testing brisant expls, especially those contg Al. A brief description of this test is given under Trauzl Tests Aluminum Boride. See under Borides Aluminum Borohydride. See under Borohy-drides... [Pg.145]

More than one boride phase can be formed with most metals, and in many cases a continuous series of solid solutions may be formed. Several methods have been used for the relatively large-scale preparation of metal borides. One that is commonly used is carbon reduction of boric oxide and the appropriate metal oxide at temperatures up to 2000 °C. Fused salt electrolysis of borax or boric oxide and a metal oxide at 700 1000 °C have also been used. Small-scale methods available include direct reaction of the elements at temperatures above 1000 °C and the reaction of elemental boron with metal oxides at temperatures approaching 2000 °C. One commercial use of borides is in titanium boride-aluminum nitride crucibles or boats for evaporation of aluminum by resistance heating in the aluminizing process, and for rare earth hexaborides as electronic cathodes. Borides have also been used in sliding electrical contacts and as cathodes in HaU cells for aluminum processing. [Pg.420]

Finally, three elements of the periodic system occupy an intermediate position with regard to the ability to form refractory metal-like and non-metallic compounds. These elements, beryllium, magnesium, and aluminum, are capable of forming fairly refractory semiconductor compounds with nonmetals (beryllium, magnesium, aluminum borides, aluminum nitride, magnesium silicides), and they may also enter into the composition of intermetallic compounds of the beryllide, aluminide, etc., type. [Pg.6]

Reactions of HCl and nitrides, borides, silicides, germanides, carbides, and sulfides take place at significant rates only at elevated (>650° C) temperatures. The products are the metal chlorides and the corresponding hydrides. The reactions most studied are those involving nitrides of aluminum, magnesium, calcium, and titanium, where ammonia (qv) is formed along with the corresponding metal chloride. [Pg.443]

Borides have metallic characteristics such as high electrical conductivity and positive coefficients of electrical resistivity. Many of them, particularly the borides of metals of Groups 4 (IVB), 5 (VB), and 6 (VIB), the MB compounds of Groups 2(11) and 13(111), and the borides of aluminum and siUcon, have high melting points, great hardness, low coefficients of thermal expansion, and good chemical stabiUty. [Pg.218]

Preparation. The simplest method of preparation is a combination of the elements at a suitable temperature, usually ia the range of 1100—2000°C. On a commercial scale, borides are prepared by the reduction of mixtures of metallic and boron oxides usiag aluminum, magnesium, carbon, boron, or boron carbide, followed by purification. Borides can also be synthesized by vapor-phase reaction or electrolysis. [Pg.219]

Uses. In spite of unique properties, there are few commercial appUcations for monolithic shapes of borides. They are used for resistance-heated boats (with boron nitride), for aluminum evaporation, and for sliding electrical contacts. There are a number of potential uses ia the control and handling of molten metals and slags where corrosion and erosion resistance are important. Titanium diboride and zirconium diboride are potential cathodes for the aluminum Hall cells (see Aluminum and aluminum alloys). Lanthanum hexaboride and cerium hexaboride are particularly useful as cathodes ia electronic devices because of their high thermal emissivities, low work functions, and resistance to poisoning. [Pg.219]

Table 3 summarizes the properties of the so-called nonmetallic hard materials, including diamond and the diamondlike carbides B C, SiC, and Be2C. Also iacluded ia this category are comadum, AI2O2, cubic boroa nitride, BN, aluminum nitride, AIN, siUcon nitride, Si N, and siUcon boride, SiB (12). [Pg.440]

Next to Cr C2, TiC is the principal component for heat and oxidation-resistant cemented carbides. TiC-based boats, containing aluminum nitride, AIN, boron nitride, BN, and titanium boride, TiB2, have been found satisfactory for the evaporation of metals (see Boron compounds, refractory boron compounds Nitrides). [Pg.450]

Aluminium, n. aluminum, aluminium, -blech, n. sheet aluminum, -bor, n. aluminum boride, -draht, m. aluminum wire, -eisen, n. ferro-aluminum. -erz, n. aluminum ore. -feilspane, m.pl. aluminum filings, -fluorwasserstoff-saure, /. fluoaluminic acid, -folie, /. aluminum foil, -formiat, n. aluminum formate, -giesserei, /. aluminum foundry or founding. -griess, m. (coarse) aluminum powder aluminum shot. guss, m. aluminum cast-ing(s), cast aluminum. [Pg.20]

Borides are generally resistant to molten metals, at least to those that do not readily form borides, such as copper, zinc, magnesium, aluminum, tin, lead, and bismuth. TiB2 is especially resistant to molten aluminum and, as such, is used in crucibles for evaporation of the metal. [Pg.440]

Aliphatic and aromatic sulfides undergo desulfurization with Raney nickel [673], with nickel boride [673], with lithium aluminum hydride in the presence of cupric chloride [675], with titanium dichloride [676], and with triethyl phosphite [677]. In saccharides benzylthioethers were not desulfurized but reduced to toluene and mercaptodeoxysugars using sodium in liquid ammonia [678]. This reduction has general application and replaces catalytic hydrogenolysis, which cannot be used [637]. [Pg.86]

The process of forming boron-boron bonds is carried on further in aluminum boride, AIB, which has a very simple hexagonal structure, consisting of hexagonal layers of boron a,toms, like the layers of carbon atoms in graphite, with aluminum atoms in the spaces between the layers (Pig. 11-15). The B—B bond length is 1.73 A, corresponding to n = 0.66 that is, two valence electrons per boron atom are used in the B—B bonds, which are two-thirds bonds. [Pg.436]

Diphenylphosphine)lithium, 126 Nickel boride, 197 Samarium(II) iodide, 270 to 1,2-disubstituted compounds B-3-Pinanyl-9-borabicyclo-[3.3.1]nonane, 249 Titanium(III) chloride, 302 of phosphorus compounds Lithium aluminum hydride-Cerium(III) chloride, 159 of sulfoxides and sulfones Sodium iodide-Boron trifluoride ether-ate, 282... [Pg.372]

REDUCTION, REAGENTS Aluminum amalgam. Borane-Dimethyl sulfide. Borane-Tetrahydrofurane. t-Butylaminoborane. /-Butyl-9-borabicyclo[3.3.1]nonane. Cobalt boride— f-Butylamineborane. Diisobutylaluminum hydride. Diisopropylamine-Borane. Diphenylamine-Borane. Diphenyltin dihydride. NB-Enantrane. NB-Enantride. Erbium chloride. Hydrazine, lodotrimethylsilane. Lithium-Ammonia. Lithium aluminum hydride. Lithium borohydride. Lithium bronze. Lithium n-butylborohydride. Lithium 9,9-di-n-butyl-9-borabicyclo[3.3.11nonate. Lithium diisobutyl-f-butylaluminum hydride. Lithium tris[(3-ethyl-3pentylK>xy)aluminum hydride. Nickel-Graphite. Potassium tri-sec-butylborohydride. Samarium(II) iodide. Sodium-Ammonia. Sodium bis(2-mcthoxyethoxy)aluminum hydride. [Pg.311]

Although few applications have so far been found for ceramic matrix composites, they have shown considerable promise for certain military applications, especially in the manufacture of armor for personnel protection and military vehicles. Historically, monolithic ("pure") ceramics such as aluminum oxide (Al203), boron carbide (B4C), silicon carbide (SiC), tungsten carbide (WC), and titanium diboride (TiB2) have been used as basic components of armor systems. Research has now shown that embedding some type of reinforcement, such as silicon boride (SiBg) or silicon carbide (SiC), can improve the mechanical properties of any of these ceramics. [Pg.35]

Thermal Evaporation The easiest way of evaporating metal is by means of resistance evaporators known commonly as boats . Boats, made of sintered ceramics, are positioned side by side at a distance of approximately 10 cm across the web width (Fig. 8.1). Titanium boride TiB2 is used as an electrically conductive material with boron nitride BN (two-component evaporator) or BN and aluminum nitride AIN (three-component evaporator) as an insulating material [2]. By combination of conductive and insulating materials, the electrical properties of evaporators are adjusted. [Pg.184]


See other pages where Borides aluminum is mentioned: [Pg.160]    [Pg.47]    [Pg.528]    [Pg.218]    [Pg.301]    [Pg.241]    [Pg.195]    [Pg.455]    [Pg.99]    [Pg.138]    [Pg.15]    [Pg.47]    [Pg.108]    [Pg.528]    [Pg.218]    [Pg.317]    [Pg.37]    [Pg.176]    [Pg.136]    [Pg.438]    [Pg.663]   
See also in sourсe #XX -- [ Pg.772 ]




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