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Bismuth-antimony alloys

The Ettingshausen effect, which has historically been assumed to be very small, is in fact quite large in the bismuth-antimony alloy system at temperatures below 200°K. By utilizing this effect in a cooling device, practical solid-state cooling is now feasible in the... [Pg.378]

Kirk-Othmer Encyclopedia of Chemical Technology, 4th edn., Vol. 3, Wiley, New York, 1992 Arsenic and arsenic alloys (pp. 624-33) Arsenic compounds (633-59) Antimony and antimony alloys (367 - 81) Antimony compounds (382-412) Bismuth and bismuth alloys (Vol. 4, 1992 (pp. 237-45) Bismuth compounds (246-70). [Pg.549]

Time-weighted average (TWA), 74 215 concentration, 25 372 exposure limit, for tantalum, 24 334 Time-Zero SX-70 film, 79 303, 305-307 Tin (Sn). See Lead-antimony-tin alloys Lead- calcium-tin alloys Lead-lithium-tin alloys Lead-tin alloys, 24 782-800. See also Tin alloys Tin compounds allotropes of, 24 786 analytical methods for, 24 790-792 in antimony alloys, 3 52t atomic structure of, 22 232 in barium alloys, 3 344, 4 12t bismuth recovery from concentrates, 4 5-6... [Pg.950]

Antimony alloys have many commercial applications. The metal makes its alloys hard and stiff and imparts resistance to corrosion. Such alloys are used in battery grids and parts, tank linings, pipes and pumps. The lead plates in the lead storage batteries constitute 94% lead and 6% antimony. Babbit metal, an alloy of antimony, tin, and copper is used to make antifriction machine bearings. Alloys made from very high purity grade antimony with indium, gallium and bismuth are used as infrared detectors, diodes, hall effect devices and thermoelectric coolers. [Pg.49]

L. Pauling and P. Pauling, On the valence and atomic size of silicon, germanium, arsenic, antimony, and bismuth in alloys. Acta Cryst. 9, 127-130 (1956). [Pg.743]

Seebeck experimented with a number of metals including antimony, iron, zinc, silver, gold, lead, mercury, copper, platinum, and bismuth. Later, the observation was made that the electromotive force (EMF) generated is proportional to the temperature difference between the junctions. Today, TE couples are often made from semiconductor alloys of bismuth antimony telluride, Bi Sb2- cTe3 (x 0.5), that have been suitably doped to possess distinct n- or p-type characteristics. A practical TE cooler consists of one or more couples that are connected electrically in series and thermally in parallel. [Pg.263]

Q Britannia metal is harder than pewter. This tin-antimony alloy s properties can be varied by the addition of zinc, copper, lead, or bismuth. o When heat from a fire melts the Wood s metal plug in a sprinkler head, water that was held back by the plug is freed. [Pg.191]

We report on the powder metallurgical fabrication of bismuth-antimony solid solution and the thermoelectric properties of the fabricated composites. The solid solution powders were prepared by mechanical alloying (MA) aiming at large reduction of the thermal conductivity with the very fine microstructures obtained through MA process. The prepared bismuth-antimony powders (Bi-7.5at%Sb) have been sintered by hot pressing. [Pg.527]

The last stage of the process is the final caustic clean, which removes any trace impurity of elements such as antimony, calcium, magnesium, and zinc that may have passed through from the previous processes. The metal is pumped from the de-bismuthizing area to the final kettles where it is held at about 500°C. Caustic soda is added and stirred into the lead for about one hour. Samples are taken at regular intervals to ensure that the product meets the required lead specifications. Once the lead is in specification, it is cast in the required shape and either sold to the market or used internally for production of calcium and antimonial alloys. [Pg.506]

B Poudel et al. . HigBeh-Thermoelectric Performance of Nanostructured Bismuth Antimony Telluride Bulk Alloys, Science express, published on line 20 March 2008 10.1126/science 1156446. ... [Pg.122]

The phases in the tin-antimony and tin-bismuth alloys have been investigated. Compounds of stoichiometry SnSb, Sn4Sb2, Sn3Sb2, SnSba and Sn3Bi have been claimed. The tin-antimony alloys form the basis of the so-called brittania metal and algiers metal. [Pg.62]

The separation and determination of bismuth in mixtures of copper, lead, tin and of cadmium, antimony, silver and copper by ingenious choice of electrolytes and potentials is described by Lingane and Jones (25) and Tanaka (27-29), respectively. Alfonsi (30, 34) has adequately discussed the application of such techniques to the determination of bismuth in lead-tin-base and bismuth-base alloys. [Pg.44]

Crude lead contains traces of a number of metals. The desilvering of lead is considered later under silver (Chapter 14). Other metallic impurities are removed by remelting under controlled conditions when arsenic and antimony form a scum of lead(II) arsenate and antimonate on the surface while copper forms an infusible alloy which also takes up any sulphur, and also appears on the surface. The removal of bismuth, a valuable by-product, from lead is accomplished by making the crude lead the anode in an electrolytic bath consisting of a solution of lead in fluorosilicic acid. Gelatin is added so that a smooth coherent deposit of lead is obtained on the pure lead cathode when the current is passed. The impurities here (i.e. all other metals) form a sludge in the electrolytic bath and are not deposited on the cathode. [Pg.168]

Perchloric acid Acetic acid, acetic anhydride, alcohols, antimony compounds, azo pigments, bismuth and its alloys, methanol, carbonaceous materials, carbon tetrachloride, cellulose, dehydrating agents, diethyl ether, glycols and glycolethers, HCl, HI, hypophosphites, ketones, nitric acid, pyridine, steel, sulfoxides, sulfuric acid... [Pg.1211]

Solders are alloys that have melting temperatures below 300°C, formed from elements such as tin, lead, antimony, bismuth, and cadmium. Tin—lead solders are commonly used for electronic appHcations, showing traces of other elements that can tailor the solder properties for specific appHcations. [Pg.532]

Rubidium metal alloys with the other alkaU metals, the alkaline-earth metals, antimony, bismuth, gold, and mercury. Rubidium forms double haUde salts with antimony, bismuth, cadmium, cobalt, copper, iron, lead, manganese, mercury, nickel, thorium, and 2iac. These complexes are generally water iasoluble and not hygroscopic. The soluble mbidium compounds are acetate, bromide, carbonate, chloride, chromate, fluoride, formate, hydroxide, iodide. [Pg.278]

Solders. In spite of the wide use and development of solders for millennia, as of the mid-1990s most principal solders are lead- or tin-based alloys to which a small amount of silver, zinc, antimony, bismuth, and indium or a combination thereof are added. The principal criterion for choosing a certain solder is its melting characteristics, ie, soHdus and Hquidus temperatures and the temperature spread or pasty range between them. Other criteria are mechanical properties such as strength and creep resistance, physical properties such as electrical and thermal conductivity, and corrosion resistance. [Pg.241]

Antimony is also used as a dopant in n-ty e semiconductors. It is a common additive in dopants for siHcon crystals with impurities, to alter the electrical conductivity. Interesting semiconductor properties have been reported for cadmium antimonide [12050-27-0] CdSb, and zinc antimonide [12039-35-9] ZnSb. The latter has good thermoelectric properties. Antimony with a purity as low as 99.9+% is an important alloying ingredient in the bismuth teUuride [1304-82-17, Bi Te, class of alloys which are used for thermoelectric cooling. [Pg.198]

Betts Electrolytic Process. The Betts process starts with lead bullion, which may carry tin, silver, gold, bismuth, copper, antimony, arsenic, selenium, teUurium, and other impurities, but should contain at least 90% lead (6,7). If more than 0.01% tin is present, it is usually removed from the bullion first by means of a tin-drossing operation (see Tin AND TIN ALLOYS, detinning). The lead bullion is cast as plates or anodes, and numerous anodes are set in parallel in each electrolytic ceU. Between the anodes, thin sheets of pure lead are hung from conductor bars to form the cathodes. Several ceUs are connected in series. [Pg.123]

The washed slime is dried and melted to produce slag and metal. The slag is usually purified by selective reduction and smelted to produce antimonial lead. The metal is treated ia the molten state by selective oxidation for the removal of arsenic, antimony, and some of the lead. It is then transferred to a cupel furnace, where the oxidation is continued until only the silver—gold alloy (dorn) remains. The bismuth-rich cupel slags are cmshed, mixed with a small amount of sulfur, and reduced with carbon to a copper matte and impure bismuth metal the latter is transferred to the bismuth refining plant. [Pg.124]

Because bismuth expands on solidification and because it alloys with certain other metals to give low melting point alloys, bismuth is particularly weU suited for a number of uses. Alloys of bismuth can be made that expand, shrink, or remain dimensionally stable on solidification. AH other metals except gallium and antimony contract on solidification. Bismuth aHoys and uses are summarized in Table 5. [Pg.124]


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See also in sourсe #XX -- [ Pg.153 ]




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