ASICs integrated circuits

Many of these steps include CVD, and CVD is now a major process in the fabrication of monolithic integrated circuits (IC), custom and semi-custom ASIC s, active discrete devices, transistors, diodes, passive devices and networks, hybrid IC s, opto-elec-tronic devices, energy-conversion devices, and microwave devices. 

Most microhotplate-based chemical sensors have been realized as multi-chip solutions with separate transducer and electronics chips. One example includes a gas sensor based on a thin metal film [16]. Another example is a hybrid sensor system comprising a tin-oxide-coated microhotplate, an alcohol sensor, a humidity sensor and a corresponding ASIC chip (Application Specific Integrated Circuit) [17]. More recent developments include an interface-circuit chip for metal oxide gas sensors and the conccept for an on-chip driving circuitry architecture of a gas sensor array [18,19]. 

Reactor 8 [R 8] Electrical Integrated Circuit Interconnect (ASIC) - Chip-to-world... 

Because the 02 signal is derived from the interaction of pumping and Nernst cells, this sensor requires a special electronic controller circuit. This ASIC (application-specific integrated circuit) includes the basic pumping current control, internal resistance measurement, and extended hardware diagnostics for the sensor. 

Availability of multi-amplifier Application Specific Integrated Circuits (ASICs) with low powers of -1 mW per channel. 

Electronic circuits must be protected from the harsh environment of the human body. The packaging of implantable electronics uses various materials, including polymers, metals, and ceramics. The encapsulation method depends somewhat on the electronic circuit technology. Older devices may still use discrete components in a classical form, such as leaded transistors and resistors. The newer designs, depending on the sophistication of the implanted device, may employ application-specific integrated circuits (ASICs) and thick film hybrid circuitry for their implementation. Such circuits place considerable requirements for hermeticity and protection on the implanted circuit packaging. 

Abbreviations OE, optoelectronic DRAM, dynamic random access memory I/O, input/output ATM, asynchronous transfer mode VLSI, v y large scale integration ASIC, application-specific integrated circuit. [From Pinkston, T. M., and Kuznia, C. (1997). Smart-Pixel-Based Netwa-k Interface Chip, App/. Optics 36(20), 4871-4880.]... 

Level 5 (genius) pixels (thousands of transistors) have complexities, in general, above a thousand active devices, a level of complexity sufficient for implementing application-specific integrated circuits (ASICs) and microprocessors. But this functionality level has problems not faced by the lower levels. First, for free-space optical interconnection, optical I/Os should be arranged in a structured two-dimensional pattern in order to effectively use the two-dimensional nature of imaging optics. On the other hand, computer-aided design (CAD) tools for elec-... 

Chip stacks. A recent approach to increasing component densities is to connect the die or chip devices vertically as a chip stack instead of assembling them horizontally on a substrate. The silicon chips are first thinned to several mils (2-4 mils), then bonded together. Where the chips are of different sizes, such as an application-specific integrated-circuit (ASIC)... 

CEHW [such as Field-Programmable Gate Arrays (FPGAs), Application Specific Integrated Circuits (ASICs), and other custom micro-coded devices] are often just as complex as S/W-controlled microprocessor-based systems (CAST-27 paragraph 2a). 

Complex Electronic Hardware All devices that are not simple are considered to be complex. See the definition of Simple Hardware [EASA CM-SWCEH-OOl]. Complex Electronic Hardware Includes custom micro-coded components (such as ASICs, PLDs and associated macro functions) and integrated technology components (such as hybrids and multichip modules). RTCA-DO-254 (para 1.6) advises that hardware should be examined hierarchically at the levels of integrated circuit, board and LRU for complexity, including addressing functions that may not be testable, such as unused modes in multiple usage devices and potentially hidden states in sequential machines . An item constructed entirely from simple items may itself be complex. Complexity is an attribute of systems or items which makes their operation difficult to comprehend. Increased system complexity is often caused by such items as sophisticated components and multiple interrelationships. 

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