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Ultrapure materials

Ultraperm Z Ultrapho sphates Ultraphosphoric acid Ultraprene Ultra Pure Ultrapure materials Ultrapure water Ultrason... [Pg.1036]

Ultrahigh Purity Gallium. Many appHcations, particularly those in the electronics industry (see Electronic materials), require high (>99.99999% = 7.N ) purity metallic galHum. This is achieved by a combination of several operations such as filtration, electrochemical refining, heating under vacuum, and/or fractional crystalli2ation (see Ultrapure materials) (14). [Pg.160]

C, is the concentration of impurity or minor component in the solid phase, and Cf is the impurity concentration in the hquid phase. The distribution coefficient generally varies with composition. The value of k is greater than I when the solute raises the melting point and less than I when the melting point is depressed. In the regions near pure A or B the hquidus and solidus hues become linear i.e., the distribution coefficient becomes constant. This is the basis for the common assumption of constant k in many mathematical treatments of fractional solidification in which ultrapure materials are obtained. [Pg.1989]

The semiconductor industry would have been impossible had not the process of zone refining been invented first. It is the standard way of producing ultrapure materials, both for research and for making silicon and germanium-based devices. [Pg.39]

ICP-MS has been used for the analysis of many materials, including alloys, steels, nuclear materials, ceramics, superconductors, plastics, polymers, and catalysts. Semiquantitative analysis by ICP-MS is often a convenient method to screen samples for trace elements and impurities. Measurement of impurities can be complicated by sample matrix-dependent degradation of sensitivity, particularly if the samples contain high concentrations of heavy elements that create extensive space-charge-induced ion transmission losses. Matrix matching is complicated by the need for ultrapure materials. [Pg.136]

The polyamic acid synthesized by the technique described was extremely consistent from batch to batch. Table II describes the typical analytical data from a typical sample of the ultrapure material. [Pg.246]

Specifically for the passivation of temperature sensitive bubble memory devices,these ultrapure materials proved to be of great value. A cure process was optimized to obtain a reliable low temperature cure without affecting the magnetic coercivities of the bubble memory devices. A positive resist process, using a simple development step to pattern via holes in devices has been optimized and successfully used to fabricate devices. The devices fabricated using the the polyimide process have been compared with conventional SiC offers reliable passivations with thinner stress free films for passivations. The fabrications involve simple inexpensive process steps and are compatible with conventional resist processes. The reliability of the imide passivated devices can be considerably enhanced by the use of ultrapure starting materials to preclude harmful ionic mobilities through passivated layers. [Pg.257]

Yellowish powder with a greenish tinge carbonizes above 300" without melting. Ultrapure material which is white or colorless, has been prepared. Almost insol in water slightly sol in hot HO sol in alkali hydroxide or carbonate sol ns. Alkaline soins turn blue on standing. [Pg.363]

Balaram, V. (2005) Recent developments in analytical techniques for characterisation of ultrapure materials - an overview. Bull Mater Sci, 28 (4), 345-348. [Pg.64]

The effects of impurities are more difficult to quantify. Recent work has paid attention to the preparation and characterization of ultrapure materials and the possibility of introducing ionic impurities and new energy levels into the band gap of the parent azide. This approach will undoubtedly lead to a better understanding of reaction mechanisms. [Pg.281]

Vitreous silica optical fibers for modern telecommunication systems must be made from ultrapure materials. Glasses produced from melts are incapable of reaching the quality levels required by these fibers. The glasses used in current fibers are produced in situ as the preform is formed by vapor deposition processes. Since the raw materials are liquids, purification by distillation can radically reduce impurity contents. Furthermore, since the glass never contacts crucible or refractory materials, the purity of the glass is maintained throughout the process. [Pg.255]

In addition to the above functions, the encapsulant must be an ultrapure material, with superior electrical and physical properties, and ease of application and repair in production and service. With the proper choice of encapsulant, the encapsulation could enhance the fragile IC device, improve its mechanical and physical properties, and its manufacturing yields, and prolong the reliability of the IC device which is the ultimate goal of the encapsulation... [Pg.67]

The solution to the diffusion equation (2.30) implies that the temperature decreases monotonically with z at all times. It is interesting that this uniform behavior is not a property of ultrapure materials. Instead, heat is propagated as a wave, in a fashion similar to the propagation of sound. This phenomenon, known as second sound, was first discovered in liquid helium at very low temperatures. It has since been observed in solid helium and has been reported to occur as well in the isotopically and chemically pure materials NaF and Bi at very low temperatures. For a discussion of the effect see B. Bertram and D. J. Sandiford, Scientific American 222(5), 92 (1970). [Pg.30]

A transfer line used to move various grades of a fluid is 0.05 m in diameter and 10 m long. The line is first used for the commercial grade and then for ultrapure material. How much of the latter must be pumped before... [Pg.53]


See other pages where Ultrapure materials is mentioned: [Pg.258]    [Pg.483]    [Pg.1834]    [Pg.37]    [Pg.308]    [Pg.1593]    [Pg.248]    [Pg.483]    [Pg.1150]    [Pg.60]    [Pg.90]    [Pg.1838]    [Pg.244]    [Pg.199]    [Pg.300]    [Pg.356]    [Pg.362]   


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