Three-dimensional printing materials

J.F. Bredt, T.C. Anderson, and D.B. Russell, Three dimensional printing materials system, US Patent 6416850, assigned to Z Corporation (Burlington, MA), July 9, 2002. 

E. Giller and D.X. Williams, Three dimensional printing material system and method using plasticizer-assisted sintering, US Patent 8506862, assigned to 3D Systems, Inc. (Rock Hill, SC), August 13, 2013. 

A novel method for producing ER formulations is a technology called three-dimensional printing (TheriForm technology) [147], which is similar to the one used in ordinary printers. The ink is here replaced with an active substance and carrier material. The layer-by-layer printing provides controlled placement of the active drug and thus of the release from the device [148],... 

Figure 1 3DP the principles. A schematic illustration of (A) the involvement of the CAD system and the printing process (B) the principle of the 3DP process in which a three-dimensional structure is huilt up from polymer/ceramic materials from a bubble jet nozzle. Abbreviation. 3DP, three-dimensional printing. Source. From Ref. 33. 

Embossing is most frequently used as a method of decorating nonslip packaging materials, vinyl wall coverings, furniture laminates, building-panel laminates, textured foil for hot stamping, and other applications where the innate quality of three-dimensional printing is of value. 

D-P (three- dimensional printing) 1 (medium) Greater material choice. Little thermally-induced degradation. Requires used of toxic organic solvents that are difficult to extract. Inner features are difficult to remove. Lacks mechanical strength. 

This type of coil was prepared from copper cladded printed circuit board material by applying photolithographic techniques. The p.c. board material is available with difierent copper thicknesses and with either a stiff or a flexible carrier. The flexible material offers the opportunity to adapt the planar coil to a curved three dimensional test object. In our turbine blade application this is a major advantage. The thickness of the copper layer was chosen to be 17 pm The period of the coil was 100 pm The coils were patterned by wet etching, A major advantage of this approach is the parallel processing with narrow tolerances, resulting in many identical Eddy current probes. An example of such a probe is shown in fig. 10. 

Newer resins include polysulfone, polyethersulfone, polyetherimide, and polyetherketone. Some of these newer materials are high temperature thermoplastic, not thermoset, resins. They are being promoted for the design of injection-molded printed circuit boards in three-dimensional shapes for functional appHcations as an alternative to standard flat printed circuit boards. Only semiadditive or fully additive processing can be used with these devices. 

Nanotransfer printing (nTP) is a more recent high resolution printing technique. It uses surface chemistries as interfacial glues and release layers (rather than inks ) to control the transfer of solid material layers from relief features on a stamp to a substrate [10-12, 44], This approach is purely additive (i.e. material is only deposited in locations where it is needed) and it can generate complex two or three-dimensional structures in single or multiple layers with nanometer resolu-... 

Extractables were further identified by a Hewlett-Packard Model No.5993 GC/MS spectrometry. Solvent extractables were further diluted with Freon TA before GC/MS analysis. Six foot long, 0.3% SP2250 OV17 type material was used as the GC column, with 20-30 cc/min flow rate of helium as the carrier gas. Mass/charge (m/e) units were scanned from 30-800 atomic mass units (amu). Three-dimensional spectra GC/MS were printed out at the end of each run. Results of the GC/MS are shown in Figure 7. 

SP2250 0V17 type material was used as the GC column, with 20-30 cc/min helium flow rate as carrier gas. Mass/charge units were scanned from 30-800 atomic mass unit (amu). Three dimensional GC/MS spectrum were printed out at the end of each run. 

In the flat as sheets or reels, e.g. paper, board, tinplate, films, foils and laminates. Materials in both sheet and reel forms may be further processed to give packs which may remain in the flat (e.g. collapsible cartons) until erected or are directly fabricated into a three-dimensional container (tinplate containers, composite drums, rigid boxes, etc.). Distortion printing also falls into this category. 

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