Thin-film multilayer metal deposition processes

The incorporation of metals in multilayer thin films significantly extends the scope of useful characteristics associated with these films. By employing, for instance, polymeric Ru(II) complexes as polycationic species and poly(sodium acrylate) as polyanions in the layer-by-layer deposition process, efficient fight-emitting solid-state devices could be fabricated [91]. In another example, a ferrocene-containing redox-active polycation was combined with an enzyme to produce electrocatalyticaUy active enzyme/mediator multilayer structures [92]. Multilayers composed of poly(4-vinylpyridine) complexed with [Os(bpy)2Cl] / and poly(sodium 4-styrenesulfonate), for example, were used to accomplish the electrocatalytic reduction of nitrite [93]. 

Arc vapor deposition processes are used for vaporizing all forms of conductive materials with low radiant thermal energy from cathodic arc deposition. Non-conductive materials cannot be processed. However, the process is effective in depositing high-wear, corrosion and erosion-resistant thin-film coatings on precision parts. Pure metals, metal nitrides, carbides and carbo-nitrides, for example, can be deposited as a monolayer, multilayer, graded, or alloy film. 

Ceramic capacitors are fabricated in four general processes thin-fihn, thick-film, single layer, and multilayer. Thin-fihn capacitors were developed out of a need to embed passive components into electronic packaging in hybrid circuits. Dielectrics such as SiO, SiOj, Ta20j, Ti02, titanates, and aluminosihcates can be vacuum deposited with a variety of electrode metallizations. 

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