Thermoplastic adhesives preforms

Solid epoxy adhesives may also be fused or compacted into various shapes or preforms (see Fig. 13.2) such as sticks, rings, and beads.5 They can then be easily applied to a specifically shaped part. Similar to thermoplastic hot-melt adhesives, these thermosetting epoxy adhesives flow on the substrate by heating. However, the product will cure to an infusible thermoset stage with continued heating. Once cured, the product demonstrates properties similar to those of other structural epoxy adhesives. These solid epoxy adhesives are sometimes referred to as thermosetting hot melts. 

The bonding materials are generally (1) in the form of thermoplastic preforms that bond or seal as a hot-melt type of adhesive or (2) thermosetting paste which cures to a structural adhesive. 

Polyimide adhesives are commercially available as electrically conductive or insulative pastes used for die attachment. They are also available as thermoplastic preforms for chip-on-lead and lead-on-chip attachments. 

Preforms, tape, or film adhesives, unlike the paste or liquid adhesives, are already in the solid state. They may be thermoplastic or thermosetting but, in both cases, may be purchased as sheets of various thicknesses and cut to size to accommodate specific device or part sizes. In using preforms, the electronics assembler avoids problems associated with the storage, handUng, and dispensing of liquid adhesives. Parts such as leadframes, lids, and substrates may also be purchased with pre-attached preforms, a convenience to the user, who then avoids having to cut and handle individual preforms. Most parts can also be stored for up to one year in ambient conditions without affecting their properties. 

A third approach to underfilling involves applying an insulative thermoplastic preform (film) prior to attaching the device. Under pressure and heat, the preform softens and flows around the solder bumps, then solidifies quickly on cooUng. The devices may then be solder reflowed to make the connections or the preform may be formulated to flow and encapsulate the solder during solder reflow. Table 5.6 lists some commercially available preforms used as underfills. Anisotropic film adhesives have also been used as underfill preforms, in which case z-direction conductive paths are formed beneath the solder bumps at the same time that the rest of the insulating film flows and cures around the bumps. Anisotropic paste adhesives can be similarly used (Figure 5.11). 

In this approach, entire wafers or segments of wafers containing ICs are stacked. Interconnections are formed from vias in the silicon. In vertically stacking memory chips or other IC chips, the chips are first thinned to several mils (4 mils or less), then adhesive bonded, and electrically interconnected directly from chip-to-chip, either from the edges or through vias in the silicon. In these approaches, both electrically conductive and electrically insulative adhesives are used. Thermally conductive preform adhesives or thin thermoplastic films are used to bond and isolate the chips within the stack and to dissipate heat. Several processes are available to vertically stack and interconnect chips of the same size and function such as SRAM, flash, and DRAM memory chips. Other processes have been developed to vertically stack chips of different sizes and functions, or to horizontally interconnect different chips in one layer, then vertically stack the layers. ... 

First, in terms of their physical form, adhesives may be either pastes or preforms (also known as films or tapes). Pastes are semisolid materials, easily dispensed through a needle or applied by screen or stencil printing. Film adhesives are solid sheets of thermoplastic or partially cured (B-staged) thermosetting polymers that can be cut to size and generally used to attach large-area components, substrates, and lids. 

Blister packaging n. The enclosing of articles in thermoformed, transparent bhsters shaped to more or less fit the contours of the articles. The preformed blisters, usually slightly oversized to provide ample room, are made of thermoplastics such as vinyl, polystyrene, or cellulosic plastics. They are placed inverted in fixtures and loaded with the articles, and then cards coated with an adhesive are applied and sealed to the flanges between and around the blisters by means of heat and pressure. 

Polyimides became popular for die-bonding adhesives because they are cleaner (in terms of ionic contaminants) than equivalent epoxy products. The market at present, however, is dominated by high-purity epoxy adhesives. Polyimides are always applied from solvent solution and require higher curing temperatures than epoxies. They are stable to higher temperatures. Solvent-borne thermoplastics pastes (or cast-film preforms) have been used for some lower reliability die-attachment applications. 

Method D appears to be possibly the most important type of isocyanate-based adhesive system. It is similar to Method B in that a preformed, fully reacted, high molecular weight polymer is employed as a vehicle in the adhesive formulation. The strength of the vehicle holds adherend members in exact position after assembly until the full bond has formed. Method D differs from Method B in that its vehicle polymer is a polyurethane. A further difference is that the inherent adhesive character and strength of the polyurethane vehicle frequently enables its use without added di- or poiyisocyanate. This strength may be realized in essentially amorphous compositions such as the thermoplastic polyurethane elastomers or millable gums. Or it may be achieved with crystallizing urethane adhesive polymers. 

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