Epoxy equivalent

Bisphenol F Resin. Bisphenol F [2467-02-9] epoxy resin is of the same general stmcture as the epoxy phenol novolaks. Bisphenol F is 2,2Emethylene bisphenol. Whereas the epoxy phenol novolaks vary from viscous Hquids to soHd materials, the bisphenol F resin has a low viscosity (ca 4 Pa-s (40 P)) and 165 epoxy equivalent weight. Its n value (degree of polymerization) is about 0.15 and crystallization, often a problem with low viscosity conventional bisphenol A resins, is reduced with the bisphenol F resin. 

Tetrakis (4-hydroxyphenyl)ethane is prepared by reaction of glyoxal with phenol in the presence of HCl. The tetraglycidyl ether [27043-37-4] (4), mp ca 80°C, possesses a theoretical epoxide functionaUty of four with an epoxy equivalent weight of 185—208 (4). 

The tria2ine ring-containing product 1,3,5-triglycidyl isocyanurate (6) is synthesized by glycidylation of cyanuric acid with epichlorohydrin. The commercial product is a crystalline powder that exhibits an epoxy equivalent weight of ca 108 and softens in the 85—110°C range (see Cyanuric AND ISOCYANURIC acids). 

The pure diglycidyl ether of bisphenol A [1675-54-3] DGEBA is a crystalline soHd (mp 43°C) with a weight per epoxide (WPE) = 170. The typical commercial unmodified Hquid resins are viscous Hquids with viscosities of 11—16 Pa-s (110—160 P) at 25°C, and an epoxy equivalent weight of ca 188. 

SoHd epoxy resins are sometimes designated as 1-, 4-, 7-, or 9-type resins these approximate the degree of polymerization. Commercial products are designated similarly, eg, Epon 1001, 1004, 1007, and 1009 (SheU Chemical Co.). The relationship between n value, epoxy equivalent weight, and melting point is shown in Table 5. 

It is possible to correlate epoxy equivalent for a given class of resin with infrared absorption data. 

The anhydrides are usually used at ratios of 0.85 1.1 moles anhydride carboxyl group per epoxy equivalent. Lower ratios down to 0.5 1 may, however, be used with some systems. The organic bases are used in amounts of 0.5-3%. These are usually tertiary amines such as a-methylbenzyldimethylamine and n-butylamine. 

Epoxy-DICY systems, 10 454 Epoxy equivalent weight (EEW), 10 399 Epoxy ester alkyd resins, 2 165-166 Epoxy esters, 10 380-384, 443 Epoxy formulations, performance of, 10 428 Epoxy groups, 10 567 hydrolysis of, 10 358 acid-catalyzed cross-linking of, 15 171 Epoxy molding compounds (EMC), 10 373, 430 34, 458... 

Materials. Reagent grade solvents, dimethyl formamide (DMF), dimethyl acetamide (DMAC), dimethyl sulfoxide (DMSO) and methanol were purchased from Baker, stored over molecular sieves once opened, and used without further purification. Aminoethane thiosulfuric acid (AETSA) purchased from Kodak, and Taurine, purchased from Alfa were purified by recrystallization. Each was thrice recrystallized from hot, deionized water. The crystalline precipitate was dried (48 hours at 40 °C) in-vacuo and subsequently stored in a desiccator. Benzophenone (BP) was purchased from Aldrich Chemical Company. QUANTACURE BTC (BTC), (4-benzolybenzyl) trimethylammonium chloride, was used as supplied by Aceto, Inc., Flushing, New York. Phenyl glycidyl ether (PGE) was purchased from MCB, distilled in-vacuo. and stored at -15 °C. Epon 828 was used as supplied bv Shell Chemical Company. The epoxy equivalent weight (EEW) for Epon 828 determined by an appropriate titration, was found to be 187.7. 

Preparation of Ozonized Lignin/Epoxy Resins. Each ozonized lignin (1.0 g) was mixed with DGEBA and heated at 120°C with stirring as described in the previous section. After heating for 30 min, the mixture was cooled to room temperature. The solidified reactants were dissolved in acetone (2 ml) and the curing reagents, diethylenetriamine (DETA) or hexamethylenedi-amine (HMDA), were added at 90% of the stoichiometric amount to epoxy equivalent. 

Swelling experiments showed that a lignin epoxide resin of 0.11 epoxy equivalents per lOOg formed a network polymer when cured with DETA, PA, or ATBN. Phase separation was observed in the rubber-toughened lignin epoxide network. Cured epoxides had lignin derivative contents of up to 95%. 

Epoxy equivalent weight determined using 4. 

The stoichiometric ratio of amine/epoxy equivalents is given by... 

An important term that is used in formulating epoxy adhesive compositions is epoxy equivalent weight (EEW). This is defined as the weight of resin in grams that contains one equivalent of epoxy. As the resin s molecular weight increases, the EEW will also increase. 

Resin designation Average value of n Melting point, °C Epoxide content, mmol/kg Epoxy equivalent weight Hydroxyl content, mmol/kg... 

The stoichiometric quantity of amine to be used to cure an epoxy resin is easily calculated from the molecular weight of the amine, the number of active hydrogens in the amine, and the epoxy equivalent weight of the resin. This calculation is shown in Table 2.3. 

These resins are most often characterized by their epoxy equivalent weight (EEW), molecular weight (number of repeating units ri), and viscosity. Table 4.2 shows the relationship between EEW and viscosity. These DGEBA epoxy resins can be used alone or in blends with other DGEBA resins, other epoxy resins, or even other types of polymeric resins. Very often commercial epoxy resin products are actually blends of resins having a broad molecular weight distribution. 

Number of repeating units n Epoxy equivalent weight Viscosity, poise at 25 °C Melting point, °C Molecular weight Approximate number of groups ... 

The base epoxy resin can be either liquid or solid. As molecular weight increases, the epoxy equivalent weight and the number of hydroxyl groups available for reaction increase. Waterborne epoxy adhesives provide excellent adhesion to metals and other high-energy substrates. Modified waterborne epoxy adhesives can also provide good adhesion to substrates such as vinyl and flexible plastic film. Characteristics of these epoxy dispersions are summarized in Table 4.6. 

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