Substrate manufacturing technologies

Current Status of Electrodes Fabrication Methods of Electrodes 277 Table IOlI Substrate manufacturing technologies [7]. 

Is homogeneous asymmetric hydrogenation a mature manufacturing technology The answer is clearly NOT YET - with, perhaps, the exception of a few privileged substrate types. Our definition of a mature manufacturing technology can be summarized as follows ... 

These data prove that thin layer multi-heterojunction devices are enabled by OVPD with accurate thickness reproducibility and layer performance, which are essential manufacturing requirements in industrial mass production. The OVPD technology also enables controlled material transport and a high material utilization efficiency of 50-70%, based on condensation on to the substrate only. For state-of-the art VTE manufacturing technology material utilization efficiencies are in the range of 1 to 6% [23],... 

As a manufacturing technology, selective metallization of a molded plastic substrate has wide utility in electrical and electronic componentry, connector and receptacle devices, customized IC carriers, electro-mechanical and electro-optical products. "The major benefits which come from a molded circuit board may be grouped under four headings including structural/mechanical, material, cost and design/aesthetics. 

More generally for the manufacturing sector flexible is synonymous of rollable , thus the development of deposition techniques fully compatible with plastic substrates, low temperature processes and solution processable materials, and suitable for flexible substrates for roll-to-roll manufacturing technologies is mandatory. 

Development is an important step of the process, since it is one of the keys for obtaining a well-defined pattern on the substrates. Development transforms the latent image into an image serving as a mask for etching of the substrates. Two technologies are now available wet development, which is widely used in circuit manufacture and dry development, which is still under study. 

While microelectronics can be described as the fabrication of electrical components like transistors, diodes, resistors and capacitors on a semiconductor substrate, mostly silicon, MEMS and MOEMS are using the manufacturing technologies of microelectronics to fabricate mechanical and optical structures as well as sensing or actuating devices. Typical examples are pressure sensors, microphones, acceleration and angular-rate sensors, magnetic compasses, inkjet heads, micro-scanners, micro-fluidic devices, biosensors, etc., to name some. 

Master, R.N., Herron, L.W., and Tummala, R.R., Cofiring process for glass-ceramic/ copper multilayer ceramic substrate, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 14, 780-783, December 1991. 

Jachim,X A., Freeman, G. B.,Turbini, L. X, Use of Surface Insulation Resistance and Contact Angle Measurements to Characterize the Interactions of Three Water Soluble Fluxes with FR Substrates, IEEE Transactions on Components, Packaging, and Manufacturing Technology, PartB,Vo. 20, No. 4,1997, pp. 443-451. 

Furthermore, ultra high-density flexible circuits have been considered recently as the necessary substrate materials for the next generation electronics packaging. Their circuit densities will be under 20 micron pitches with 20 micron diameter via holes. They need completely new manufacturing technologies, such as an additive process instead of traditional subtractive process. Ultra high-density flexible circuits will be considered separately. 

Z. Lai and J. Liu, Anisotropically Conductive Adhesive Rip-Chip Bonding on Rigid and Flexible Printed Circuit Substrates, IEEE Transactions on Components Packaging and Manufacturing Technology, Part B, Vol 19, 1996, p 644-660... 

The manufacturing technology of polarizers that are used in modem LCDs had been established already in 1930. As described above, polarizers were prepared by adsorbing iodine on PVA that was inunersed in an aqueous iodine solution. This is the substrate that becomes the polarizer after stretch orienting the PVA. fti order to give mechanical and physical strength, this stretched film of a water-soluble... 

In terms of cost and manufacturing technologies for scalable devices, because the functional materials of OPVs are likely to dissolve in common organic solvents, they can be easily printed or coated onto the flexible polymer substrates such as polyethylene terephthalate (PET) and polyethylene... 

Yield. There are no single-point array frulures on ungated InSb detector arrays. Arrays can be made as large as avmlable substrates. Effective array sizes are readout limited. This is due to the fact that the readout is subject to single point failures and is constrained by current manufacturing technology. 

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