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Stacks cleaning

The stack cleaning had progressed from the top down to the point where this large buildup near the mouth of the hreech was encountered. The high-pressure water wash was found to he somewhat ineffective and it was replaced with a firewater hose and nozzle. The hose was operated hy a worker on a scaffold that had heen erected at the hreech entry into the stack. Water was directed onto the large mass in an attempt to wash as much off as possible before using picks and shovels. The entire mass of the buildup suddenly fell in one piece, according to two witnesses. A few seconds later, the entire stack collapsed. [Pg.348]

In the practical application of electrodialysis there are two main process operation modes. The first one is referred to as the unidirectional electrodialysis and the second as electrodialysis reversal [22]. In a unidirectional operated electrodialysis system the electric field is permanently applied in one direction and the diluate and concentrate cells are also permanently fixed over the period of operation. Unidirectional operated electrodialysis plants are rather sensitive to membrane fouling and scaling and often require a substantial feed-solution pretreatment and stack-cleaning procedures in the form of periodical rinsing of the stack with acid or detergent solutions. The unidirectional operating concept is mainly used today for applications in the... [Pg.100]

Shallow marine/ coastal (clastic) Sand bars, tidal channels. Generally coarsening upwards. High subsidence rate results in stacked reservoirs. Reservoir distribution dependent on wave and tide action. Prolific producers as a result of clean and continuous sand bodies. Shale layers may cause vertical barriers to fluid flow. [Pg.79]

Figure Bl.21.1 shows a number of other clean umeconstnicted low-Miller-index surfaces. Most surfaces studied in surface science have low Miller indices, like (111), (110) and (100). These planes correspond to relatively close-packed surfaces that are atomically rather smooth. With fee materials, the (111) surface is the densest and smoothest, followed by the (100) surface the (110) surface is somewhat more open , in the sense that an additional atom with the same or smaller diameter can bond directly to an atom in the second substrate layer. For the hexagonal close-packed (licp) materials, the (0001) surface is very similar to the fee (111) surface the difference only occurs deeper into the surface, namely in the fashion of stacking of the hexagonal close-packed monolayers onto each other (ABABAB.. . versus ABCABC.. ., in the convenient layerstacking notation). The hep (1010) surface resembles the fee (110) surface to some extent, in that it also... Figure Bl.21.1 shows a number of other clean umeconstnicted low-Miller-index surfaces. Most surfaces studied in surface science have low Miller indices, like (111), (110) and (100). These planes correspond to relatively close-packed surfaces that are atomically rather smooth. With fee materials, the (111) surface is the densest and smoothest, followed by the (100) surface the (110) surface is somewhat more open , in the sense that an additional atom with the same or smaller diameter can bond directly to an atom in the second substrate layer. For the hexagonal close-packed (licp) materials, the (0001) surface is very similar to the fee (111) surface the difference only occurs deeper into the surface, namely in the fashion of stacking of the hexagonal close-packed monolayers onto each other (ABABAB.. . versus ABCABC.. ., in the convenient layerstacking notation). The hep (1010) surface resembles the fee (110) surface to some extent, in that it also...
Extended defects range from well characterized dislocations to grain boundaries, interfaces, stacking faults, etch pits, D-defects, misfit dislocations (common in epitaxial growth), blisters induced by H or He implantation etc. Microscopic studies of such defects are very difficult, and crystal growers use years of experience and trial-and-error teclmiques to avoid or control them. Some extended defects can change in unpredictable ways upon heat treatments. Others become gettering centres for transition metals, a phenomenon which can be desirable or not, but is always difficult to control. Extended defects are sometimes cleverly used. For example, the smart-cut process relies on the controlled implantation of H followed by heat treatments to create blisters. This allows a thin layer of clean material to be lifted from a bulk wafer [261. [Pg.2885]

An obvious method of increasing the filtration area in the vessel is to stack several plates on top of each other the plates are operated in parallel. One design, known as the plate filter, uses circular plates and a stack that can be removed as one assembly. This allows the stack to be replaced after the filtration period with a clean stack, and the filter can be put back into operation quickly. The filter consists of dimpled plates supporting perforated plates on which filter cloth or paper is placed. The space between the dimpled plates and the cloth is coimected to the filtrate outlet, which is either into the hoUow shaft or into the vessel, the other being used for the feed. When the feed is into the vessel, a scavenger plate may have to be fitted because the vessel will be full of unfiltered slurry at the end of the filtration period. This type of filter is available with filtration areas up to 25 m and cakes up to 50 mm thick. [Pg.402]

Checking Against Optimum Design. This attempts to answer the question whether a balance needs to be as it is. The first thing to compare against is the best current practice. Information is available ia the Hterature (13) for large-volume chemicals such as NH, CH OH, urea, and ethylene. The second step is to look for obvious violations of good practice on iadividual pieces of equipment. Examples of violations are stack temperatures > 150° C process streams > 120° C, cooled by air or water process streams > 65° C, heated by steam t/ urbine 65% reflux ratio > 1.15 times minimum and excess air > 10% on clean fuels. [Pg.94]

The success of EDR ia water demineralization has appareatly resulted from its greater tolerance of particulate and fouling matter compared to reverse osmosis greater forgivingness of process upsets greater tolerance for unskilled operators simplicity ia desiga and constmction of EDR stacks compared to reverse osmosis modules the abiHty to iaspect, clean, or replace one membrane at a time the existence of a comprehensive global sales and... [Pg.175]

Since electrodialysis membranes are subject to fouling, it is sometimes necessaiy to disassemble a stack for cleaning. Ease of reassembly is a feature of ED. [Pg.2031]

Peripheral Components In addition to the stack, a power supply, pumps for diluate and concentrate, instrumentation, tanks for cleaning, and other peripherals are required. Safety devices are mandatoiy given the dangers posed by electricity, hydrogen, and chlorine. [Pg.2032]

Other methods which should be mentioned because they show potential benefits for pollution reduction from utility stacks include (1) coal cleaning... [Pg.494]

The filter elements should remove particles of five microns, must be water-resistant, have a high flow rate capability with low pressure drop, possess high dirt-retention capacity, and be rupture-resistant. The clean pressure drop should not exceed five psig at 100 °F (38 °C). The elements must have a minimum collapse differential pressure of 50 psig. Pleated-paper elements are preferred—provided they meet these requirements. Usually, the pleated-paper element will yield the five psig clean drop when used in a filter that was sized to use depth-type elements. This result is due to the greater surface area of the pleated element, more than twice the area of a conventional stacked disc-type or other depth-type elements. [Pg.551]

Probably there is hide that can be done in the design of a stack to avoid this problem, although raising the elevation could be of value. In such cases, air pollution control can probably be implemented only by process reduction during unfavorable wind conditions or by permanent stack gas cleaning devices. In the lee of a chff there may be eddies of the type shown in Figure 3. [Pg.343]

Such requirements could deal with the selection and performance of gas cleaning equipment, and with the design of the duct systems (including stacks). [Pg.1371]


See other pages where Stacks cleaning is mentioned: [Pg.422]    [Pg.2032]    [Pg.69]    [Pg.422]    [Pg.1790]    [Pg.2224]    [Pg.2208]    [Pg.2036]    [Pg.422]    [Pg.2032]    [Pg.69]    [Pg.422]    [Pg.1790]    [Pg.2224]    [Pg.2208]    [Pg.2036]    [Pg.168]    [Pg.403]    [Pg.229]    [Pg.178]    [Pg.196]    [Pg.220]    [Pg.327]    [Pg.77]    [Pg.89]    [Pg.130]    [Pg.328]    [Pg.254]    [Pg.1574]    [Pg.1605]    [Pg.1720]    [Pg.1731]    [Pg.1827]    [Pg.474]    [Pg.747]    [Pg.292]    [Pg.294]    [Pg.531]    [Pg.4]    [Pg.271]    [Pg.359]    [Pg.346]    [Pg.593]    [Pg.1231]    [Pg.1241]   
See also in sourсe #XX -- [ Pg.78 ]




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