Soldering Atmospheres

Wave solder atmosphere environment (air and nitrogen). Nitrogen-atmosphere testing was eliminated. Minor improvements in solder performance could not make up for the cost difference. This would have been a large and costly DoE experiment. However, by selecting certain runs from the entire DoE run for each evaluation, the process was simplified. 

In addition to the metallurgical aspects discussed above, process parameters can have important effects on reliability as well. Good-quality paste printing, peak reflow temperature, dwell time above the liquidus temperature, cooling rate, and solder atmosphere reactions all affect the microstructure of solder joints and ultimately their reliability. Higher processing temperatures increase the dissolution rates of metal finishes and/or conductor metals (i.e., minor elements) into the solder and can increase the rate of intermetallic compound formation in the bulk solder. This increases the joint stiffness (i.e., reduces the compliance). 

Tin—Nickel. AHoy deposits having 65% fin have been commercially plated siace about 1951 (135). The 65% fin alloy exhibits good resistance to chemical attack, staining, and atmospheric corrosion, especially when plated copper or bron2e undercoats are used. This alloy has a low coefficient of friction. Deposits are solderable, hard (650—710 HV ), act as etch resists, and find use ia pfinted circuit boards, watch parts, and as a substitute for chromium ia some apphcafions. The rose-pink color of 65% fin is attractive. In marine exposure, tin—nickel is about equal to nickel—chromium deposits, but has been found to be superior ia some iadustfial exposure sites. Chromium topcoats iacrease the protection further. Tia-nickel deposits are bfitde and difficult to strip from steel. Temperature of deposits should be kept below 300°C. 

Hermetically Sealed. A hermetically sealed device shall be sealed against the entrance of an external atmosphere and the seal shall be made by fusion, e.g., soldering, brazing, welding, or the fusion of glass to metal. 

The behaviour of a wide range of a, a-0 and /3 brasses in various corrosive environments was studied by Voce and Bailey and the results summarised by Whitaker . Penetration by mercury and by molten solder was intercrystalline in all three types of brass. In moist ammoniacal atmospheres the penetration of unstressed brasses of all types was intercrystalline. Internal or applied stresses accelerated the intercrystalline penetration of a brasses and initiated some transcrystalline cracking, and also caused severe transcrystalline cracking of /3 alloys and transcrystalline cracking across the 0 regions in the two-phase brasses. Immersion in ammonia solution, however, caused intercrystalline cracking of stressed 0 brasses. 

The effect of Oj, SOj, NOj, HjS, CI2, CO and NH3 on Sn/50%Pb in atmospheres of different relative humidity were investigated but only SO2 and NO2 were active at low concentrations (<100 ppm). An XPS study of Sn/50 7oPb solder exposed to O2, HjO and NO2 was conducted to establish both the surface species formed and the ratio of the concentration of each metal in the surface. Previous XPS studies had only considered the interaction of tin/lead solder with the air . 

The unfortunate action of the compound layer is observed only rarely, usually in hot water. In cooking vessels (domestic or industrial) the copper is protected satisfactorily at some sacrifice of tin, and occasional re-tinning ensures long service. In atmospheric corrosion the arrival of compounds at the surface of the coating results in some darkening and in loss of solderability. 

With tin coatings on brass, the interdiffusion of coating and substrate brings zinc to the surface of the tin the action can be rapid even with electrodeposited coatings. The effect of zinc in the surface layers is to reduce the resistance of the coating to dulling in humid atmospheres, and the layer of zinc corrosion product formed makes soldering more difficult. An intermediate layer of copper or nickel between brass and tin restrains this interdiffusion . 

To provide solderability and protection in mild atmospheric conditions 5 ... 

Catalytic forms of copper, mercury and silver acetylides, supported on alumina, carbon or silica and used for polymerisation of alkanes, are relatively stable [3], In contact with acetylene, silver and mercury salts will also give explosive acetylides, the mercury derivatives being complex [4], Many of the metal acetylides react violently with oxidants. Impact sensitivities of the dry copper derivatives of acetylene, buten-3-yne and l,3-hexadien-5-yne were determined as 2.4, 2.4 and 4.0 kg m, respectively. The copper derivative of a polyacetylene mixture generated by low-temperature polymerisation of acetylene detonated under 1.2 kg m impact. Sensitivities were much lower for the moist compounds [5], Explosive copper and silver derivatives give non-explosive complexes with trimethyl-, tributyl- or triphenyl-phosphine [6], Formation of silver acetylide on silver-containing solders needs higher acetylene and ammonia concentrations than for formation of copper acetylide. Acetylides are always formed on brass and copper or on silver-containing solders in an atmosphere of acetylene derived from calcium carbide (and which contains traces of phosphine). Silver acetylide is a more efficient explosion initiator than copper acetylide [7],... 

U-Tube Manometers. These are generally made from a glass tube bent in the shape of the letter U and partly filled with a working liquid, most often with mercury. The operation of the manometer is based on the displacement of the levels of the working liquid in both arms of the tube depending on the difference in the pressures over these levels. One arm of a manometer is connected to the vacuum setup in which the pressure is to be measured, while the other arm is either closed (soldered) or remains open, i.e. is constantly at atmospheric pressure. 

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