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Sintered contacts

We used polycrystalline films of ZnO and Sn02 as adsorbents. The films were deposited from the water suspension of respective oxides on quartz substrates. These substrates contained initially sintered contacts made of platinum paste. The gap between contacts was of about lO" cm. All samples were initially heated in air during one hour at T 500 C. We used purified molecular oxygen an acceptor particle gas. H and Zn atoms as well as molecules of CO were used as donor particles. We monitored both the kinetics of the change of ohmic electric conductivity and the tangent of inclination angle of pre-relaxation VAC caused by adsorption of above gases and the dependence of stationary values of characteristics in question as functions of concentrations of active particles. [Pg.74]

Compared with a Teflon -bonded commercial electrode, the composite electrode showed lower polarization losses at high current densities, even though the composite material did not contain Pt. The ohmic and mass transfer resistances were lower in the composite electrode than in the commercial electrode. The sintered contacts and interlocked networks formed in the composite structure permitted better electrical and physical contact between the carbon fibres and metal fibres, leading to a composite electrode with a high void volume and large macroscopic porosity, which increased the accessibility of carbon to the reactants [22],... [Pg.288]

Figure C2.11.6. The classic two-particle sintering model illustrating material transport and neck growtli at tire particle contacts resulting in coarsening (left) and densification (right) during sintering. Surface diffusion (a), evaporation-condensation (b), and volume diffusion (c) contribute to coarsening, while volume diffusion (d), grain boundary diffusion (e), solution-precipitation (f), and dislocation motion (g) contribute to densification. Figure C2.11.6. The classic two-particle sintering model illustrating material transport and neck growtli at tire particle contacts resulting in coarsening (left) and densification (right) during sintering. Surface diffusion (a), evaporation-condensation (b), and volume diffusion (c) contribute to coarsening, while volume diffusion (d), grain boundary diffusion (e), solution-precipitation (f), and dislocation motion (g) contribute to densification.
In liquid-phase sintering, densification and microstmcture development can be assessed on the basis of the liquid contact or wetting angle, ( ), fonned as a result of the interfacial energy balance at the solid-liquid-vapour intersection as defined by the Young equation ... [Pg.2771]

Exposure to PTFE can arise from ingestion, skin contact, or inhalation. The polymer has no irritating effect to the skin, and test animals fed with the sintered polymer have not shown adverse reactions. Dust generated by grinding the resin also has no effect on test animals. Formation of toxic products is unlikely. Only the heated polymer is a source of a possible health hazard (120). [Pg.355]

The Utah deposit is located in southwestern Utah near Cedar City. The iron ore deposits are of contact metamorphic origin. The cmde ore contains 35 to 65% iron, primarily in the form of magnetite and goethite. Mining is done by the open pit method. The cmde ore is cmshed, screened at —75 mm (—200 mesh size) and shipped as lump ore containing 54% iron. The ore is rescreened at the steel mill to produce lump ore (10—64 mm) for the blast furnace and sinter feed (0—10 mm) for the sinter plant. [Pg.413]

Sintering consists of heating a mixture of fine materials to an elevated temperature without complete fusion. Surface diffusion and some incipient fusion cause the soHd particles in contact with one another to adhere and form larger aggregates. In the processing of hematite, Fe202, or magnetite,... [Pg.165]

In sintering, the green compact is placed on a wide-mesh belt and slowly moves through a controlled atmosphere furnace (Fig. 3). The parts are heated to below the melting point of the base metal, held at the sintering temperature, and cooled. Basically a solid-state process, sintering transforms mechanical bonds, ie, contact points, between the powder particles in the compact into metallurgical bonds which provide the primary functional properties of the part. [Pg.178]

Conta.ctMa.teria.ls, Electrical contact materials are produced by either slicing rod made from metal powder, infiltrating a porous refractory skeleton, or compaction and sintering of powders (see Electrical CONNECTORS) (51—53). [Pg.190]

Copper and silver combined with refractory metals, such as tungsten, tungsten carbide, and molybdenum, are the principal materials for electrical contacts. A mixture of the powders is pressed and sintered, or a previously pressed and sintered refractory matrix is infiltrated with molten copper or silver in a separate heating operation. The composition is controlled by the porosity of the refractory matrix. Copper—tungsten contacts are used primarily in power-circuit breakers and transformer-tap charges. They are confined to an oil bath because of the rapid oxidation of copper in air. Copper—tungsten carbide compositions are used where greater mechanical wear resistance is necessary. [Pg.190]

Cadmium Sulfide Photoconductor. CdS photoconductive films are prepared by both evaporation of bulk CdS and settHng of fine CdS powder from aqueous or organic suspension foUowed by sintering (60,61). The evaporated CdS is deposited to a thickness from 100 to 600 nm on ceramic substates. The evaporated films are polycrystaUine and are heated to 250°C in oxygen at low pressure to increase photosensitivity. Copper or silver may be diffused into the films to lower the resistivity and reduce contact rectification and noise. The copper acceptor energy level is within 0.1 eV of the valence band edge. Sulfide vacancies produce donor levels and cadmium vacancies produce deep acceptor levels. [Pg.431]

Stability, and can provide both ohmic low resistance contacts and rectifying contacts. Typically, siUcide layers are formed in situ by sputteriag a thin platiaum layer onto the siUcon surface, followed by sintering. Infrared detection is another appHcation of platiaum siUcide technology. [Pg.174]

Fig. 4. Alumina—silica—chromia fiber after 120 h at 1426°C showing crystallization and sintering at contact points. Magnified x5000. Fig. 4. Alumina—silica—chromia fiber after 120 h at 1426°C showing crystallization and sintering at contact points. Magnified x5000.
Sintering. A ceramic densiftes duriag sintering as the porosity or void space between particles is reduced. Additionally, the cohesiveness of the body iacreases as iaterparticle contact or grain boundary area iacreases. Both processes depend on and are controlled by material transport. [Pg.311]

Typical applications in the chemical field (Beaver, op. cit.) include detarring of manufactured gas, removal of acid mist and impurities in contact sulfuric acid plants, recovery of phosphoric acid mists, removal of dusts in gases from roasters, sintering machines, calciners, cement and lime Idlns, blast furnaces, carbon-black furnaces, regenerators on fluid-catalyst units, chemical-recoveiy furnaces in soda and sulfate pulp mills, and gypsum kettles. Figure 17-74 shows a vertical-flow steel-plate-type precipitator similar to a type used for catalyst-dust collection in certain fluid-catalyst plants. [Pg.1616]


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See also in sourсe #XX -- [ Pg.288 ]




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