Silicone molding compound

In order to prepare the samples for dielectric-constant measurements, etherdiacrylate 6 was mixed with a trace amount of AIBN at room temperature in a cylindrical donut mold made from General Electric RTV 11 silicon molding compound. The donuts had an outer diameter of 7.0mm, an inner diameter of 3.0 mm, and a thickness of 3.0 mm the semisolid triacrylate 3 was mixed with a... 

Elastomers. The elastomers are prepared from linear silicone oils or gums and reinforced with a filler and then vulcanized (cured or cross-linked). The base resin for silicone molding compounds are the result of reacting silicone monomer with methylchloride to produce methyl chlorosilane ... 

TABLE 2.30 Silicone Molding Compound Data Sheet Values... 

Dow Corning silicone molding compound Test method ... 

Silicone molding compounds are available as compression, injection molding, extrusion, and transfer molding grades. Major suppliers include Dow Coming, GE Silicones, Bayer (Baysilone), Transene, Cytec Fiberite, and Wacker... 

Silicone molding compound, glass-filled Diallyl phthalate, glass filled... 

Silicone molding compound, mineral-filled Styrene-methyl methacrylate copolymer Melamine, cellulose-filled Urea, cellulose-filled... 

Cadmium pigments are stable to 400 °C with only minimal degradation, allowing them to be used in the majority of polymers, and also allowing colored articles to be recycled. They have limited use in some polymers, such as silicone molding compounds, acrylic molding compounds and acetals. 

Entries on new materials, including re-cyclate plastics, fullerenes, hard-surfaced polymers, dendrimers, transflective materials, rapid prototyping materials, silicone nitride, supercritical fluids, bulk molding compounds, conversion coatings, folic acid, replacements for chloro-fluorocarbons ... 

Michael, K. W., Antonen, R. G., "The Properties of Silicone/Epoxy Electronic Grade Molding Compound", Proceedings of the Soc. of Hybrid and Microelectronics Conf, P. 253, Anaheim, Calif., 1978. 

This paper reports the results of a molecular-level investigation of the effects of flame retardant additives on the thermal dedompositlon of thermoset molding compounds used for encapsulation of IC devices, and their implications to the reliability of devices in molded plastic packages. In particular, semiconductor grade novolac epoxy and silicone-epoxy based resins and an electrical grade novolac epoxy formulation are compared. This work is an extension of a previous study of an epoxy encapsulant to flame retarded and non-flame retarded sample pairs of novolac epoxy and silicone-epoxy compounds. The results of this work are correlated with separate studies on device aglng2>3, where appropriate. 

Semiconductor Grade Silicone-Epoxy. TGA, DSC, and EGA analyses revealed no difference between the FR and non-FR compounds below 200°C. The FR moieties again decomposed only in the temperature range above 350°C. There was very little Cl or Br in the aqueous extract, and no CH2CI or CH2Br was detected in the EGA product profiles. This shows the capability of material formulators to supply very clean semiconductor grade molding compounds. 

The most common and widely used thermoset molding compounds are classified as follows (a) alkyd, (b) allylic (diallyl phthalate), (c) amino (melamine and urea), (d) epoxy, (e) phenolic, (f) polyester, and (g) silicone. There may be other specialty thermoset resin materials used on specific applications. 

To achieve low stress embedding material, low modulus material such as silicones (elastomers or gels) and polyurethanes are usually used. Soft-domain elastomeric particles are usually incorporated into the hard (high modulus) materials such as epoxies and polyimides to reduce the stress of embedding materials. With the addition of the perfect particle size, distribution, and loading of soft domain particles, low stress epoxy molding compounds have been developed as excellent embedding materials for electronic applications. 

Silicone rubber compounds can be molded, extruded and calendered. The vulcanisation of rubber compounds occurs in two stages 1) in a press or steam boiler at high pressure and 120-150 °C 2) by thermostatic control at atmospheric pressure and 200-250 °C. 

The rule, therefore, is that silicone coatings are a very effective way to avoid damage to die surfaces encapsulated in epoxy transfer molding compounds provided that ... 

Figure 1. Silicone die coatings can be used to protect the die against damage from the compressive stresses generated during cure and thermal cycling of the transfer molding compound in post-molded plastic packages.

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