Epoxy transfer molding compounds

The rule, therefore, is that silicone coatings are a very effective way to avoid damage to die surfaces encapsulated in epoxy transfer molding compounds provided that ... 

Due to their small feature sizes, microelectronic circuits need protection from environmental hazards such as mechanical damage and adverse chemical influences from moisture and contaminants. Several approaches are currently in use, for example, hermetic encapsulation of the device in sealed metal or ceramic enclosures, application of soft silicone gels as a cover over integrated circuitry, and encapsulation by transfer molding, which is the topic of this report. Both silicone resins and epoxy resins are used for this purpose. As the quality and performance of the epoxy encapsulants improved, the need for the generally more expensive silicone resins diminished. The present work is exclusively devoted to epoxy transfer molding compounds. 

REACTIVITY OF TRANSFER MOLDING COMPOUND MADE USING XD-9053.00L VS. CRESOL EPOXY NOVOLAC ... 

All samples were prepared from a commercially available epoxy cresol novolac-phenol formaldehyde novolac-tertia-ry amine based molding compound. Pelletized preforms were heated to 85°C in a RF preheater prior to being transfer molded at 180°C/68 atm. for 90 sec. Molded samples were cooled in air to room temperature and stored in a desiccated environment until testing or subsequent thermal treatment. Post mold curing, PMC, was accomplished in a gravity oven at 175°C for a period of 4 hours. Samples without post mold curing are designated by NPMC. 

Transfer, or plunger molding, is a process in which high-flow B-stage resins, such as epoxies, are liquefied under heat and pressure in a transfer pot, after which the resultant liquid resin is transferred under pressure into mold cavities. The transferred resin is then heated to form cured, final parts that are then removed from the mold. Although compression and transfer molding are used principally with thermosetting compounds, the processes are occasionally used with thermoplastic material, often thermoplastic composites. 

Molded boards are made with resins containing fillers to improve thermal and mechanical properties. The resins are molded into a die or cavity to form the desired shape, including three-dimensional features. The board is metaUzed using conventional seeding and plating techniques. Alternatively, three-dimensional prefabricated films can also be transfer molded and further processed to form structures with finer dimensions. With proper selection of filler materials and epoxy compounds or by molding metal cores, the molded boards can be CTE tailored with enhanced thermal dissipation properties (Seraphim et al, 1989). 

Molding Compound Delamination in Plastic SMT Packages. Plastic-packaged integrated circuits are generally transfer molded using a filled epoxy-based compound. 

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