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Shear stress substrate

Initiation. Free-radical initiators are produced by several processes. The high temperatures and shearing stresses required for compounding, extmsion, and molding of polymeric materials can produce alkyl radicals by homolytic chain cleavage. Oxidatively sensitive substrates can react directly with oxygen, particularly at elevated temperatures, to yield radicals. [Pg.222]

While the smooth substrate considered in the preceding section is sufficiently reahstic for many applications, the crystallographic structure of the substrate needs to be taken into account for more realistic models. The essential complications due to lack of transverse symmetry can be dehneated by the following two-dimensional structured-wall model an ideal gas confined in a periodic square-well potential field (see Fig. 3). The two-dimensional lamella remains rectangular with variable dimensions Sy. and Sy and is therefore not subject to shear stresses. The boundaries of the lamella coinciding with the x and y axes are anchored. From Eqs. (2) and (10) one has... [Pg.12]

For a monolayer film, the stress-strain curve from Eqs. (103) and (106) is plotted in Fig. 15. For small shear strains (or stress) the stress-strain curve is linear (Hookean limit). At larger strains the stress-strain curve is increasingly nonlinear, eventually reaching a maximum stress at the yield point defined by = dT Id oLx x) = 0 or equivalently by c (q x4) = 0- The stress = where is the (experimentally accessible) static friction force [138]. By plotting T /Tlx versus o-x/o x shear-stress curves for various loads T x can be mapped onto a universal master curve irrespective of the number of strata [148]. Thus, for stresses (or strains) lower than those at the yield point the substrate sticks to the confined film while it can slip across the surface of the film otherwise so that the yield point separates the sticking from the slipping regime. By comparison with Eq. (106) it is also clear that at the yield point oo. [Pg.53]

Atherosclerosis, a disease of the vascular wall, is the substrate for the arterial forms of CVD. Atherosclerotic plaques exhibit a focal distribution along the arterial tree as a consequence of local conditions that favor their initiation and progression. Low or reversed shear stress, for example, contributes to plaque development, a process in which the regulation of several genes may be involved (Resnick and Gimbrone 1995). [Pg.217]

To model this, Duncan-Hewitt and Thompson [50] developed a four-layer model for a transverse-shear mode acoustic wave sensor with one face immersed in a liquid, comprised of a solid substrate (quartz/electrode) layer, an ordered surface-adjacent layer, a thin transition layer, and the bulk liquid layer. The ordered surface-adjacent layer was assumed to be more structured than the bulk, with a greater density and viscosity. For the transition layer, based on an expansion of the analysis of Tolstoi [3] and then Blake [12], the authors developed a model based on the nucleation of vacancies in the layer caused by shear stress in the liquid. The aim of this work was to explore the concept of graded surface and liquid properties, as well as their effect on observable boundary conditions. They calculated the hrst-order rate of deformation, as the product of the rate constant of densities and the concentration of vacancies in the liquid. [Pg.76]

Mechanical forces can disturb the elaborate structure of the enzyme molecules to such a degree that de-activation can occur. The forces associated with flowing fluids, liquid films and interfaces can all cause de-activation. The rate of denaturation is a function both of intensity and of exposure time to the flow regime. Some enzymes show an ability to recover from such treatment. It should be noted that other enzymes are sensitive to shear stress and not to shear rate. This characteristic mechanical fragility of enzymes may impose limits on the fluid forces which can be tolerated in enzyme reactors. This applies when stirring is used to increase mass transfer rates of substrate, or in membrane filtration systems where increasing flux through a membrane can be accompanied by increased fluid shear at the surface of the membrane and within membrane pores. Another mechanical force, surface... [Pg.297]

The manner by which shear stress-induced cellular changes occur in endothelial cells involves cell membrane and cytoskeletal molecules that lead to a shape change. The cytoskeleton contains actin filaments, intermediate filaments, and microtubules, all of which are restructured upon exposure to external force. Under stress conditions, actin filaments coalesce to form stress fibers that anchor at the focal contacts, which are adhesion sites at the cell substrate interface. [Pg.242]

The test method consists of uniaxially straining a sample of the film-substrate couple as shown schematically in Figure 1. The film thickness is t, and the specimen width is w. Under tensile strain, an interfacial shear stress, x(x), is produced. While the film is bonded to the substrate, the shear stress, x(x), at the interface causes a tensile stress, metal film. When the strain is sufficient, the tensile stress will reach the ultimate tensile strength of the film, tr. Then, if the film fails by brittle... [Pg.501]

The above discussion is relevant to isotropic bulk materials. Where a thin film is deposited on a harder substrate, there is a general tendency for the area of contact to be determined by the yield stress (or approximately by the hardness) of the substrate, while the shear stress is determined by the surface film. In the ideal case... [Pg.49]

Re-orientation of surface crystallites, and transfer to the counterface, take place quickly under the influence of sliding so that the coefficient of friction and the shear stress decrease. At the same time the compression of the film under the normal component of the applied stress forces the film material into the low spots of the substrate surface, and it is at this stage that embedding and chemical bonding are likely to become more significant. [Pg.68]

The brittle film cracking with plastic deformation of the ductile substrate at the interface has been described by using the shear lag model. " This model, which was proposed in the analysis of the fragmentation of fiber composites," " develops a relation for the critical stress producing the steady-state cracking of the film. It assumes that the interfacial shear stress, on the one hand, is activated at each crack tip along the characteristic slip length r, and, on the... [Pg.61]

Fig. 14 Stress distribution in a cracked film. The dotted lines correspond to the elastic behavior of the film/substrate system, the solid lines to the presence of plasticity in the substrate at the crack/interface intersection (a) crack opening in a film deposited on a substrate which is uniaxially stretched, (b) longitudinal strain distribution In the film, (c) normal stress distribution in the film, and (d) shear stress distribution In the film at the Interface. Fig. 14 Stress distribution in a cracked film. The dotted lines correspond to the elastic behavior of the film/substrate system, the solid lines to the presence of plasticity in the substrate at the crack/interface intersection (a) crack opening in a film deposited on a substrate which is uniaxially stretched, (b) longitudinal strain distribution In the film, (c) normal stress distribution in the film, and (d) shear stress distribution In the film at the Interface.
Fig. 15 (a) Schematic representation of the stress profiles in an adherent portion of film at a distance x from a free surface of a through-thickness crack. Interfacial shear stress x. and peel stress p correspond to the action of the substrate on region (1 The normal stress parallel to the x axis, is supposed to remain constant through the film thickness h. [Pg.63]

From the results obtained, for SiC coatings several cases can be identified for which the Von Mises and shear stresses and their gradients with respect to the interface are low. For example, Ta, Mo, Ti, Nb, and TiN produce this effect, when interposed between the steel substrate and the SiC coating. [Pg.70]

The analytical approach developed by Schadler and Noyan, allows calculation of the stress redistribution in cracked triple layer systems. This approach assumes mechanical equilibrium of the cracked coating and the interlayer through perfectly adhering interfaces which transfer the applied stress to the substrate. It is thus possible to deduce expressions for stress distribution normal to the cracked film and shear stress distribution at the interlayer ... [Pg.74]

Mohandas and co-workers (18), confirming previous findings of Weiss and Blumenson (19), have also shown that cells in an environment free of adsorbable proteins (which rapidly modify the surface properties of polymeric or inorganic substrates) will exhibit a similar direct relationship between their adhesion and the critical surface tension of the surface they contacted. DiflFerential adhesion of red blood cells was measured by determining the fraction of cells retained on a surface after the application of well-calibrated shear stresses (IS). In protein-free experiments, the red cells (themselves dominated in adhesive interactions by their protein membranes) had greatest adhesion to glass, intermediate adhesion to polyethylene and siliconized glass, and least adhesion to Teflon. [Pg.10]

Plots of Gc as a function of the nominal prarticle/substrate contact area f are show in Fig. 3(a) for several values of relative humidity. TTie data were initially modeled the data with a two parameter curve fit (gc A ") for each value of relative humidity. Each fit yielded n = 0.5 to within the uncertainty of the curve fitting procedure (typically 0.1). For simplicity the curve fits in Fig. 3(a) represent one parameter least squares fits with n = 0.5, i.e., Gc A-. Since we expect Gc this dep>endence suggests that the initial flaw size is p)ropx)rtional to p>article area (c A). Interfricial flaws are exp)ected to serve as starter cracks, and may be respionsible for the particle size dependence of the shear stress required for detachment. [Pg.277]

Consider a 3-dimensional, corrugated solid placed on a smooth substrate as a simplified model for a mechanical contact, which is a subtle case (Section III. C.5). The macroscopic contact will then consist of individual junctions where asperities from the corrugated solid touch the substrate. A microscopic point of contact p then carries a normal load Ip, and a shear force fp will be exerted from the substrate to the asperity and vice versa. These random forces fp will try to deform both solids. For the sake of simplicity, let us only consider elastic deformations in the top solid. Asperities in intimate contact with the substrate will be subject to a competition between the (elastic) coupling to the top solid and the interaction with the substrate. If the elastic stress exceeds the local critical shear stress c,p of junction p, the contact will break and asperity p will find a new mechanical equilibrium position. In order for (5 to exceed Uep, the area A = tiL- over which the random forces accumulate must be sufficiently laige. The value of L where this condition is satisfied is called the elastic... [Pg.258]

According to the repulsion-adsorption model, a solvent layer is formed at the interface when the gel-substrate interaction is repulsive, and the frictional shear stress arises from the viscous flow of the solvent layer. Therefore, the frictional stress should increase with the increase in the sliding velocity, i.e., a ° v. [Pg.226]


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See also in sourсe #XX -- [ Pg.218 ]




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