Self-Assembly Lithography

Ikuta and K. Hirowatari, Real three dimensional micro fabrication using stereohthography, in Proc. IEEE Micro Electro Mechanical Systems (MEMS 93), Ft. Lauderdale, pp. 42 47 (1993) K. Ikuta, K. Hirowatari, and T. Ogata, Three dimensional integrated fluid systems (MIPS) fabricated by stereo lithography, in IEEE Int. Workshop on Micro Electro Mechanical Systems (MEMS 94), Oiso, Japan, pp. 1 6 (1994). 

Fundamentals of Microfabrication The Science of Miniaturization, 2nd ed., pp. 66, 67, CRC Press, New York (2002). 

Resists based on SAMs have also been successfully deposited on metals such as gold, aluminum, titanium, zirconium, silver, copper, and platinum as well as Si02, GaAs, and other surfaces, inspired no doubt by the first demonstration 

Muller, C. David, B. Volkel, andM. Gunze, Nanostmcturing of alkanehtiols withultrashaip field emitters, J. Vac. Set Technol. B13, 2846 2849 (1995). 

Biebuyck, N.B. Larsen, E. Delamarche, and B. Michel, Lithography beyond light micro contact printing with monolayer resists, IBM J. Res. Dev. 41 (1997). 

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In recent years, there are many effective methods for the preparation of SERS-active Ag substrates. These include Langmuir-Blodgett (LB), self-assembly, lithography, and electrodeposition. 

Chemically amplified resists are quite effective in improving pattern sizes in photofabrication. However, optical limitations in resolution must be overcome to improve further progress. Several processes contribute to improving the resolution of photofabrication. In this chapter, immersion, double-patterning, multipatterning maskless, multielectron beam, and direct self-assembly lithography processes are introduced. 

Artificial superhydrophobic surfaces have been introduced in the past decade and a variety of production methods (self-assembly, lithography, sol-gel) and materials (polymers, metals, Si, etc.) have been suggested. 

Marrian C R K, Perkins F K, Brandow S L, Koloski T S, Dobisz E A and Calvert J M 1994 Low voltage electron beam lithography in self-assembled ultrathin films with the scanning tunneling microscope Appi. Rhys. Lett. 64 390... 

On detailed electrical characteristics of a SET transistor utilizing charging effects on metal nanoclusters were reported by Sato et al. [26]. A self-assembled chain of colloidal gold nanoparticles was connected to metal electrodes, which were formed by electron-beam lithography. The cross-linking of the particles as well as their connection to the electrodes results from a linkage by bifunctional organic molecules, which present the tunnel barriers. 

A similar route has been followed most recently by Weiss et al. who have fabricated a multi-island SE device from self-assembled ID gold nanocrystal chains [28]. They assembled thiol-stabilized 50 nm Au particles in a chainlike structure and used subsequently electron-beam lithography for electrode fabrication. Here it has to be... 

Nealey and coworkers [75,76,146] took a similar approach and applied lithographically defined self-assembled monolayers as substrates to direct the orientation of block copolymer thin films. After EUV interferometic lithography on octadecyltrichlorosilane (OTS) or phenylethyltrichlorosilane (PETS) monolayers, PS-fr-PMMA block copolymers were deposited and annealed on the substrates. Due to the selective wetting of PS and PMMA on the unexposed and exposed regions, respectively, they were able to obtain large areas of perpendicular lamella when the commensurate condition was fulfilled. 

Quantum dots are the engineered counterparts to inorganic materials such as groups IV, III-V and II-VI semiconductors. These structures are prepared by complex techniques such as molecular beam epitaxy (MBE), lithography or self-assembly, much more complex than the conventional chemical synthesis. Quantum dots are usually termed artificial atoms (OD) with dimensions larger than 20-30 nm, limited by the preparation techniques. Quantum confinement, single electron transport. Coulomb blockade and related quantum effects are revealed with these OD structures (Smith, 1996). 2D arrays of such OD artificial atoms can be achieved leading to artificial periodic structures. 

A new methodology, which combines traditional (top-down) lithography and self-assembly (bottom-up) approaches, has been developed for fabrication of complex nanoscale colloidal stmctures on a surface over a large domain. The principle of this method is to create a chemically patterned surface by well-established soft lithography, followed by self-assembling nanoparticles selectively deposited... 

Hung AM, Stupp SI. Simultaneous self-assembly, orientation, and patterning of peptide-amphiphile nanofihers by soft lithography. Nano Lett 2007 7 1165-1171. 

Keywords wrinkling Thin-film Elastomeric polymer Polydimethylsiloxane Patterns Deformation Surfaces Self-assembly Polyelectrolyte multilayer films Thin-films Polymer brushes Colloidal crystallization Mechanical-properties Assembled monolayers Buckling instability Elastomeric polymer Tobacco-mosaic-virus Soft lithography Arrays... 

Important techniques for bottom-up nanofabrication include soft lithography and surface self-assembly. Also the use of containers such as carbon nanotubes to confine molecular scale objects in one dimension is a useful tool. 

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