Thermal conductivity requirements

The design of heat exchangers and the determination of pressure drops across units require thermal conductivity and viscosity data. These data are usually available (often in the databanks of process simulators) and, if unavailable, can be estimated by group-contribution techniques [8]. 

A variety of noncorrosive, thermaUy conductive silicone adhesives are available that are suitable for use in bonding hybrid circuit substrates, connecting power semiconductor components and devices to heat sinks as well as for use in other bonding applications requiring thermal conductivity. The flowable versions are used as thermally conductive potting materials for transformers, power supplies, coils, and other electronic devices that require improved thermal dissipation [41]. 

The heat pipe has properties of iaterest to equipmeat desigaers. Oae is the teadeacy to assume a aeady isothermal coaditioa while carrying useful quantities of thermal power. A typical heat pipe may require as Htfle as one thousandth the temperature differential needed by a copper rod to transfer a given amount of power between two poiats. Eor example, whea a heat pipe and a copper rod of the same diameter and length are heated to the same iaput temperature (ca 750°C) and allowed to dissipate the power ia the air by radiatioa and natural convection, the temperature differential along the rod is 27°C and the power flow is 75 W. The heat pipe temperature differential was less than 1°C the power was 300 W. That is, the ratio of effective thermal conductance is ca 1200 1. 

Thickness. The traditional definition of thermal conductivity as an intrinsic property of a material where conduction is the only mode of heat transmission is not appHcable to low density materials. Although radiation between parallel surfaces is independent of distance, the measurement of X where radiation is significant requires the introduction of an additional variable, thickness. The thickness effect is observed in materials of low density at ambient temperatures and in materials of higher density at elevated temperatures. It depends on the radiation permeance of the materials, which in turn is influenced by the absorption coefficient and the density. For a cellular plastic material having a density on the order of 10 kg/m, the difference between a 25 and 100 mm thick specimen ranges from 12—15%. This reduces to less than 4% for a density of 48 kg/m. References 23—27 discuss the issue of thickness in more detail. 

Relations for transport properties such as viscosity and thermal conductivity are also required if wall friction and heat-transfer effects are considered. 

The interelectrode insulators, an integral part of the electrode wall stmcture, are required to stand off interelectrode voltages and resist attack by slag. Well cooled, by contact with neighboring copper electrodes, thin insulators have proven to be very effective, particularly those made of alumina or boron nitride. Alumina is cheaper and also provides good anchoring points for the slag layer. Boron nitride has superior thermal conductivity and thermal shock resistance. 

In appUcations in which electrical conductivity is required, metals, copper, tungsten, molybdenum, and Kovar [12606-16-5] are the preferred chip-carrier materials. Metals have exceUent thermal conductivities. Tables 2 and 3 Ust the various materials used for substrates, along with their mechanical, electrical, and thermal properties. 

Refractories are materials that resist the action of hot environments by containing heat energy and hot or molten materials (1). There is no weU-estabhshed line of demarcation between those materials that are and those that are not refractory. The abiUty to withstand temperatures above 1100°C without softening has, however, been cited as a practical requirement of industrial refractory materials (see Ceramics). The type of refractories used in any particular apphcation depends on the critical requirements of the process. For example, processes that demand resistance to gaseous orHquid corrosion require low permeabihty, high physical strength, and abrasion resistance. Conditions that demand low thermal conductivity may require entirely different refractories. Combinations of several refractories are generally employed. 

Beryllia and Thoria. These are specialty oxides for highly specialized appHcations that require electrical resistance and high thermal conductivity. BeryUia is highly toxic and must be used with care. Both are very expensive and are used only in small quantities. 

Any refractory material that does not decompose or vaporize can be used for melt spraying. Particles do not coalesce within the spray. The temperature of the particles and the extent to which they melt depend on the flame temperature, which can be controlled by the fueLoxidizer ratio or electrical input, gas flow rate, residence time of the particle in the heat zone, the particle-size distribution of the powders, and the melting point and thermal conductivity of the particle. Quenching rates are very high, and the time required for the molten particle to soHdify after impingement is typically to... 

Ultrasonic Spectroscopy. Information on size distribution maybe obtained from the attenuation of sound waves traveling through a particle dispersion. Two distinct approaches are being used to extract particle size data from the attenuation spectmm an empirical approach based on the Bouguer-Lambert-Beerlaw (63) and a more fundamental or first-principle approach (64—66). The first-principle approach implies that no caHbration is required, but certain physical constants of both phases, ie, speed of sound, density, thermal coefficient of expansion, heat capacity, thermal conductivity. 

A guarded hot-plate method, ASTM D1518, is used to measure the rate of heat transfer over time from a warm metal plate. The fabric is placed on the constant temperature plate and covered by a second metal plate. After the temperature of the second plate has been allowed to equiUbrate, the thermal transmittance is calculated based on the temperature difference between the two plates and the energy required to maintain the temperature of the bottom plate. The units for thermal transmittance are W/m -K. Thermal resistance is the reciprocal of thermal conductivity (or transmittance). Thermal resistance is often reported as a do value, defined as the insulation required to keep a resting person comfortable at 21°C with air movement of 0.1 m/s. Thermal resistance in m -K/W can be converted to do by multiplying by 0.1548 (121). 

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