Properties of Bismaleimide Resins

Han Han, Y.-G., Liao, G.-X., Xu, Y.-J., Yu, G.-P., Jian, X.-G. Cure kinetics, phase behaviors, and fracture properties of bismaleimide resin toughened by poly (phthalazinone ether ketone). Polym. Eng. Sci. 46 (2009) 2301-2308. 

Xiaolan Hu, Zhong Lin, Moufa Yu et al. Tribological properties of bismaleimide resin and its composites./owma/ of Material Engineering (S). SAMPE China 180-182, 2008. 

Table 10. Mechanical Properties of Bismaleimide Diels-Alder Resins ...

Table 8. Mechanical properties of bismaleimide diels-alder resins ...

Similar hybrid thermosets consisting of bismaleimide resins mixed with bisphenol A dicyanate ester have been commercially available (BT resin, Mitsubishi gas chemical). The presence of cross-linked triazine ether network in the matrix of bismaleimide crosslinked network is believed to improve the toughness, reduce the moisture sensitivity and improve the dielectric properties of the bismaleimide thermoset without a sacrifice in heat resistance. 

Table 2.17 Thermal and mechanical properties of bismaleimide-modified UPE resin network [188] ...

Other thermosetting resins used as matrices for structural composites are phenolics [89], aromatic polyimides [90], and other special high-temperature, high-strength resins Uke bismaleimides and cyanate esters [91]. Typical properties of these resins are reported in Table 8.3. 

Mitsubishi Gas Chemical (7) has developed a family of products which are stated to be a coreactive blend of triazine resin (terminology used to describe bisphenol A dicyanate and its prepolymers) and a bismaleimide resin. Properties of these resins are described in patents (8) and product literature (7). End uses suggested include electronic encapsulation, printed wiring board and structural composites. 

Rajabi Laleh, and Malekzadeh Ghodratollah. Effects of bismaleimide resin on dielectric and dynamic mechanical properties of epoxy-based laminates. Iran. Polym. J. 15 no. 6 (2006) 447-455. 

The carbon fibres used are from the separate sources and cover all the grades listed in Table 3.1. Measurements were made at room temperature and all the matrices except one are epoxies. The use of bismaleimide resin makes little difference to properties apart from the relatively low transverse strain-to-failure. The large gaps in information especially for transverse, compressive and shear properties are clear. The anisotropy of unidirectional materials can be seen by comparing longitudinal and transverse tensile or shear moduli and strengths. 

Bismaleimide Resins via EI E Reaction. The copolymerization of a BMI with o,o -diallylbisphenol A [1745-89-7] (DABA) is a resia coacept that has beea widely accepted by the iadustry because BMI—DABA bleads are tacky soHds at room temperature and therefore provide all the desired properties ia prepregs, such as drape and tack, similar to epoxies. Crystalline BMI can easily be blended with DABA, which is a high viscosity fluid at room temperature. Upon heating BMI—DABA blends copolymerize via complex ENE and Diels-Alder reactions as outlined ia Eigure 8. 

The saiq>les studied were a BCB terminated aromatic imide oligomer and a BCB terminated imide monomer blended with a compatible bismaleimide (BMI) resin. Neat properties studied on both resin systems included the thersial and rheological properties of the uncured specimens subsequently used to determine appropriate cure conditions. Thermal and mechanical properties of the cured materials are also discussed. 

Bisbenzocyclobutenes readily react with molecules which contain sites of reactive unsaturation such as bismaleimides [10,13, 31, 32]. This is in essence, a novel type of Diels-Alder polymerization in which the bis-diene is latently embodied within two benzocyclobutene moieties. The properties of these polymers depends strongly on the mole ratio of the monomers and when it is equimolar, can result in some exceptionally tough high Tg resins [33, 34]. 

The most common advanced composites are made of thermosetting resins, such as epoxy polymers (the most popular singlematrix material), polyesters, vinyl esters, polyurethanes, polyimids, cianamids, bismaleimides, silicones, and melamine. Some of the most widely used thermoplastic polymers are polyvinyl chloride (PVC), PPE (poly[phenylene ether]), polypropylene, PEEK (poly [etheretherketone]), and ABS (acrylonitrile-butadiene-styrene). The precise matrix selected for any given product depends primarily on the physical properties desired for that product. Each type of resin has its own characteristic thermal properties (such as melting point... 

The majority of base materials for circuit boards are combinations of a copper foil with a laminate, where the laminate itself consists of a carrier material and a resin. Thus properties of the base material such as mechanical strength, dimensional stability, and processi-bility are determined primarily by the carrier material. On the other hand, the resin materials are responsible for the thermomechanical and electrical properties as well as for its resistance against chemicals and moisture. Frequently used carrier materials are based on glass and carbon fibers, papers, and polyamide, whereas the majority of the laminating resins are thermosets such as epoxies, phenolics, cyanates, bismaleimide triazine (BT) resins, maleimides, and various combinations of these [13]. 

PROPERTIES OF SPECIAL INTEREST BMI resins are generally brittle. They can be toughened with additives such aromatic diamines (chain extension via Michael Addition reaction), divinylbenzene or bis (ally Iphenyl) compounds (chain extension via Diels-Alder reaction and ene reaction, respectively), benzocyclobutene derivatives (chain extension via Diels-Alder reaction), low molecular weight rubber, and thermoplastics. Certain bismaleimides are liquid crystalline. ... 

The double bonds in bismalemide are highly electron-deficient due to two flanking carbonyl groups, and are reactive towards a bimolecular addition reaction. Hence the maleimide groups of a bismaleimide monomer or chain-extended prepolymer can undergo homopolymerisation to produce 3D network structures. To manipulate the structure and properties, different types of maleimide monomer or prepolymer can be used. The reactivity of such resins depends on their chemical structure and UPE. 

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