Electronic encapsulation

Tobiason furnishes us with two examples of EP formulations for electronic encapsulation and primer coating applications as shown in Tables II and 12, respectively [213]. The coating formula was obtained from a Union Carbide Technical Bulletin. 

Thalhum and its compounds have limited apphcations. It is used in insecticides and rodenticides. Thalhum-mercury alloys are used for switches and closures for use at sub-zero temperatures. Another application is in making low melting glasses for electronic encapsulation. Thallium sulfide is used in photocells. 

Ho, T., et al., Modification of Epoxy Resins with Polysiloxane TPU for Electronic Encapsulation, Journal of Applied Polymer Science, vol. 60, 1996, p. 1097. 

In electronic encapsulation applications, epoxy derivatives of novolacs containing meta-bromo phenol have exhibited substantially better physical and performance properties compared to the conventional tetrabromo bisphenol-A epoxies and brominated epoxy novolacs. The meta-bromo phenol moiety contributes the expected improvements in thermal and hydrolytic stability to the formulation while providing fire retardancy properties (13). 

The increasing demand for thermally stable polymers as electronic encapsulants is consistently creating a need for more information on such materials. Thermogravimetric analysis (TGA) is a valuable tool for the thermal analysis of the silicone polymers. 

Salensky, G. "Epoxy Resin Systems for Electrical/Electronic Encapsulation Insulation/Circuits" Lake Publishing Corp. Libertyville, IL, 1962, May. 

While most of these films are clearly low-modulus materials, they possess properties useful for such radiation-cure coating applications as conformal coatings, electronic encapsulent gels, or fiber optic coatings, particularly where such applications demand silicones broad operational temperature range,... 

Chem. Descrip. Aromatic urethane acrylate, < 400 ppm MEHQ inhibitor Uses Urethane-acrylic producing flexible, fast curing, solv. resist., UV/ EB cured prods, for adhesives, coatings (metal, paper, wood), elastomers, electronics (encapsulants, photoresists), inks, photopolymers Properties APHA 100 clear liq. sp.gr. 1.054 dens. 8.8 Ib/gal vise. 3700 cps 99% reactive esters... 

Chem. Descrip. 4-Methylbenzophenone and benzophenone Uses Photoinitiator for UVsystems based on acrylic oligomers and monomers, structural adhesives, coatings, electronics, encapsulants, inks... 

Uses Photoinitiator for structural adhesives, coatings, electronics, encapsulants, inks... 

Uses Epoxy resin comonomer or as modifiers for epoxy systems in flexible and impact-resist, coatings and potting compds. sealants electronic encapsulation as primer subcoat to anchor surf, coatings on cellophane for food pkg. 

Uses Elec./electronic encapsulation print rollers... 

A team at Cheng Kung University (Taiwan) has found that a phosphorus containing reactive material produces less fumes and contributes to greater thermal stability than conventional systems containing TBBA. The material 2-(6-oxido-6H-dibenzo(c,e)(l,2)oxaphosphorin-6-yl)-l,4-benzenediol, known as ODOPB, was converted into a phosphorus-containing epoxy material for use in an electronic encapsulation apphcation. 

Flexible plastic foams may be found in the form of very soft cushioning materials used in upholstery, clothing interlayers, automobile seats, vibration absorbers, etc. The most common flexible foam resins are polyurethanes, foamed vinyls, cellular polyethylene, cross-linked polyethylene, and silicone foam. Semirigid foams are used for floatation devices, marine bumpers, special electrical insulation on television cables, packaging, and a host of other applications. Rigid foams are used in the production of airplane parts, boats, electronic encapsulation, and many furniture applications where wood was formerly used. 

Ho, T. H. Wang, C. S. Modification of epoxy resin with siloxane containing phenol aralkyl epoxy resin for electronic encapsulation application. Eur.Polym J., 2001, 37, 267. 

Cresol epoxy novolac 8.8 Electronics encapsulants, powder coatings, laminates... 

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