Bismaleimide-triazine

Keywords. Cyanate ester, Polycyanurates, Phenolic-triazine, Polymer matrix composite, Cure kinetics, Polymer blends, Cyanate-epoxy blend, Bismaleimide-triazine resins, Aerospace structure... 

The majority of base materials for circuit boards are combinations of a copper foil with a laminate, where the laminate itself consists of a carrier material and a resin. Thus properties of the base material such as mechanical strength, dimensional stability, and processi-bility are determined primarily by the carrier material. On the other hand, the resin materials are responsible for the thermomechanical and electrical properties as well as for its resistance against chemicals and moisture. Frequently used carrier materials are based on glass and carbon fibers, papers, and polyamide, whereas the majority of the laminating resins are thermosets such as epoxies, phenolics, cyanates, bismaleimide triazine (BT) resins, maleimides, and various combinations of these [13]. 

Rigid substrate-based CSPs. The die may be attached and wire bonded or flip-chip bonded to a small rigid interconnect substrate such as a ceramic or a plastic laminate, for example, bismaleimide triazine (BT). Conventional wire bonding and overmolding processes, as in leadframe CSPs, are also used. 

Interpenetrating polymer networks (IPNs) have been the subject of extensive study since their advent in the 1960s. The IPN is a combination of two polymers in network form, at least one of which is synthesized and/or cross-linked in the immediale presence of the other. In this section, we will refer to the research in recent years on the IPN or semi-IPN based on BMI. A special class that is part of the IPN network is made up of the bismaleimide-triazine (BT) resins based on BMI and dicyanate ester (CE), which has many attractive properties such as very good thermal stability, moisture resistance, low dielectric constant, and low dielectric loss. The cure mechanism of their blends was highly controversial and sometimes conflicting, and all research done on this subject until the year 2006 led to the conclusion that CE... 

Ji Lifu, Gu Aijuan, Liang Guozheng, and Ynan Li. Novel modification of bismaleimide-triazine resin by reactive hyperbranched polysiloxane. J. Mater. Sci. 45 no. 7 (2010) 1859-1865. 

Wu Guanglei, Kou Kaichang, Chao Min, Zhuo Longhai, Zhang Jiaoqiang, and Li Ning. Preparation and characterization of bismaleimide-triazine/epoxy interpenetrating polymer networks. Thermochim. Acta. 537 (2012) 44—50. 

Zeng Xiaoliang, Yu Shuhui, and Sun Rong. Thermal behavior and dielectric property analysis of boron nitride-filled bismaleimide-triazine resin composites. J. Appl. Polym. Sci. 128 no. 3 (2013) 1353-1359. 

Epoxy resin-based laminates are the workhorse of virtually all consumer and commercial electronic products. There are several variations of this pervasive laminate family, each developed to answer a special need. Among these are standard FR-4, multifunctional epoxy, difunctional epoxy, tetrafunctional epoxy, and BT or bismaleimide triazine blends. Each of these was developed to answer the need for a resin with a successively higher Tg or glass transition temperature. Multifunctional epoxy is the most commonly used form. 

Polyimide and polyamide-type engineering plastics 107 Bismaleimide triazine resin BT resin... 

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