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Power circuits/devices

Crystal boules are sliced into wafers on which microelectronic circuits and power semiconductor devices are fabricated. An important use of the wafers is for infrared dectors for space, defense, and environmental applications. [Pg.1474]

There is no doubt that everyone is familiar with Moore s law, the doubling of data density per integrated circuit every 2 years. The performance of integrated circuit devices, historically limited by the characteristics of the transistors, is today limited by the electrical characteristics of the interconnect. The needed improvements in the interconnect performance are achieved with copper and a reduction in the insulator dielectric4 constant due to the associated reduction in the interconnect capacitance, the cross-talk, and the power consumption. [Pg.11]

The common mode rejection ratio (CMRR) is the ratio (usually expressed in decibels) between the common mode noise at the input of a power handling device and the transverse mode noise at the output of the device. Figure 7.3 illustrates the distinction between the two modes of noise. Common mode noise is typically due to either coupling of propagated noise from an external source or stray ground potentials, and it affects the line and neutral (or return) wires of a circuit equally. [Pg.159]

Fill factor — The current versus potential I(U) characteristics of a —> power source, contrarily to those of power dissipation devices, is not limited to the first and third quadrant. In this case the I(U) curve crosses the U and I axes at values different from zero. The value of I at U = 0 is denoted -+ short-circuit current, Jsc, and the value of U at I = 0 is denoted open-circuit potential, Uoc. The maximum power output, Pmax> from a power source depends on the shape of the I(U) curve and is given by Tmax = ( 7) max> excluding first and third quadrant points. The fill factor FF is given by FF = yfff-... [Pg.272]

Short-circuit current — It is the current supplied by an electrical -> power source device if the two terminals of the device are connected, without associated dissipation -> resistance, i.e., load resistance equal to zero. The short-circuit current is determined by the power source characteristics, given by the quotient between electromotive force and internal resistance. See also -> fill factor. [Pg.608]

Some of the present industrial uses of diamond coatings include cutting tools, optical windows, heat spreaders, acoustic wave filters, flat-panel displays, photomultiplier and microwave power tubes, night vision devices, and sensors. Because its thermal conductivity and electrical insulation qualities are high, diamond is used for heat sinks in x- ray windows, circuit packaging, and high-power electroific devices. Moreover, the high chemical stability and inertness of diamond make it ideal for use in corrosive environments and in prosthetic devices that require biocompatibility. [Pg.380]

Internal sources of noise arise from any power-dissipating device. Of course, every laboratory apparatus is a potential source of contamination. For example, Johnson noise arises because the electrons that carry an electric current always have a thermal motion, causing small fluctuating voltages across any resistor in the electrical circuit. One source of environmental noise is the "pick-up" of a 50-Hz signal due to the main supply in the laboratory. [Pg.86]

Switching devices for the power circuits that need to be operated frequently are usually circuit breakers and contactors. Manually operated load break switches, fuse-switch combinations and molded case circuit breakers are used for feeder circuits that are infrequently operated. [Pg.154]

The outgoing switching device in a high current, high fault level, switchboard will usually be a power circuit breaker if it feeds more that about 400 amps to the load. Below 400 amps the circuit could have a fuse-contactor combination, see sub-section 7.3.2 for comments on contactors and Chapter 8 on fuses. Therefore if the outgoing device must be a circuit breaker then the comments and discussion in sub-section 7.2.3 above apply. Low voltage switchboards often use moulded case circuit breakers... [Pg.154]

The hand-reset feature of a moulded case or miniature circuit breaker may replace the 86 relay. There may be a project requirement to use fuses. For low power circuits an auto-reset device (29) may be acceptable, provided that it does not reclose the circuit breaker or contactor. [Pg.536]

It should be noted that this function is assigned only to a relay which detects the flow of current from the frame of a machine or enclosing case or structure of a piece of apparatus to ground, or detects a ground on a normally ungrounded winding or circuit. It is not applied to a device connected in the secondary circuit or secondary neutral of a current transformer, or in the secondary neutral of current transformer, connected in the power circuit of a normally grounded system. [Pg.538]

This corresponds to a power 4 X 10 WHz at 290 K which produces an rms noise voltage (AkTBR) across any resistor combination of value R. The p — p fluetuation is 4-5 times greater than this value. Practical circuit devices such as amplifiers increase this apparent noise power by their power gain plus... [Pg.60]

Q Switching devices for power circuits Circuit-breaker, disconnector (isolator)... [Pg.126]

Note (see section 1.4.3) that the current always flows from the positive electrode towards the negative electrode in the circuit part which is out of the power supply device. Figure 2.11 describes the situation inside the electrochemical cell working as a power source where current flows from the negative electrode to the positive electrode. On the other hand, the current flow out of the cell is indeed directed from the positive towards the negative electrode. [Pg.73]

In power circuits or power devices, heat must be removed by convection by blowing air across the part, by conduction through several solid materials and interfaces to a heat sink or heat exchanger, or by a combination of conduction and convection. If heat transfer depends solely on conduction, the adhesive used for attachment is often the limiting factor providing the... [Pg.341]


See other pages where Power circuits/devices is mentioned: [Pg.354]    [Pg.112]    [Pg.291]    [Pg.457]    [Pg.997]    [Pg.29]    [Pg.297]    [Pg.318]    [Pg.69]    [Pg.175]    [Pg.354]    [Pg.56]    [Pg.104]    [Pg.162]    [Pg.620]    [Pg.504]    [Pg.507]    [Pg.3227]    [Pg.77]    [Pg.82]    [Pg.603]    [Pg.421]    [Pg.88]    [Pg.162]    [Pg.398]    [Pg.217]    [Pg.284]    [Pg.284]    [Pg.120]    [Pg.341]    [Pg.718]    [Pg.241]    [Pg.6]   


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Power devices

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