Polyethersulfone plastic

Possible tape materials include polyimide, polyester, polyethersulfone (PES), and polyparabanic acid (PPA) (18). Of these, polyimide is the most widely used material because its high melting point allows it to survive at temperatures up to 365°C. Although polyester is much cheaper than other materials, its use is limited to temperatures less than 160°C. PES and PPA, on the other hand, are half as cosdy as polyimide, and can survive maximum short-term temperatures of 220 and 275°C, respectively. PES has better dimensional stabiUty than polyimide, absorbs less moisture, and does not tear as easily however, it is inflammable and can be attacked by certain common solvents. Table 7 Hsts various plastic tapes and their properties. Common bump materials are gold, copper, and 95% Pb/5% Sn solder (see Tables 6 and 8 for properties see also References 2 and 21). 

The aromatic sulfone polymers are a group of high performance plastics, many of which have relatively closely related stmctures and similar properties (see Polymers containing sulfur, polysulfones). Chemically, all are polyethersulfones, ie, they have both aryl ether (ArOAr) and aryl sulfone (ArS02Ar) linkages in the polymer backbone. The simplest polyethersulfone (5) consists of aromatic rings linked alternately by ether and sulfone groups. 

The TLCP used was KU 9231 produced by Bayer AG, Germany. The matrix material was an engineering plastic polyethersulfone (PES) manufactured by Jilin University, China. In an earlier article [11] we reported that KU 9231 was incompatible with the PES. 

Polysulfone It is a high performance amorphous plastic that is tough, highly heat resistant, strong and stiff. Products are transparent and slightly clouded amber in color. Material exhibits notch sensitivity and is attacked by ketones, esters, and aromatic hydrocarbons. Other similar types in this group include polyethersulfone, polyphenyl-sulfone, and polyarylsulfone. Use includes medical equipment, solar-heating applications and other performance applications where flame retardance, autoclavability and transparency are needed. 

Plastic material for printed circuits was obtained from a mixture of polycarbonate or polyethersulfone with BPA/DC [38],... 

Processes developed for the injection molding of circuit boards include PCK Technology s mold-n-plate process uses two shots, the first being one of catalytic resins, to form paths on plastic parts that are then processed in a copper bath to form circuitry. Special grades of polysulfone, polyethersulfone, and polyarylsulfone are used for the process. In the in-mold metallization process, various conductive, resistive, capacitive, or inductive components are embedded directly into the plastic part in the tool. 

Suppliers of a given type of plastics, such as polyethersulfones or epoxy resins, usually offer a whole range of grades. It is impossible to tell from company literature whether two resin grades are fundamentally different, or similar in all respects but for one detail, such as their ease of processing. 

The most common type of microdialysis probe is constructed as a concentric tube as shown in Fig. 1. The probes usually consist of a semiper-meable membrane, such as polysulfone, polyethersulfone, polyamide, polycarbonate-poly ether copolymer, or cuprophan [4], glued between the tip of the inner cannula and the outer shaft, which are made of steel or plastic. The perfusion fluid (perfusate) enters the inlet flowing through the inner tube to its distal end and exits the inner tube to enter the space between the inner tube and the outer dialysis membrane where molecular exchange takes place. After the exchange, the fluid containing the molecules of interest (dialysate) is transferred towards the proximal end of the probe and is collected at the outlet for later... 

Many kinds of polymers are used in the electronics industries, from polyethylene to so-called super engineering plastics, such as polyethersulfone or polyimide. Almost all of them require additives. The reason for this is either to retain intrinsic characteristics or to extend those characteristics. In order to retain properties, polymers need process and heat stability, thermal stability or light stability. For the acquisition of new function, many kinds of functional additives can be added. Metal deactivators, antistatic agents and flame retardants are just some examples. 

They are easily bonded with epoxy or urethane adhesives however, the temperature resistance of the adhesives do not match the temperature resistance of the plastic part. No special surface treatment is required other than abrasion and solvent cleaning. Polyetherimide (ULTEM ), polyamide-imide (TORLON ), and polyethersulfone can be solvent cemented, and ultrasonic welding is possible. 

Ultrason E Polyethersulfone, <30 wt% glass fiber, PES BASF Plastics... 

Ultrason E, Polyethersulfone, BASF Corp., Plastic Materials... 

Several studies have determined the threshold stress intensity for engineering plastics, eg, polycarbonate (5). The dt/6N values are in excellent agreement for growth rates > 10 mm/cycle but differ significantly for lower values. Additional threshold data have been reported for PMMA as a function of stress ratio R, where R = l min/ max (70). Other studies have been conducted to characterize the near threshold crack propagation behavior (12,71). Figure 21 (12) shows a a-N curve for polyethersulfone, including data at the near threshold level. Similarly... 

This survey covers measurements on plastics with all the reinforcing agents previously mentioned and includes a wide range of plastics now being used in plastics technology. It includes commonly used plastics such as polyamides, polyesters, polyethylene terephthalate, and epoxy resins, but also covers newer plastics, such as polyimides, polysulfones, polyethersulfone, polyphenylene sulfide, and polyether ether ketone, all of which have more specialized applications. 

The heat distortion temperature at 1.80 Mpa is the temperature that causes a beam loaded to 1.80 to deflect by 0.3 mm. If the heat distortion temperature is lower than the ambient temperature, -20 C is given. Polymers such as low-density polyethylene, styrene ethylene-butene terpolymer, ethylene-vinyl acetate copolymer, polyurethane, and plasticized polyvinyl chloride distort at temperatures below <50°C, whereas others, such as epoxies, polyether ether ketone, polydiallylphthalate, polydiallyl isophthalate, polycarbonate, alkyd resins, phenol formaldehyde, polymide 6,10 polyimide, poly-etherimides, polyphenylene sulfide, polyethersulfone, polysulfonates, and silicones, have remaikably high distortion temperatures in the range of 150°C to >300 C. Thermomechanical analysis has been used to determine the deflection temperature of polymers and sample loading forces (i.e., plots of temperature vs. flexure). 

DESIGNING WITH PLASTICS AND COMPOSITES A HANDBOOK POLYETHERSULFONE... 

The Composite Materials Research Laboratory headed by Chung at the State University of New York at Buffalo, New York, has recently conducted some interesting evaluations of a wide variety of EMI shielding filler materials for plastics. In all cases, the polymeric material they studied was polyethersulfone (PES). This is a very attractive polymer for the molding of housings for electronic devices. Its properties are shown in Table 2. 

Haas TW. Polyethersulfone (PES). In Rubin II, editor. Handbook of plastic materials and technology. NY Wiley-Interscience 1990. p. 295. 

Polyethersulfone (PES) is an amorphous polymer and a high-temperature engineering thermoplastic. Even though PES has high-temperature performance, it can be processed on conventional plastic processing equipment. Its chemical structure is shown in Fig. 12.15. PES has an outstanding ability to withstand exposure to elevated temperatures in air and water for prolonged periods. 

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