Polyetherimide

Polyetherimide A wide variety of commercially available adhesives can be used in bonding polyetherimide to itself or to dissimilar materials. Among these are polyurethane [(cure at RT to 302°F (150°C)], RTV silicones, hot melts (polyamide types) curing at 401 C (205°C) and epoxies (non-amine type, two-part) (12). 

Poly butylene Terephthalate (PBT) Commercial adhesives recommended include modified epoxies, cyanoacrylates, acrylics, polyurethanes, silicone, and polyesters. 

Pentaeiythritotetrabenzoate ester (Benzoflex S-552) was used to plasticize poly(arylene ether)/polyetheriniide blends. A micFoporous membrane was manufactured from plasticized polyetherimide. Plasticizer was then removed by leaching into a suitable solvent.  

Major polymer applications niicrowaveable cookware, electronic connectors, automotive engine sensors, bulb sockets, vacuum pump vanes, aircraft interiors, steam sterilizable surgical components 

Important processing methods injection molding, blow molding, extrusion 

Typical fillers glass fiber, carbon fiber 

Special considerations PEI has very good fire resistance (LOI 47%) compounding with 30 wt% glass fiber reduces LOI to 32 compounding of PEI with glass fiber does not affect heat deflection temperature 

Major polymer applications aircraft interiors, multipin connectors, coil bobbins, integrated circuits sockets, fiber optics connectors, dip switches, automotive fuses, printed circuit boards, transformer wire coatings, microwave cookware, sight glasses, membranes, medical applications (due to the resistance to different methods of sterilization), coatings 

PE has a non-polar, nonporous, and inert surface. For this reason, adhesives cannot link chemically or mechanically to untreated PE surfaces. Although PE is relatively inert to most solvents, solvent cementing cannot be used. For bonding to itself or to other materials, an adhesive with a suitable surface preparation method must be used. There are a number of surface treatment techniques in use, including chemical, electronic, flame, and primer methods. Oxidation treatments are the most successful. These include immersion in a chromic-acid solution, exposure to corona discharge, flame oxidation, immersion in an aqueous solution of chlorine, or exposure to chlorine gas in the presence of ultraviolet light. The chromic acid oxidation method is probably the most convenient for use with molded plastic parts of diverse contour. 

Wipe with acetone, methyl ethyl ketone (MEK) or xylene  

Immerse in the following chromic-acid solution (Table 7.9) for 60—90 min at room temperature, or 30—60 s at 71 °C 

Dissolve the potassium dichromate in the clean tap water then add the sulfuric acid in increments of about 200 g, stirring after each addition 

This method utilizes an oxyacetylene burner, which is passed over the faying surface until it 

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Bisphenol A. One mole of acetone condenses with two moles of phenol to form bisphenol A [80-05-07] which is used mainly in the production of polycarbonate and epoxy resins. Polycarbonates (qv) are high strength plastics used widely in automotive appHcations and appHances, multilayer containers, and housing appHcations. Epoxy resins (qv) are used in fiber-reinforced larninates, for encapsulating electronic components, and in advanced composites for aircraft—aerospace and automotive appHcations. Bisphenol A is also used for the production of corrosion- and chemical-resistant polyester resins, polysulfone resins, polyetherimide resins, and polyarylate resins. 

Polyetherimide synthesis has been achieved by reaction of a dianhydride containing an ether linkage with a diamine, reaction of a diamine containing an ether linkage with a dianhydride, or nucleophilic displacement of halo or nitro groups of a bisimide by bisphenol dianion (19,20). Such Pis exhibit good thermal stabiUty and melt processibiUty. 

AppHcation of an adhesion-promoting paint before metal spraying improves the coating. Color-coded paints, which indicate compatibiHty with specific plastics, can be appHed at 20 times the rate of grit blasting, typically at 0.025-mm dry film thickness. The main test and control method is cross-hatch adhesion. Among the most common plastics coated with such paints are polycarbonate, poly(phenylene ether), polystyrene, ABS, poly(vinyl chloride), polyethylene, polyester, and polyetherimide. 

Other blends of polycarbonate have limited markets so far. The most significant blends are with polyurethanes, polyetherimides, acrylate—styrene-acrylonitrile (ASA), acrylonitrile—ethylene—styrene (AES), and styrene—maleic anhydride (SMA). 

A variety of polyetherimides have been described in reviews on polyimides (qv) (88). Many more recent materials have additional heterocycHc units such as quinoxaline and ben2imida2ole units, besides the ether and imide functionahties (89). 

An all aromatic polyetherimide is made by Du Pont from reaction of pyromelUtic dianhydride and 4,4 -oxydianiline and is sold as Kapton. It possesses excellent thermal stabiUty, mechanical characteristics, and electrical properties, as indicated in Table 3. The high heat-deflection temperature of the resin limits its processibiUty. Kapton is available as general-purpose film and used in appHcations such as washers and gaskets. Often the resin is not used directly rather, the more tractable polyamide acid intermediate is appHed in solution to a surface and then is thermally imidi2ed as the solvent evaporates. 

Syntheses. The presence of the ether and imide functionahties provides two general approaches for synthesis. Polyetherimides can be prepared by a nucleophilic displacement polymerkation similar to the haUde displacement inpolysulfone synthesis or by a condensation of dianhydrides and diamines that is similar to normal polyimide synthesis (see POLYIMIDES). 

I itro-DisplacementPolymerization. The facile nucleophilic displacement of a nitro group on a phthalimide by an oxyanion has been used to prepare polyetherimides by heating bisphenoxides with bisnitrophthalimides (91). For example with 4,4 -dinitro monomers, a polymer with the Ultem backbone is prepared as follows (92). Because of the high reactivity of the nitro phthalimides, the polymerkation can be carried out at temperatures below 75°C. Relative reactivities are nitro compounds over halogens, Ai-aryl imides over A/-alkyl imides, and 3-substituents over 4-substituents. Solvents are usually dipolar aprotic Hquids such as dimethyl sulfoxide, and sometimes an aromatic Hquid is used, in addition. 

Polymerization of the dianhydride and diamine proceeds through an intermediate poly(amide acid) stage before ring closure converts the adjacent acid and amide groups to the polyetherimide (94). The polymerization can be carried directiy to the polyetherimide as a single-step process, or first to an ainide—acid-containing prepolymer, which can be isolated, and then to the polyetherimide. 

Polymerization via Nucleophilic Substitution Reaction. Halo- and nitro- groups attached to phthahmide groups are strongly activated toward nucleophilic substitution reactions. Thus polyetherimides ate synthesized by the nucleophilic substitution reaction of bishaloimides (59,60) and bisnitroimides (61,62) with anhydrous bisphenol salts in dipolar aptotic solvents. 

The majority of polyetherimides are tractable and their polymerization can be performed in solution or in the melt. High molecular weight polyetherimides have been synthesized via one-step imide—amine exchange reaction between bis(etherimide)s and diamine (67) according to the following ... 

This scheme eliminates the process of converting bis(etherimide)s to bis(ether anhydride)s. When polyetherimides are fusible the polymerization is performed in the melt, allowing the monamine to distill off. It is advantageous if the amino groups of diamines are more basic or nucleophilic than the by-product monoamine. Bisimides derived from heteroaromatic amines such as 2-arninopyridine are readily exchanged by common aromatic diamines (68,69). High molecular weight polyetherimides have been synthesized from various N,lSf -bis(heteroaryl)bis(etherimide)s. 

A number of amorphous thermoplastics are presently employed as matrices in long fiber composites, including polyethersulfone (PES), polysulfone (PSU), and polyetherimide (PEI). AH offer superior resistance to impact loading and higher interlaminar fracture toughnesses than do most epoxies. However, the amorphous nature of such polymers results in a lower solvent resistance, clearly a limitation if composites based on such polymers are to be used in aggressive environments. 

Information on the synthesis of the polyetherimide—polysiloxane block copolymers has not been disclosed. Many other synthetic methods for preparing block copolymers have been described (19,20,25) but are currendy not beheved to be commercially important. 

Table 13. Typical Properties of Polyamide/Elastomer and Polyetherimide/Elastomer Block Copolymers ...

The polyetherimide—polysdoxane multiblock copolymers are relatively hard (about 70 on the Shore D scale). Their main appHcation is flame-resistant wire and cable covering (24), where they combine very low flammabiUty with a low level of toxic products in the smoke. This unusual and vital combination of properties justifies their relatively high price, about 37/kg, at a specific gravity of about 1.2. 

Some of the common types of plastics that ate used ate thermoplastics, such as poly(phenylene sulfide) (PPS) (see Polymers containing sulfur), nylons, Hquid crystal polymer (LCP), the polyesters (qv) such as polyesters that ate 30% glass-fiber reinforced, and poly(ethylene terephthalate) (PET), and polyetherimide (PEI) and thermosets such as diaHyl phthalate and phenoHc resins (qv). Because of the wide variety of manufacturing processes and usage requirements, these materials ate available in several variations which have a range of physical properties. 

Newer resins include polysulfone, polyethersulfone, polyetherimide, and polyetherketone. Some of these newer materials are high temperature thermoplastic, not thermoset, resins. They are being promoted for the design of injection-molded printed circuit boards in three-dimensional shapes for functional appHcations as an alternative to standard flat printed circuit boards. Only semiadditive or fully additive processing can be used with these devices. 

The UL flammability ratings describe the relative ease of ignition and combustibiUty of plastics. Tests include the measurement of flame propagation, time to self-extinguish, melt and drip with and without flame, and oxygen indexes. Some engineering plastics, eg, polyetherimides, are, as ranked by this test, inherently nonflammable. Others can be made nonflammable by compounding with flame retardants (ERs) such as bromine... 

Polyetherimide Resins. Polyetherknide resins (PEI) (7) were commercialized during the 1980s (see Polyimides). They ate produced by an unusual nucleophilic substitution process ... 

The PEEK resia is marketed as aeat or filled pellets for iajectioa mol ding, as powder for coatiags, or as preimpregaated fiber sheet and tapes. Apphcations iaclude parts that are exposed to high temperature, radiation, or aggressive chemical environments. Aerospace and military uses are prominent. At present, polyamideimide (PAl) resia and poly(arylene sulfides) are the main competitors for apphcations requiring service temperatures of 280°C. At lower temperatures, polyethersulfones, amorphous nylons, and polyetherimides (PEI) can be considered. 

Other Polyimide Resins. The polyimide category, which includes both the polyetherimide and the polyamide resins discussed eadier, can be broken down into three subdivisions. 

UETEM, Polyetherimide Properties Guide, Geneial Electiic Co., Pittsfield, Mass., Mai. 1985. 

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