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Surfactants polishes

Chem. Descrip. Isothiazolinones aq. formulation Uses Preservative, bactericide, fungicide, yeast inhibitor, algicideforaq. coatings, polymer disps., filler suspensions, sol ns. and disps. of adhesives and thickeners, concrete additives, oil emulsions, polishes, surfactants, cleaners... [Pg.663]

One of the most important categories of products used for surface modification includes products like paints, inks, and polishes. Eventhough they form a small fraction of the composition of paints, inks, and polishes, surfactants are the most essential component of these products. [Pg.454]

Uses Emulsifier for waxes, polishes surfactant for personal care prods. [Pg.1437]

Other chemical products (SICs 284, 285, 287, and 289) consist of some 6,175 corporations whose primary business is the manufacturing and marketing of soaps and detergents surfactants specialty cleaning, polishing, and sanitary preparations perfumes, cosmetics, and other toilet preparations paints, varnishes, enamels, and other allied products fertilizers, pesticides, and other agricultural chemicals and adhesives and sealants, explosives, printing ink, and other specialty chemicals and chemical preparations. [Pg.50]

GiammonaST. 1967. Effects of furniture polish on pulmonary surfactant. Am J Dis Child 113 658-663. [Pg.178]

Surfactants are widely used industrially and perform a variety of functions. As processing aids they help to disperse fillers and other ingredients and to form and stabilize emulsions. They are key components in shampoos, detergents, polishes and cleaning products. In other... [Pg.407]

Formulated metal polishes consist of fine abrasives similar to those involved in industrial buffing operations, ie, pumice, tripoli, kaolin, rouge and crocus iron oxides, and lime. Other ingredients include surfactants (qv), eg, sodium oleate [143-19-1] or sodium dodecylbenzenesulfonate [25155-30-0]-, chelating agents (qv), eg, citric acid [77-92-9] and solvents, eg, alcohols or aliphatic hydrocarbons. [Pg.211]

Metal polishes may contain emulsifiers and thickeners for controlling the consistency and stabilization of abrasive suspensions, and the product form can be solid, paste, or liquid. Liquid and paste products can be solvent or emulsion types the market for the latter is growing. Formulas for metal polishes are listed in Reference 12. A representative liquid emulsion product may contain 8—25 wt % abrasive, 2—6 wt % surfactant, 0—5 wt % chelating agents, and 0—25 wt % solvent, with the remainder being water. The abrasive content in an emulsion paste product is greater than that in a solvent product. [Pg.211]

As an example, consider a clean floor tile with a surface tension of 32 mN m-1 and the same tile that has been soiled (27 mN m 1). This is an example of a very realistic possibility. One can observe clearly that the contact angle increases dramatically once the surface tension of the liquid (for example, floor polish with surfactant) increases above that of the substrate. Shown also in Figure 6.55 are bars that span typical surface tension expected... [Pg.229]

Emulsions. Aerosol emulsions (qv) may be oil in water (o/w), such as shaving creams, or water in oil (w/o), such as air fresheners and polishes. These aerosols consist of active ingredients, an aqueous or nonaqueous vehicle, a surfactant, and a propellant, and can be emitted as a foam or as a spray. [Pg.345]

Quick-breaking foams consist of a miscible solvent system such ethanol (qv) [64-17-5] and water, and a surfactant that is soluble in one of the solvents but not in both. These foams are advantageous for topical application of pharmaceuticals because, once the foam hits the affected area, the foam collapses, delivering the product to the wound without further injury from mechanical dispersion. This method is especially useful for treatment of bums. Some personal products such as nail polish remover and after-shave lotion have also been formulated as quick-breaking foams. [Pg.346]

The added surfactant molecules intended for CMP slurry stabilization can adsorb not only onto the abrasive particle but also onto the surface of the wafer to be polished. Depending on the extent of such adsorption, the added surfactant may influence the CMP process in several ways such as change in friction behavior of the slurry, modification of removal rate and selectivity, alteration of defectivity level, and shift in post-CMP profile. In this section the impact of surfactant adsorption on the removal rate, selectivity, and post-CMP cleaning characteristics will be discussed. [Pg.222]

Park J-G, Katoh T, Lee W-M, Jeon H, Paik U. Surfactant effect on oxide to nitride removal selectivity of nano-abrasive ceria slurry for chemical mechanical polishing. Jap Journ App Phy 2003 42 5420-5425. [Pg.245]


See other pages where Surfactants polishes is mentioned: [Pg.139]    [Pg.146]    [Pg.586]    [Pg.163]    [Pg.843]    [Pg.370]    [Pg.316]    [Pg.347]    [Pg.89]    [Pg.209]    [Pg.165]    [Pg.498]    [Pg.394]    [Pg.320]    [Pg.544]    [Pg.164]    [Pg.230]    [Pg.255]    [Pg.233]    [Pg.486]    [Pg.28]    [Pg.32]    [Pg.35]    [Pg.45]    [Pg.48]    [Pg.90]    [Pg.201]    [Pg.224]    [Pg.225]    [Pg.239]    [Pg.253]    [Pg.257]    [Pg.391]   


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