Polished sections equipment

Methods making use of epoxy resins, resulting in polished sections in only a few minutes, are discussed first, followed by details of impregnation and encapsulation. Equipment and techniques for grinding and polishing, including thin-section procedures, are described. The use of Hyrax , a synthetic resin with an index of refraction of 1.70, is discussed, followed by a description of a recommended method for refractive-index determination of particles mounted on a thin film of epoxy. 

The wide variety of available sawing, grinding, and polishing equipment, and the necessity for economically producing a high quality polished section, result in several options in building a compact, relatively maintenance free and inexpensive system for sample preparation. 

Equipment needed for microscopy in a cement plant may range from only a polarized-light microscope required for powder mount analysis to sawing, grinding, and polishing equipment necessary for thin-sec-tion and polished-section study. Two somewhat idealized lists of equipment are given in Table 11-1. The "Economy" column in the table contains only the minimum equipment for powder-mount study and polished-section examination. The other column also contains items for preparation of thin sections. 

A choice between reflected-light or transmitted-light techniques for plant use may, of necessity, be made on the basis of personal ease of application, tradition, equipment availability, or other reasons. In the writer s opinion, a combination of the two modes of analysis is best. Reflected-light observations of polished sections of whole or crushed clinkers from the... 

With quickly setting epoxy resins or similar materials, such as cyanoacrylate ester (Super Glue ), and modern semiautomatic grinding and polishing equipment, polished sections can be made within a few minutes, while an alcohol-washed, sieved clinker powder, moimted in refractive-index oil, is studied. 

Similarly, posttreatment refers to similar process equipment after the boiler section (such as condensate polishing). 

The observations are performed with a Leitz Ortholux polarizing microscope equipped with the ftOpak illuminator, lamps for reflected and transmitted light, immersion objectives, and verniers. Characteristics of the polished thin sections and of the nuclear emulsion plates are observed in transmitted light with the same immersion optics after removing the Berek prism. 

The differences and similarities in the requirements of CMP for microelectronics manufacturing and microfabrication are summarized in Table 14.1. This comparison gives an overview of the parameters relevant to CMP and is intended to serve as a guideline for CMP practitioners, consumable suppliers, equipment manufacturers, and others. Polishing tools and consumable sets capable of handling MEMS-specific tasks will be discussed at the end of this section. The following is a list of these terms for comparison. 

Unpattemed electroplated copper wafers were polished using an IPEC 472 polisher equipped with an IR temperature sensor which measures pad surface temperature. The copper rate was determined from copper thickness measurements from a Tencor RS55 resistance monitor, calibrated to cross-sectional SEM micrographs. The SEM tools are regularly calibrated to national standards. 

The VR-75 RRIM machine made by Accuratio Systems, Inc. (ASI) was used in this study, and a chromium polished steel mold (220 x 293 x 3 mm) with an aftermixer section was also used. It was equipped with cores for hot water circulation and was controlled at 60°C-70°C. The clamping force was supplied by a simple air bag press. The resin used consisted of a polyurea dispersion in a blend of... 

The two-dimensional distribution of nickel throughout the modified filter disc was examined with SEM/DEX (energy dispersive X-ray) on a polished radial cross section of the disc. The analysis was performed on a JSM 6400 (JEOL) equipped with a NORAN X-ray analysis system. The K line of nickel was used as the X-ray analysis line. The electron probe worked at an acceleration voltage of 15-25 kV and a current intensity of 3 x lO A. 

The chemical composition of minerals was determined in 29 polished carbon-coated thin sections using a Cameca Camebax BX50 microprobe equipped with three spectrometers and a back-scattered electron detector (BSE). Operating conditions were 20 kV acceleration voltage, 8 nA (for carbonates and clay minerals) to 12 nA (for feldspars) measured beam current, and a 1-10 pm beam diameter (depending on the extent of homogeneous areas). Standards and count times were wollastonite (Ca, 10 s), orthoclase (K, 5 s), albite (Na, Si, 5 and 10 s, respectively), corundum (Al, 20 s), MgO (Mg, 10 s), MnTiOj (Mn, 10 s) and hematite (Fe, 10 s). Precision of analysis was better than 0.1 mol%. 

The chemical composition of minerals was determined in a total of 17 polished, carbon-coated thin sections. A Cameca Camebax BX50 microprobe equipped with three spectrometers and a back-scattered electron detector (BSE) was used for quan-... 

EMP. EMP (electron microprobe) analysis was performed with a Cameca sx-50 microprobe equipped with WDS detectors. K-alpha lines were used to analyze AJ, Si, P, S and Zn, and L-alpha lines were used for Ce, Pb and Pd. Data was collected using a 20kV accelerating voltage, 60nA beam current, 1 micron spot size and 3 micron step increments across the cross-sectioned, polished fillettes. Elements were calibrated against their respective standards, supplied by Micro-Analysis Consultants Limited. 

The composites were cut and ground into bars for three-point-bending test in an lnstron-5566 machine with a crosshead speed of 0.5mm/min and a span of 24mm. Both the polished cross section and fracture surface were observed by Electron Microprobe Analysis (EPMA JXA-8100, JEOL, Tokyo, Japan) equipped with EDS. 

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