Plasma-assisted method

Nano-materials in lithium ion battery electrode design, presentation of a plasma-assisted method to create a carbon replica of an alumina template membrane... 

Surmenev, R.A. (2012) A review of plasma-assisted methods for calcium phosphate-based coatings fabrication. Surf. Coat. Technol., 206, 2035-2056. 

Mizutani T, Dale C J, Chu W K and Mayer T M 1985 Surface modification in plasma-assisted etching of silicon Nucl. Instrum. Methods B 7 825-30... 

The reactions that occur to auto-exhaust emissions when exposed to plasma include oxidation of HCs, carbon monoxide, and partially diesel PM also. Nitric oxide (NO) can be oxidized by plasma to N02. Plasma alone, due to its oxidizing character, is not a viable NO control method. However, combinations of plasma with catalysts, referred to as plasma-assisted catalysts or simply plasma catalysts , have been suggested for NO reduction. The plasma is believed to show potential to improve catalyst selectivity and removal efficiency. Current state-of-the-art plasma catalysts have efficiencies comparable to those of active DeNO systems, removing about 50% of NO at a fuel economy penalty of less than 5% [85],... 

This chapter examines the deposition of fluorinated polymers using plasma-assisted physical vapor deposition. Ultrathin coatings, between 20 and 5000 nm have been produced, using RF magnetron sputtering. The method of coating, fabrication, and deposition conditions are described. 

When the gases are introduced into the chamber, they are heated. Heating may be accomplished by many methods. In a plasma-assisted process, the gases are heated by passing them through a plasma. Otherwise, the gases may be passed over a series of wires, such as those found in a hot filament reactor. 

In general, several possible chemical reactions can occur in a CVD process, some of which are thermal decomposition (or pyrolysis), reduction, hydrolysis, oxidation, carburization, nitridization and polymerization. All of these can be activated by numerous methods such as thermal, plasma assisted, laser, photoassisted, rapid thermal processing assisted, and focussed ion or electron beams. Correspondingly, the CVD processes are termed, thermal CVD, plasma assisted CVD, laser CVD and so on. Among these, thermal and plasma assisted CVD techniques are widely used, although polymer CVD by other techniques has been reported. ... 

In order to find the domain of LCVD, it is necessary to compare various vacuum deposition processes chemical vapor deposition (CVD), physical vapor deposition (PVD), plasma chemical vapor deposition (PCVD), plasma-assisted CVD (PACVD), plasma-enhanced CVD (PECVD), and plasma polymerization (PP). All of these terms refer to methods or processes that yield the deposition of materials in a thin-film form in vacuum. There is no clear definition for these terms that can be used to separate processes that are represented by these terminologies. All involve the starting material in vapor phase and the product in the solid state. 

Another method for production of ceria films is by oxygen-plasma-assisted molecular beam epitaxy (OPA-MBE). This method has been reviewed by Chambers.The advantage of the oxygen assisted plasma technique is that for certain films the dissociation of O2 is limiting in the growth of fully oxidized films. By use of a plasma source of oxygen, O atoms and ions are provided to the... 

For the formation of a metallic film in addition to thick film silk-screen technique, thin film metallization is another means for the film deposition. Deposition of thin film can be accomplished by either physical or chemical means, and thin film technology has been extensively used in the microelectronics industry. Physical means is basically a vapor deposition, and there are various methods to carry out physical vapor deposition. In general, the process involves the following 1) the planned deposited metal is physically converted into vapor phase and 2) the metallic vapor is transported at reduced pressure and condensed onto the surface of the substrate. Physical vapor deposition includes thermal evaporation, electronic beam assisted evaporation, ion-beam and plasma sputtering method, and others. The physical depositions follow the steps described above. In essence, the metal is converted into molecules in the vapor phase and then condensed onto the substrate. Consequently, the deposition is based on molecules and is uniform and very smooth. 

H. Shiomi, K. Tanabe, Y. Nishibayashi, and N. Fujimori, Epitaxial growth of high quality diamond film by the microwave plasma-assisted chemical-vapor-deposition method, Jpn. J. Appl Pl s., 29(l) 34-40 (1990)... 

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