Big Chemical Encyclopedia

Chemical substances, components, reactions, process design ...

Articles Figures Tables About

Package process window

Figure 11.32 The Package process window shows the completion of the packaging process itself via creating BMI pkg.exe in the destination folder. If there is an error that will obstruct the package process, you will notice it here. You can save the generated messages/warnings to a log file for future analysis. Figure 11.32 The Package process window shows the completion of the packaging process itself via creating BMI pkg.exe in the destination folder. If there is an error that will obstruct the package process, you will notice it here. You can save the generated messages/warnings to a log file for future analysis.
Objective Determine which processing benefits new AO chemistries can bring to this industry segment Solution New stabilizer packages containing lactone AOs expand BOPP film s processing window, providing opportunities for Increased line productivity. [Pg.51]

PP s semicrystalline nature imparts to it an excellent combination of physical, thermal and chemical properties which makes it a premium material in packaging applications. Its commercial exploitation in this sector has, however, been impeded by several material-related properties which make it difficult to thermoform. The main problems are (1) low melt strength leading to sagging of the sheet during heating and which in turn results in parts with poor material distribution, and (2) a narrow temperature processing window within which the sheet may be formed. [Pg.848]

A minimum temperature of 230°C is required to ensure adequate wetting and spreading by the Pb-free solder on circuit board pads as well as on component leads and terminations. Temperatures exceeding 245°C increase the likelihood of thermal damage to larger, plastic-molded packages (e.g., BGA and QFP devices). When temperatures exceed 260°C, there is the potential for thermal degradation of passive chip components (chip capacitors, indnctors, or filters) as well as to circuit board structures (e.g., vias) and laminate materials. In the case of Sn-Pb eutectic solder that melts at 183°C, the minimum process temperature of 215°C ensures adequate solderability, which is 15°C lower than that of a nominal Pb-free process. The available Sn-Pb process window is 215°C to 260°C, or a AT equal to 45°C, rather than the AT of 30°C for the Sn-Ag-Cu Pb-free solders (T di = 217°C). [Pg.954]

The initial use was as a blow moulded vessel for vegetable oil candles. However, because of its biodegradability it is of interest for applications where paper and plastics materials are used together and which can, after use, be sent into a standard paper recycling process. Instances include blister packaging (the compound is transparent up to 3 mm in thickness), envelopes with transparent windows and clothes point-of-sale packaging. [Pg.627]

Data in this chapter have been processed with CPCwin (Colloid and Polymer Characterization for Windows A.H group, Austria e-mail anton.huber kfuni), a software package that has been developed to handle SEC data. The... [Pg.460]

Plastics can also be combined with other materials such as aluminum, steel, and wood to provide specific properties. Examples include PVC/wood window frames and plastic/ aluminum-foil packaging material. All combinations require that certain aspects of compatibility such as processing temperature and linear coefficient of thermal expansion or contraction exist. [Pg.374]

A great variety of PVC materials have been tested in the process thus far cable, cable trays, flooring material, window frames, artificial leather, packaging, pipes, flexible hoses, ring binders and roofing material. This indicates that the process is robust and can handle a broad range of PVC materials. In terms of chlorine content, there are no restrictions. With the completion of the pretreatment pilot plant, the contents of other plastics and metals may now be reduced significantly. [Pg.17]

Typical additive packages for engineering thermoplastics have been described by Titzschkau [9], such as processing aids for PA, PP, or PET/PBT, three-component additive packages for polyamides and polyesters (nucleating agent, lubricant and process heat stabiliser) and coated copper stabilisers for polyamides. Additive packages or combinations of up to five or more additives are quite common. A typical white window PVC profile formulation comprises an acrylic impact modifier, TiC>2, CaCC>3, calcium stearate, a... [Pg.7]

The primary and secondary aluminum industry produces ingots of pure (greater than 99%) aluminum that serve as feedstock for other materials and processes. Within the U.S., the leading end-users of aluminum come from three industries containers and packaging, transportation, and building and construction. Examples of materials produced with aluminum are sheet metal aluminum plate and foil rod, bar, and wire beverage cans automobiles aircraft components and window/door frames. [Pg.75]


See other pages where Package process window is mentioned: [Pg.385]    [Pg.385]    [Pg.89]    [Pg.250]    [Pg.87]    [Pg.806]    [Pg.399]    [Pg.20]    [Pg.1436]    [Pg.1064]    [Pg.99]    [Pg.131]    [Pg.5795]    [Pg.28]    [Pg.211]    [Pg.239]    [Pg.273]    [Pg.3]    [Pg.905]    [Pg.954]    [Pg.260]    [Pg.148]    [Pg.63]    [Pg.464]    [Pg.16]    [Pg.34]    [Pg.665]    [Pg.580]    [Pg.127]    [Pg.505]    [Pg.375]    [Pg.275]    [Pg.306]    [Pg.532]    [Pg.257]    [Pg.168]    [Pg.173]    [Pg.114]    [Pg.124]   


SEARCH



Packaging processes

Processes windows

Processing window

© 2024 chempedia.info