Motorola, Inc

Principal producers of ferroelectric capacitors are (110) Murata Manufacturing Co., Ltd., Kyoto, Japan Kyocera Corp., Kyoto, Japan Philips Electronics, N.V., Eindhoven, the Netherlands and NEC Corp., Tokyo, Japan. Principal piezoelectric ceramic component producers are (110) Murata Manufacturing Co., Ltd., Kyoto, Japan Motorola, Inc., Schaumburg, lU. EDO Corp., College Point, N.Y. Morgan Matroc, Inc., Bedford, Ohio Kyocera Corp., Kyoto, Japan and Philips Electronics, N.V., Eindhoven, the Netherlands. 

Battin, L. 1988 Six Sigma Process by Design - Design and Dimensions. Group Mechanical Technology, 1(1), Government Electronics Group, Motorola Inc., Scottsdale, Arizona. 

Motorola goes with ZigBee Protocol for Wireless Networking, press release, Motorola Inc., September 23rd 2003, Phoenix, Arizona. 

H. Maleki, G. Deng, A. Anani, and I. Kerzhner-Haller, US Patent Application (Motorola Inc., USA),... 

Motorola, Inc., Semiconductor Products Division, Phoenix, Ariz. 85005. Chemistry Department, Arizona State University, Tempe, Ariz. 85281. Chemistry Department, Michigan State University, East Lansing, Mich. 48823. 

The ideas expressed herein are those of the author and do not necessarily reflect the views or positions of Motorola Inc. 

L. Borucki, (Motorola Inc.), Mathematical modeling of polish-rate decay in chemical-mechanical polishing, Journal of Engineering Mathematics, 43, 2-4, 105-114, August 2002. 

Recently, a joint research project between Motorola Inc. and Cree Research yielded SiC FETs that operate at frequencies as high as 12.6 GHz [16]. The FETs were fabricated on 4H-SiC which has a higher mobility than 6H-SiC. 

Motorola. 1989. Motorola Telecommunications Data Book. Motorola, Inc., Phoenix, AZ. 

FIGURE8.132 A255bumpBGA, 1.5-mmpitchbetweenleads,27 x 27 mm body size (Source Courtesy of Motorola, Inc., Phoenix, AZ. Motorola. With permission.)... 

Motorola. 1993. Linear Interface ICs Device Data, Vol. 1, pp. 3-609. Motorola Inc. 

Wurzburg, H.N.D. Voltage Regulator Handbook Theory and Practice. Motorola Inc. 

Motorola. 1988. A Designer s Guide for Switching Power Supply Circuits and Components. Motorola Inc., SG79D Rev 5. UNITRODE Power Supply Design Seminar, UNITRODE Corp. (Call (603) 424-2410 or your local representative for specific dates and locations.)... 

Noble, Daniel E. 1970. Noble Comments. Phoenix, AZ Motorola Inc. 

Bruce Freyman and Robert Pennisi, Motorola, Inc., Overmolded Plastic Pad Array Carriers (OMPAC) A Low Cost, High Interconnect Density IC Packaging, Proceedings of the 41st Electronics Components Technology Conference, Atlanta, GA, May 1991. 

C. Becker, R. Brooks,T. Kirby, K. Moore, C. Raleigh,J. Stafford, and K.Wasko, Motorola, Inc., Direct Chip Attach (DCA), the Introduction of a New Packaging Concept for Portable Electronics, Proceedings of the 1993 International Electronics Packaging Conference, San Diego, CA, September 12-15,1993. 

Barney, M., Motorola Inc., Motorola s Second Generation, Six-Sigma Forum Magazine, May 2002. 

S. Wiegele, P. Thompson, R. Lee, and E. Ramslan Reliability and Process Characterization of Electroless Nickel-Gold/Sol-der Flip Chip Interconnect Technology, Motorola, Inc. 

Fig. 33 Force-resistance-deformation relationships for (a) rigid particle system and (b) deformable particle system. Courtesy of C.P. Yeh, Motorola Inc.

It is also possible to sulfonate PBI by direct treatment with sulfuric acid. A patent from Motorola Inc. [382] describes the sulfonation of PBI dissolved in concentrated sulfuric acid. Wet films of the so-obtained polymers have a conductivity... 

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