Microstrip line

Gupta, K. C. Garg, R. Bahl, I. J. Microstrip Lines and Slotlines Artech House Dedham MA, 1979. 

As mentioned before, the highest Q values can be achieved with hts thin film technology. In this case also ground plane metalization needs to be formed by a hts film, e.g. in general double sided films are required for ultimate performance. As an alternative, coplanar resonators have been used (d) with some compromize on Q in comparison to microstrip lines... 

Shi Y, Lin W, Olson DJ, Bechtel JH, Wang W (1999) Microstrip line-slot ground electrode for high-speed optical push-pull polymer modulators. In Organic thin films for photonic applications. Optical Society of America, Washington DC, p 20... 

FIGURE 7.18 Cross section of (a) a circularly shielded dual-plane waveguide with three microstrip lines, and (b) a two-layered four-element cylindrical cavity-backed aperture... 

FIGURE 7.19 Insertion loss of two circularly shielded waveguides with three (a) coplanar and (b) dual-plane microstrip lines... 

In the schematic shown in Figure 4.2.10, the RF path is visible between the two signal sources (RF ports) used for extracting the S parameters, and is composed of a length of microstrip transmission line from each port connected to a model for a series-switch plate . Driven by the 6 mechanical wires at each side, which control its position, the switch plate is internally modeled as an equivalent circuit including transmission line, frequency-dependent resistance, and variable capacitance between the conductor on the plate and the underlap of the ends of the microstrip lines separated by the gap for the switch isolation. As with the beams, this model is defined by a complete set of parameters, such as the dimensions and material properties. Parameters can be adjusted quickly to achieve the desired RF performance for different closing states of the electromechanical structure. 

The transmitted and reflected power measurement needs a bidirectional coupler and two power detectors, one for each measurement. The coupler main characteristics are the following ones coupling, directivity, low insertion losses, 27.095MHz operation frequency and a high input power. The design of this component has lead to consider and compare two possibilities microstrip lines and toroidal cores. 

Both of them accomplished the functional characteristic, however, each option present advantages and drawbacks. The first option is easy and cost-efficient to implement, since it is included in the board where the transmitter is mounted, but requires low tolerances in the fabrication process (microstrip line widths, material permitivity). The second option is less sensitive to the tolerances, however the vibration requirements would be difficult to fidfil. Since tolerances of the selected fabrication process assures the work of the microstrip coupler work in the required range, this is the chosen option. 

Microstrip line with diamond air-bridge fixture for high power measurement. 

Sorensen, R. K, Iskander, M. F. Lee, J. J. (2004). Low-cost nonplanar microstrip-line ferrite phase shifter utilizing circular polarization. leee Microwave and Wireless Components Letters, Vol. 14, No. 1, pp. 25-27, Issn 1531-1309. 

The adjustment of the matching outpnit PIN photodiode and the input microwave amplifier is necessary to achieve maximal respwnsivity and rninirnal losses in the electric transmission paths of the photonic receiver. The electrical p>art is made by thin layer hybrid microwave electrical integrated circuit. Our work was concentrated on design and construction of a microwave hybrid optoelectronic receiver Qefabek V.,Arciniega J.A., 2009), where the PIN photodiode was connected by microstripe line to inpnit of the HBT amplifier. The all parts are placed on the composite material substrate. 

Transmission characteristics of the LTCC substrate were compared to that of alumina with tungsten metallization. The substrate used in this measurement has a microstrip line configuration (Figure 1.1.18). Figure 1.1.19 shows the measured results of insertion loss (S21). The frequency range was from 0.1 to 50 GHz. The insertion loss of the LTCC was —0.35 dB/cm at 30 GHz, and was... 

We have developed a new LTCC which has excellent electric characteristics in the range of microwave frequency. Sheet resistance of copper metallization cofired with the LTCC was less than 3mS2/D, and the insertion loss of the microstrip line was —0.35 dB/cm at 30 GHz, and was half of that of tungsten metallization. 

FIGURE 9.75 A MSM photoconductor fabricated in a microstrip line configuration on semi-insulating InP. 

The reason that multilayer PCBs radiate at much lower levels than double-sided, single-layer boards is that the trace return is directly under the trace in the Vcc or Vb planes, forming a microstrip line. This is similar to the technique of using a phantom ground plane on single-layer boards as shown in Fig. 11.31. The trace height is now small compared to a trace that must wander over one or more rows as in single-layer boards. 

Figure 1.62. (a) Diagrammatic view of the correlation circuit for photoconductivity cross-correlation measurement in (CH) on broadband microstrip lines, (b) Corresponding circuit diagram. The switches are modeled using the approximation of lumped elements with a static capacitance Cg and a resistor having a time-dependent conductance G(/) in parallel. Z is the characteristic impedance of the transmission lines. (Reprinted with permission from ref. 149)... 

Several RF devices were fabricated (see Figure 10.6) using the above process. They include a 50-microstrip line, a patch antenna, a 4-by-l antenna array with feed network, and a spiral antenna. We note that all these structures remained intact after repetitive flexing and stretching. 

Figure 10.8 Three single-layer microstrip line samples (a) E-liber TL with E-fiber ground plane, (b) E-fiber TL with copper ground plane, and (c) copper TL with copper ground plane.

To extract explicit propagation constants along the TLs, three E-fiber microstrip lines were fabricated and measured (see Figure 10.12 Zhang et al., 2012). As described in Wang et al. (2012b), the fibers were first embroidered to form the textile TLs, followed by their integration onto the polymer substrates (Sr = 3, tan 5 <0.01). The E-fiber TLs and their copper counterparts were measured from 30 MHz to 6 GHz,... 

Camarchia, V., et al., 2014. Demonstration of inkjet-printed silver nanoparticle microstrip lines on alumina for RF power modules. Org. Electron. 15 (1), 91-98. 

The geometry of a single ACA joint is shown as Fig. 22, and parameters of the chip. Teflon board, and ACA joint are listed in Table 3. To avoid extremely small cells in the FDTD domain, the conductive particles are assumed to have a column shape with a height of 10 pm. A previous study (Ref 43) has shown that there is no significant difference in transmission behavior when 3 or 10 pm particles are used. In the FDTD simulation, the media under consideration were assumed to be uniform, isotropic, and homogeneous. Both the microstrip lines on the chip and on the substrate were designed as 50 Q transmission fines. A pulse with a spectrum of 1 to 30 GHz was used as the excited source. It was applied at the feed-in microstrip that was connected with the microstrip on the chip by flip-chip transition. To avoid electromagnetic reflec-... 

One of the latest approaches in microwave-induced plasmas consists of the realization of microwave discharges in microstructured resonant cavities using microstrip lines for power transmission (an MSP). Such a structure was achieved by... 

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