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Micro-encapsulated adhesives

Other substances. Without protection the pure substance undergoes fast aging and will be unusable after some hours. Therefore, TLCs are most commonly used within micro-encapsulation. Mixed with a binder the TLC capsules can be applied onto a surface via an airbrush. Complete adhesive foils produced with micro-encapsulated TLCs are available for measuring the surface temperatore with reduced lateral resolution. Another different technique is accessible when micro-encapsulated TLCs are dissolved in a liquid. Thus, it is possible to determine the temperatore field within a fluid. In general the capsules reduce the lateral resolution tracers in liquids, for example, have a minimum resolutimi of about 100 pm. [Pg.1644]

Casein is the major component (80 per cent) of milk, with molecular weights between 1 and 20kDa and includes four distinct types a-sl, a-s2, (3, and k. Casein is the predominant phosphoprotein that precipitates at pH 4.6 (20°C) and is characterized by an open, random coil structure. By treating acid-precipitated caseins with alkali solution caseinates are produced. Both caseins and caseinates form transparent films from aqueous solutions without any treatment because of their random coil nature and numerous hydrogen bonds. Caseins have shown to be useful in adhesives, micro encapsulation, food ingredients, and pharmaceuticals [31]. [Pg.484]

Anaerobic adhesives have been available for many years in a micro-encapsulated form. Fasteners are coated by deposition from a slurry. When dry the fasteners can be stored until required. Whilst this approach has obvious benefits for on-part inspection these products have had limited success due to shelf life problems and inconsistent locking performance. ... [Pg.213]

The ECN resins are multifunctional, solid polymers characterized by low ionic and hydrolyzable chlorine impurities, high chemical resistance, and good thermal performance. The ECN resins are widely used as base components in high-performance electronic and structural molding compounds, micro-chip encapsulation, high—temperature adhesives, structural molding powders, etc. [Pg.116]

Scanning acoustic microscopy (SAM) is an ideal nondestructive method for revealing internal flaws within materials or between material interfaces. SAM is extensively used in detecting voids, delamination, and other separations that can occur in adhesive-attached parts, especially after thermal cycling. SAM is particularly useful in the analysis or evaluation of many types of electronic parts, including ceramic and plastic-encapsulated ICs, plastic-encapsulated microcircuits (PEMs), hybrid micro-circuits, CSPs, PBGAs, and printed-wiring boards. [Pg.369]

These screws and bolts eliminate the need for nuts and washers and so provide cost savings. Common types incorporate a nylon insert, either as a small plug or as a strip along the length of the thread. Fig. 12.7(a). A development of this principle is the application of a layer of nylon over a patch of thread. As the screw is engaged in the mating part, the nylon is compressed and completely fills the space between thread forms. This provides an interference which will resist rotation of the screw. Fig. 12.7(b). A more recent development is the application to an area of thread of a chemical adhesive which is completely dry to the touch. Fig. 12.7(c). The liquid adhesive is encapsulated within the film. When the two threaded parts are assembled, the micro-capsules of adhesive are broken, releasing the adhesive, which hardens and provides a reliably sealed and locked thread. [Pg.186]

There is now an increased interest in reducing the size of the encapsulates (from micro- to nano-) in order to minimize their possible impact on food texture and appearance. Reducing the size of encapsulates also creates some extra benefits for specific functional food applications, because of the greater specific surface of the particles generated (for instance, improved adhesion properties). Lipids, polysaccharides and proteins have mostly been used to generate nanoencapsulation systems. [Pg.487]

From Section 3.3, it was shown there are a large number of monomers and oligomers available for polyurethanes. It is often said that if cost was not of concern, then urethane-based polymers could be tailored to replace most polymers for applications that did not demand too high a service temperature [28]. Polyurethanes, besides adhesives and sealants applications, can be found as foams (rigid, flexible, micro-cellular), elastomers, and encapsulants which differ slightly in raw materials. However, processing parameters and additives make feasible a diverse synthesis of this material. [Pg.123]


See other pages where Micro-encapsulated adhesives is mentioned: [Pg.98]    [Pg.388]    [Pg.1645]    [Pg.1015]    [Pg.702]    [Pg.705]    [Pg.235]    [Pg.713]    [Pg.236]    [Pg.419]    [Pg.1278]    [Pg.702]    [Pg.90]    [Pg.189]    [Pg.118]   
See also in sourсe #XX -- [ Pg.158 ]




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