Low-temperature cofired ceramic LTCC

MCM-C interconnect substrates are produced from either low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC). Either process can produce multilayer substrates having high numbers of conductor layers (up to 100), although for most applications 2-20 layers are sufficient. The fabrication of MCM-C involves thick-film processes that have wider lines and spacings (5-20 mils) than MCM-D, but are lower in cost. 

Photodiode Band-pass filters 125 X 125 Peristaltic pump Low- temperature cofired ceramic (LTCC) Dye (Pcmceau IV) 10 ng / ml Spectrofluorometry spectro 4iotometry... 

The chips themselves are most commonly made from SU-8 molds and polydimethylsUoxane (PDMS) which is a silicon-based organic polymer. It is optically clear, inert, and nontoxic, which makes it well suited for lab-(Mi-a-chip applications. Other glasses, silicon wafers, and acrylics have also been used. Recently, Golrmka et al. have used low-temperature cofired ceramic (LTCC) technology to produce electrical, optical, and fluidics within an LOC structure (Table 1, 10th and 11th rows) [10, 11]. 

Figure 1.3 shows an example module with thin-film interconnects on a low-temperature cofired ceramic (LTCC) substrate [32]. This module measures 81 X 55 X 1.88 mm and has a 14-layer cofired LTCC substrate with silver conductor and 6-layer thin-film interconnects (three on the top and three on the bottom) using Ti/Cu and benzocyclobutane (BCD) structure. A microprocessor is connected to 2 memory chips and over 140 passive components through about 4000 nets. 

Thermal vias in low-temperature cofired ceramic (LTCC) are fabricated in the same manner with the same constraints as in multilayer thick films. The only difference is the formulation of the via-fill material. 

Low-Temperature Cofired Ceramic (LTCC) Fligh-Temperature Cofired Ceramic (HTCC)... 

Copper can be plated on the surface conductors of both high-temperature cofired ceramic (HTCC) and low-temperature cofired ceramic (LTCC) packages and substrates. On internal layers, on HTCC, the conductors must be composed of high-resistivity refractory metallization. 

In particular, low-temperature cofired ceramics (LTCC) is a convenient technology for the manufacturing of band-pass filters for a frequency band of 380-2400 MFlz as required by radio telephony systems. 

As it is comparatively easy to combine Low Temperature Cofired Ceramics (LTCC) with materials that have different characteristics, it is possible to integrate and build the different types of components into the ceramic. Furthermore, while it is possible to incorporate low loss metal into LTCCs as a conductor, ceramic has low dielectric loss at high frequencies making it effective for achieving low loss performance, compared with other materials such as resin and the like. In addition, its thermal expansion coefficient compared with resin materials and other ceramic materials is low, and it has the merit of excellent connection reliability for high density packaging of LSI components. For these reasons, LTCCs are regarded as a... 

Multilayered Low Temperature Cofired Ceramics (LTCC) Technology... 

Imanaka, Y. (2005). Multilayered Low Temperature Cofired Ceramics (LTCC) Technology, Springer, New York. 

Low Temperature Cofired Ceramic (LTCC). A logical extension of the discussion of cofired alumina is a brief discussion of a recently developed technology low temperature cofired ceramic. A comprehensive discussion of this technology is contained in numerous sources, including a companion to this work, Electronic Packaging and Interconnection Handbook The information presented in that work is summarized here. 

Ceramic-glass composite materials may be used to economically fabricate very complex multilayer interconnection structures. The materials in powder form are mixed with an organic binder, a plasticizer, and a solvent and formed into a slurry by ball or roll milling. The slurry is forced under a doctor blade and dried to form a thin sheet, referred to as green tape or greensheet. Further processing depends on the type of material. There are three basic classes of materials high temperature cofired ceramic (HTCC), low temperature cofired ceramic (LTCC), and aluminum nitride. 

Low temperature cofired ceramic (LTCC) High temperature cofired ceramic (HTCC) Aluminum nitride... 

Jantunen H. A novel low temperature cofiring ceramic (LTCC) material for teleconmumication devices, Ph.D. thesis. Faculty of Science, (2001), (Finland, University of Oulu). 

Jantunen H., Rautioaho R., Uusimaki A. and Leppavuori S. Temperature Coefficient of Microwave Resonance Frequency of a Low-Temperature Cofired Ceramic (LTCC) System,/. Am. Ceram. Soc., (2002), 85, 697-699. 

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