Multilayer substrate

Waldvogel and Poulikakos1501 extended the model and numerical techniques of Zhao et al.13681 by incorporating solidification and droplet-substrate contact resistance in the heat transfer model. They conducted both theoretical and experimental studies on the impact and solidification of molten solder droplets on a multilayer substrate. The theoretical model was based on the Lagrangian formulation, and accounted for a host of thermal-fluid phenomena,... 

H. Ymeri, B. Nauwelaers and K. Maex. Computation of conductance and capacitance for IC interconnects on a General Lossy Multilayer substrate. Active and Passive Elec. Comp. Vol 24. pp 87-114,2001... 

Most inorganic membrane supports exhibit a tubular shape. This is a well-adapted geometry for cross-flow filtration in which the feed stream is circulated across the surface of the membrane and the permeated flux passes through the membrane in a perpendicular direction. Stainless steel, carbon, and ceramic are the most frequently used materials in the preparation of supports. As shown in Fig. 2, tubes or multichannel substrates can act as membrane supports. A well-designed support must be mechanically strong, and its resistance to fluid flow must be very low. Aiming at enhancing flux performances, multilayered substrates have been prepared that exhibit an asymmetric structure... 

MCM-C interconnect substrates are produced from either low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC). Either process can produce multilayer substrates having high numbers of conductor layers (up to 100), although for most applications 2-20 layers are sufficient. The fabrication of MCM-C involves thick-film processes that have wider lines and spacings (5-20 mils) than MCM-D, but are lower in cost. 

The test was carried out in 11 Eilenmeyer flasks containing the following multilayer substrate the bottom of each flask was covered with 20 g of a... 

Kawai, S. (1999). Development of glass-ceramic material for multilayer substrate in submillmeter-wave application, Proceedings of 12th Fall Meeting of the Ceramic Society of Japan , p. 397. 

Today, on the other hand, glass ceramics are widely used for ceramic multilayer substrate with Ag and Cu as an inner conductor. About 40—50% of grass elements such as AI2O3, SiOi, MgO and alkali-earth elements compose the dielectrics, which can sinter at relatively lower temperature (<900°C). 

C4PBGA, an 1C package developed by Motorola that attaches the IC die to a plastic substrate using the C4 process. It uses a multilayer substrate, unlike the chip-scale or SLICC package. 

With advancements in MCMs, where large chips (up to 500-mils square) are closely packed and where devices and interconnect substrates are fragile (for example, polyimide thin-film multilayer substrates used in MCM-D), new rework challenges have arisen. In these high-density circuits, spacings between the chips may be as small as 40 mils—too small... 

Nevertheless, preparation of the multilayer substrate surface is more complex and is usually carried out by the users instead of manufacturers of ceramic substrates. Simply applying a polymer layer onto the as-fired ceramic surface cannot lead to successful thin-film layers. The solvent trapped in microporosities in the conductor for vias and/or at the interface between conductor and ceramics may outgas during the reflow soldering when populating components on the finished thin-film substrate, resulting in poor adhesion of thin-film metal and dielectric at the position of vias. 

Properties of Glass-Ceramic Composites Used as Multilayer Substrates (Nippon Electric Glass Co., Japan) ... 

Semenov OV, Malek A, Bittermann AG, Voids J, Zisch AH. Engineered polyelectrolyte multilayer substrates for adhesion, proliferation, and differentiation of human mesenchymal stem cells. Tissue Eng Part A 2009 15 2977-2990. 

FIGURE 23.2 The IBSS/AAPIO multilayer substrate structure. 

FIGURE 23.9 Structure for the HDI multilayer substrate with lasered blind vias and direct connection to the ICs. 

FIGURE 23.12 The fabrication process for carrier-formed dreuit multilayer substrate. 

FIGURE 23.20 The OrmaLink multilayer substrate fabrication process. 

FIGURE 23.22 The ALIVH manufacturing sequence for a multilayer substrate. 

FIGURE 23.23 The ALIVH-FB manufacturing process for a multilayer substrate. (Illustration Courtesy of CirciuTree.)... 

So far we have considered H at the surface of a bulk substrate. The metal layer was made of the same element as the underlying bulk. In this chapter we go one step further and consider two-layer (or multilayer) substrates, in which the bulk substrate is covered with a top layer of a different metallic element. We are looking for effects H can have on the properties and also on the formation of the top layer. 

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