Cofired ceramic

Figure 6. Cofired ceramic pin grid array package with 270 pins and a tape-automated-bonded 1C.

Feature Cofired Ceramic Thick Film Thin Film... 

The most advanced implementation of cofired-ceramic-packaging technology is the thermal conduction module (TCM) used in large-scale computers (IBM) (4, 72, 74). This package can accommodate over 100 flip-chip-bonded ICs on a 90 by 90 mm cofired ceramic substrate. The multilayer ceramic substrate contains 33 metal layers for chip pad redistribution, signal interconnection, and power distribution (Figure 14). Each chip contains 120 bonding pads, and 1800 pins are brazed to the bottom of the substrate for connection to a PWB. 

Figure 16. Cross section of thin-film multilayer interconnections on a pinned cofired ceramic substrate, with face-up tape-automated-bonded chip and thermal vias. (Reproduced with permission from reference 79. Copyright 1988 Materials Research Society.)...

Heat Dissipation. The very high power densities resulting from increased circuit density and speed require innovative approaches for dissipating heat, such as heat pipes (160, 161), immersion cooling (64-66), or structures such as microchannels (162, 163) or microcapillaries (163-165) etched into the substrate or fabricated internally within a cofired ceramic substrate (166). 

Jantunen, H. et al. (2000) Preparing low-loss low-temperature cofired ceramic material without glass addition, J. Am. Ceram. Soc. 83, 2855-7. 

Wersing, W. et al. (1999) Integrated passive components using low temperature cofired ceramics, SPIE 3582, 193-9. 

A DIRECT METHANOL FUEL CELL USING CERMET ELECTRODES IN LOW TEMPERATURE COFIRE CERAMICS... 

A Direct Methanol Fuel Cell Using Cermet Electrodes in Low Temperature Cofire Ceramics... 

MCM-C interconnect substrates are produced from either low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC). Either process can produce multilayer substrates having high numbers of conductor layers (up to 100), although for most applications 2-20 layers are sufficient. The fabrication of MCM-C involves thick-film processes that have wider lines and spacings (5-20 mils) than MCM-D, but are lower in cost. 

Figure 5.6 Example of a ceramic multichip module (MCM-C) and a hybrid microcircuit. Top MCM-C fabricated from high-temperature cofired ceramic. Source Honeywell Sohd State Electronics Center. Bottom Multilayer thick-film hybrid microcircuit.

Photodiode Band-pass filters 125 X 125 Peristaltic pump Low- temperature cofired ceramic (LTCC) Dye (Pcmceau IV) 10 ng / ml Spectrofluorometry spectro 4iotometry... 

The chips themselves are most commonly made from SU-8 molds and polydimethylsUoxane (PDMS) which is a silicon-based organic polymer. It is optically clear, inert, and nontoxic, which makes it well suited for lab-(Mi-a-chip applications. Other glasses, silicon wafers, and acrylics have also been used. Recently, Golrmka et al. have used low-temperature cofired ceramic (LTCC) technology to produce electrical, optical, and fluidics within an LOC structure (Table 1, 10th and 11th rows) [10, 11]. 

PDMS, poly dimethylsilozane) PET, poly(ethylene terephthalate) PC, polycarbonate PMMA, poly(methyl methacrylate) PVC, poly(vinyl chloride) LTCC, low-temperature cofirable ceramics MES, 2-morpholinoethanesulfonic acid SDS, sodium dodecyl... 

The original multilayered ceramic packages were developed around what is today known as a high-temperature cofired ceramic (HTCC). In this technology the ceramic was primarily an alumina-based... 

G. Zablotny, Improving Yields in Cofired Ceramic Packages An Examination of Process and Equipment, Hybrid Circuit Technology, 9 [2] 33-35 (1992). 

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