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Liquid thermal expansion coefficient

The original reference also includes correlations for liquid and vapor specific volume, liquid thermal expansion coefficient, liquid and vapor enthalpy, liquid specific heat, and liquid and vapor Prandtl numbers. [Pg.639]

Equation (9.17). The slope of the curve below about 130 °C gives the thermal expansion coefficient for crystalline polyethylene, which is a hard plastic material. The volume expands sharply at the melting temperature. Above about 140 °C, the slope gives the thermal expansion coefficient of the plastic liquid. Thermal expansion coefficients are usually positive because increasing temperature causes a loosening up of the intermolecular bonds in the material. [Pg.160]

Thermal expansion coefficient of the film Thermal expansion coefficient of the liquid Thermal expansion coefficient of the solid Thermal expansion coefficient of the substrate Phase shift... [Pg.24]

The viscosity of liquid silicates such as drose containing barium oxide and silica show a rapid fall between pure silica and 20 mole per cent of metal oxide of nearly an order of magnitude at 2000 K, followed by a slower decrease as more metal oxide is added. The viscosity then decreases by a factor of two between 20 and 40 mole per cent. The activation energy for viscous flow decreases from 560 kJ in pure silica to 160-180kJmol as the network is broken up by metal oxide addition. The introduction of CaFa into a silicate melt reduces the viscosity markedly, typically by about a factor of drree. There is a rapid increase in the thermal expansivity coefficient as the network is dispersed, from practically zero in solid silica to around 40 cm moP in a typical soda-lime glass. [Pg.309]

Cathodoluminescence microscopy and spectroscopy techniques are powerful tools for analyzing the spatial uniformity of stresses in mismatched heterostructures, such as GaAs/Si and GaAs/InP. The stresses in such systems are due to the difference in thermal expansion coefficients between the epitaxial layer and the substrate. The presence of stress in the epitaxial layer leads to the modification of the band structure, and thus affects its electronic properties it also can cause the migration of dislocations, which may lead to the degradation of optoelectronic devices based on such mismatched heterostructures. This application employs low-temperature (preferably liquid-helium) CL microscopy and spectroscopy in conjunction with the known behavior of the optical transitions in the presence of stress to analyze the spatial uniformity of stress in GaAs epitaxial layers. This analysis can reveal,... [Pg.156]

It is clear that nonconfigurational factors are of great importance in the formation of solid and liquid metal solutions. Leaving aside the problem of magnetic contributions, the vibrational contributions are not understood in such a way that they may be embodied in a statistical treatment of metallic solutions. It would be helpful to have measurements both of ACP and A a. (where a is the thermal expansion coefficient) for the solution process as a function of temperature in order to have an idea of the relative importance of changes in the harmonic and the anharmonic terms in the potential energy of the lattice. [Pg.134]

Smith, W. T., Greenbaum, S. and Rutledge, G. P. (1954) J. Phys. Chem. 58, 443. Correlation of critical temperature with thermal expansion coefficients of organic liquids. [Pg.355]

Consider Problem 9-9, part a. This time use alcohol as a liquid medium with a thermal expansion coefficient of 1.12 X 10 3/°C. The heat capacity of the alcohol is 0.58 kcal/kg °C, and its density is 791 kg/m3. Determine the relief size required. [Pg.422]

Results for thermal expansion coefficient of liquids are presented for major organic chemicals. The results are especially helpful in the design of relief systems for process equipment containing liquids that are subject to thermal expansion. [Pg.145]

Physical and thermodynamic property data, such as thermal expansion coeffici t, are important in process engineering. The following brief discussion illustrates such importance. Liquids contained in process equipment will expand with an increase in temperature. To accommodate such expansion, it is necessary to design a relief system which will relieve (or vent) the thermally expanding liquid and prevent pressure build-up from the expansion. If provisions are not made for a relief system, the pressure will increase from die diermally expanding liquid. If the pressure increase is excessive, damage to the process equipment vtdll occur. [Pg.145]

The following equation was selected for correlation of thermal expansion coefficient of liquid as a function of temperature ... [Pg.145]

The results for thermal expansion coefficient are given in Table 7-1 for major organic chemicals. The presented values are applicable to a wide variety of substances. The tabulation also discloses the temperature range for which the equation is useable. The respective minimum and maximum temperatures are denoted by TMIN and TMAX. Spot values are provided at 25 C for both thermal expansion coefficient and liquid density. [Pg.145]

A comparison of calculated and actual data values for thermal expansion coefficient of liquid in Figure 7-2 for a representative compound. The graph indicates good agreement of calculated and data values. [Pg.146]

The correlation results maybe used for calculation of thermal expansion coefficient of liquid and volumetric flow from thermal expansion. Examples are shown in Table 7-2. [Pg.146]

Estimate the thermal expansion coefficient of liquid for n-pentane (CSH12) at 40 C. [Pg.172]

Thermal Expansion Coefficient for Liquids The coefficient of volume expansion for liquids is the ratio of the change in volume per degree to the volume at -17.8°F (0°C). The value of the coefficient varies with temperature. [Pg.356]

Data for thermal movement of various bitumens and felts and for composite membranes have been given (1). These describe the development of a thermal shock factor based on strength factors and the linear thermal expansion coefficient. Tensile and flexural fatigue tests on roofing membranes were taken at 21 and 18°C, and performance criteria were recommended. A study of four types of fluid-applied roofing membranes under cyclic conditions showed that they could not withstand movements of <1.0 mm over joints. The limitations of present test methods for new roofing materials, such as prefabricated polymeric and elastomeric sheets and liquid-applied membranes, have also been described (1). For evaluation, both laboratory and field work are needed. [Pg.216]

EXAMPLE 10.4 Hamaker Constant of Liquid Polystyrene. Estimate the Hamaker constant of liquid polystyrene at 298 K. The thermal expansion coefficient a for polystyrene at 298 K is approximately 5.7 10 4 K 1. Compare your result with the experimentally obtained value of A = 7.8 10 2°J reported by Croucher( 1981, Fig. 1). [Pg.490]

The approach to the critical point, from above or below, is accompanied by spectacular changes in optical, thermal, and mechanical properties. These include critical opalescence (a bright milky shimmering flash, as incident light refracts through intense density fluctuations) and infinite values of heat capacity, thermal expansion coefficient aP, isothermal compressibility /3r, and other properties. Truly, such a confused state of matter finds itself at a critical juncture as it transforms spontaneously from a uniform and isotropic form to a symmetry-broken (nonuniform and anisotropically separated) pair of distinct phases as (Tc, Pc) is approached from above. Similarly, as (Tc, Pc) is approached from below along the L + G coexistence line, the densities and other phase properties are forced to become identical, erasing what appears to be a fundamental physical distinction between liquid and gas at all lower temperatures and pressures. [Pg.49]

According to Ferry12 the free-volume per cm of substance, i. e. the fractional free-volume /, is hard to define exactly and should be regarded as merely a useful semi quantitative concept. Specifically, the thermal expansion coefficients of liquids for the most part reflect the increase in fractional free-volume only a small part is connected with the anharmonic dependence of potential energy or interatomic and intermoleeular distances. [Pg.66]

Here oth is the fraction of thermal expansion connected with changes in hole concentration (free-volume expansion), ), is the energy of hole formation, r=M/p0 Vn Na, where NA is the Avogadro number,M molecular weight, p0 the density of a liquid without holes at absolute zero, and Vn the hole volume. For polymeric systems r is very small, and then ahTis the function of E IRTalone. The value Of, is identified with experimentally observed changes in the thermal expansion coefficients A a at Tg, i.e. [Pg.81]

The low water absorptivity and good resistance to hydrostatic pressure make syntactic foams very useful for marine and submarine construction. Materials to be used for deep-sea application must have 1) low compressibilities at high hydrostatic pressure, 2) low thermal expansion coefficients, 3) low water absorption, and 4) good fire resistance. The fluids used for buoyancy in deep water submersibles include gasoline, ammonia, and silicone oil, while the solids include plastic, glass and aluminium foams, lithium, wood, and monolithic polyolefins. The liquids are dense but have low... [Pg.103]

In liquids and solids, particles are very close together and repulsive forces play a much more important role than they do in gases. It is not surprising, therefore, that equations of state, such as those of van der Waals, and Redlich and Kwong, do not do a good job of predicting liquid and solid phase data. Usually, data for liquids and solid are presented in the form of thermal expansion coefficients and isothermal compressibilities. Some data for a and k of selected liquids and solids are given in Table 3. [Pg.39]

TABLE 3 Thermal Expansion Coefficients and Isothermal Compressibility of Liquids and Solids... [Pg.40]


See other pages where Liquid thermal expansion coefficient is mentioned: [Pg.378]    [Pg.378]    [Pg.539]    [Pg.56]    [Pg.415]    [Pg.417]    [Pg.18]    [Pg.139]    [Pg.55]    [Pg.98]    [Pg.665]    [Pg.145]    [Pg.92]    [Pg.87]    [Pg.405]    [Pg.161]    [Pg.350]    [Pg.26]    [Pg.33]    [Pg.87]    [Pg.110]    [Pg.32]   
See also in sourсe #XX -- [ Pg.3 , Pg.417 ]




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