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Joint resistance model

Joint Resistance Model of Sphere-Flat Contacts. The joint thermal resistance of a contact formed by elastic bodies, such as a sphere-flat contact is obtained from the model proposed by Kitscha and Yovanovich [46] and Kitscha [47] ... [Pg.182]

Fig. 2-15 Joint-roughness model for analysis of thermal contact resistance. Fig. 2-15 Joint-roughness model for analysis of thermal contact resistance.
Thermal contact, gap, and joint conductance models developed by many researchers over the past five decades are reviewed and summarized in several articles [20,23,50,58,143,147,148] and in the recent text of Madhusudana [59]. The models are, in general, based on the assumption that the contacting surfaces are conforming (or flat) and that the surface asperities have particular height and asperity slope distributions [26, 116, 125]. The models assume either plastic or elastic deformation of the contacting asperities, and require the thermal spreading (constriction) resistance results presented above. [Pg.184]

S. Lee, S. Song, V. Au, and K. P Moran, Constriction/Spreading Resistance Model for Electronics Packaging, Proc. 4th ASME/JSME Thermal Engineering Joint Conference, Maui, HI, pp. 199-206, March 19-24,1995. [Pg.202]

When a weight was placed on the model bridge, as shown in Fig. 15.3(b), the joints resisted failure until a certain critical load was reached. At this critical load, that is the failure load, the joints peeled apart and the model bridge collapsed. With 10 mm wide strips the failure load was 70 g. Howeva, when impact load was used, the weight required was less, around 40 g. Under wet conditions the load was also Iowa, around 20 g. [Pg.356]

P(4) The rigorous procedure is based on fully elastic adhesive behaviour and closed-form analytical models. Adhesive plastic behaviour may also be utilised when determining the temporary maximum Joint resistance. [Pg.178]

The rigorous design method is based on generally accepted closed-form models. The adhesive behaviour in the models is assumed to be linearly elastic. Only the formulae used in the calculation of the temporary maximum joint resistance require the complete shear stress—shear strain curve or the elastic—plastic model of the adhesive to be known. As adhesives typically have a non-linear shear behaviour, using only the linear part of the stress—strain curve brings added conservatism to the models with respect to the actual joint resistance. [Pg.470]

It is worth recalling that any of the molecular force laws given by Eqs. (13-16) are derived within the framework of the freely-jointed model which considers the polymer chain as completely limp except for the spring force which resists stretching thus f(r) is purely entropic in nature and comes from the flexibility of the joints which permits the existence of a large number of conformations. With rodlike polymers, the statistical number of conformations is reduced to one and f(r) actually vanishes when the chain is in a fully extended state. [Pg.85]

For joint action in innovation systems and especially also for outlining the framework conditions by the political actors, it is expedient to understand the itmovation systems. The model developed in the scope of the project serves to create a systematic hnk between the framework conditions, the influential factors and the correlations between the participants. The various contributory parties can better assess their own options for influence, existing resistance to new ideas, possible coahtions or the significance of market trends, and can approach change processes in a more purposeful way as a resrrlt of this. [Pg.15]

Fernandez A, Cofiaudo J, Cunha EM, Ocio MJ, Martinez A (2002) Empirical model building based on Weibull distribution to describe the joint effect oh pH and temperature on the thermal resistance of Bacillus cereus in vegetale substrate. Int J Food Microbiol 77 147-153 Forney LJ, Zhou X, Brown CJ (2004) Molecular microbial ecology land of the one-eyed king. Curr Opin Microbiol 7 210-220... [Pg.207]

Resistive joint torque Soft tissue, passive stretching of antagonistic muscles, and ligaments introduce nonKnearities, which can be modeled as ... [Pg.239]

The presented form was developed heuristicaUy, and it shows that the resistive torques depend on both the joint angle and its angular velocity. The two first terms are the contributions of passive tissues crossing the joints (dissipative properties of joints) reduced to first-order functions. The other terms are the nonlinear components of the resistive torques around the terminal positions, and are modeled as double exponential curve [73],... [Pg.239]

For the monomer polymerization at room temperature, the adhesive was augmented with a redox system of 3% BP and 0.75% DMA. To study, explain, and predict the development of the elastic failure of the polymer in the adhesive interlayer, an improved method of investigating adhesive layer crack resistance with modeling of the formation and growth of a crack at the adhesive-honded joint loading was used [119]. Five adhesive-bonded joints with the adhesive mixture compositions shown in Table 3.1 were subjected to static tests for crack resistance at room temperature. The characteristics of the static crack resistance of the adhesive-bonded joint Kic is the coefficient of the stresses intensity Gic is the intensity of the elastic energy release ic is the opening in the crack tip) were determined at the moment of onset of the crack in double-cantilever specimens DCB (Fig. 3.5). The specimen cantilevers were made of PMMA of TOCH type. [Pg.113]

In the present study, a knee joint simulator is used to simulate the tibial axis load and flexion-extension motion under walking condition. The lubrication condition or fluid film formation in knee prosthesis models is evaluated by measuring the electric contact resistance between the femoral metallic component and tibial conductive polymeric or elastomeric component under the constant applied voltage in a knee joint simulator. [Pg.387]

Shunin, Yil N. Schwartz, K.K. High resistance of joints CNT/Me, In R.C. Tennyson, A.E., Kiv (eds) Computer modelling of electronic and atomic processes in solids. Kluwer Acad. Publishers, Dodrecht/Boston/London, 1997, pp. 241-257. [Pg.67]


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See also in sourсe #XX -- [ Pg.3 , Pg.3 , Pg.51 , Pg.53 ]




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