International Microelectronics

J. J. Barrett, High Definition Electroplated Copper Conductors on Silicon and Ceramic, Proceedings of the 5th International Microelectronics Conference, International Society of Hybrid Microelectronics, Tokyo, Japan (May 25-27, 1988), pp. 461-467. 

Tumala, R., Chahal, P, and Bhattachrya, S., Recent advances in integral passives at PRC, presented at the International Microelectronics and Packaging Society 35th Nordic Conference, Stockholm, Sweden, September 1998. 

Rolke, J. Proc. International Microelectronics Conference, Tokyo, 1980, p. 12-19. 

Copyright 2009 by IMAPS - International Microelectronics and Packaging Society. Permission to reprint/repubUsh granted from the 42nd International Symposium on Microelectronics (IMAPS 2009) Proceedings, pp. 492-499, November 1-5, 2009, San Jose McEnery Convention Center, San Jose, California. ISBN 0-930815-89-0. 

Stress = (Odij - aa,b) x 10 x (rcure - fuse) X modulus (-55°, +25°, +125 °C), where as i, = 10 ppm/°C for ferrite cores and ajhs (above or below Tg, respectively). (Copyright 1999 IMAPS - International Microelectronics and Packaging Society, and 2001 by Elsevier Press. Reproduced by permission.)... 

A. Christou, Reliability Aspects of Moisture and Ionic Contamination Diffusion Through Hybrid Encapsulants, in Proceedings of the Technical Program—International Microelectronics Conference (1978) p. 237, Industrial Scientific Conference Management, Inc., New York. Electric insulators and dielectrics Silicone/epoxy-polyurethane interpenetrating networks, moisture, and ion diffusion through potting compounds. 

Folk, M., Wang, V., Elshabini, A., and Barlow, E, Embedded passives in low-temperature co-fired ceramic for RF and microwave applications. Proceedings of the 2003 International Microelectronics and Packaging Conference, Boston, MA, 2003. 

Crumpton, J.C., Cofield, V.E., and Bacher, R.J., Through-hole plugs and thermal vias. Proceedings of the International Symposium on Microelectronics, International Microelectronics and Packaging Society (IMAPS), Washington, DC, 2000, pp. 325-329. 

So, Y. H., et al. In Proceedings of the International Microelectronics and Packaging Society, Boston, 2000 International Microelectronics and Package Society Washington, DC 80-86. 

J. W. Stafford, Chip Carriers— Their Application and Euture Direction, Proceedings of the International Microelectronics Con/erence, Anaheim, CA, February 26-28,1980, New York, June 17-19,1980. Also published in Electronics Packaging and Production, vol. 20, no. 7, July 1980. 

Akiteru Rai, Yoshihisa Dotta, Takashi Nukii, and Tetsuga Ohnishi, Sharp Corporation, Flip Chip COB Technology on PWB, Proceedings of the 7th International Microelectronics Conference, Yokohama, Japan, June 3-5,1992. 

Packages, International Microelectronics and Packaging Society (IMAPS), 2004. 

International Microelectronic and Packaging Society (IMAPS) http //www.imaps. org (accessed October 12, 2010). Founded in 1967, IMAPS holds an annual national conference as well as international, national, and regional saninars. 

Koichi Hirano, Seiichi Nakatani, and Jun ichi Kato, A Novel Composite Substrate with High Thermal Conductivity for CSP, MCM, and Power Modules, Proceedings, International Microelectronic and Packaging Society, 1998. 

Torii, A. Takizawa, M. Sawano, M. The application of flip chip bonding technology using anisotropic conductive film to the mobile communication terminals. Proceedings of the International Electronics Manufacturing Technology/International Microelectronics Conference, Tokyo, Japan, April 1998 94-99. 

Matsubara, H. Bare-chip face-down bonding technology using conductive particles and light-setting adhesives. Proceedings of the International Microelectronics Conference, Yokohama, Japan, 1992 81-87. 

IMAPS International Microelectronics and Packaging Society http //www.imaps.org/... 

B.L. Booth, Optical Waveguide and Fiber Array Connectivity and Packaging Solutions , invited paper presented at the Optoelectronics Device Packaging Topical Workshop and Exhibition sponsored by International Microelectronics and Packaging Society (IMAPS), Radisson Hotel, Bethlehem, PA, October 11-14, 2004 proceedings to be published. 

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