International Microelectronics IMAPS

Copyright 2009 by IMAPS - International Microelectronics and Packaging Society. Permission to reprint/repubUsh granted from the 42nd International Symposium on Microelectronics (IMAPS 2009) Proceedings, pp. 492-499, November 1-5, 2009, San Jose McEnery Convention Center, San Jose, California. ISBN 0-930815-89-0. 

Stress = (Odij - aa,b) x 10 x (rcure - fuse) X modulus (-55°, +25°, +125 °C), where as i, = 10 ppm/°C for ferrite cores and ajhs (above or below Tg, respectively). (Copyright 1999 IMAPS - International Microelectronics and Packaging Society, and 2001 by Elsevier Press. Reproduced by permission.)... 

Borland, W. and Felten, Thick film capacitors and resistors inside printed wiring boards, 34th International Symposium on Microelectronics (IMAPS), Baltimore, MD, Jime 2001, pp. 452-457. 

Crumpton, J.C., Cofield, V.E., and Bacher, R.J., Through-hole plugs and thermal vias. Proceedings of the International Symposium on Microelectronics, International Microelectronics and Packaging Society (IMAPS), Washington, DC, 2000, pp. 325-329. 

Packages, International Microelectronics and Packaging Society (IMAPS), 2004. 

Hoffmeyer, M., Farooq, M., Reliability and Microstructural Assessment of Hybrid CBGA Assemblies , paper presented at the 39th International Symposium on Microelectronics, IMAPS 2006, San Diego, October 8-12,2006. 

International Microelectronic and Packaging Society (IMAPS) http //www.imaps. org (accessed October 12, 2010). Founded in 1967, IMAPS holds an annual national conference as well as international, national, and regional saninars. 

Locher, I., et al., 2004. Routing methods adapted to e-textiles. In ftoceedings of the 37th International Symposium on Microelectronics (IMAPS 2004), November 2004. 

Buzby, D. Dobie, A. (2008). Fine Line Screen Printing of Thick Film Pastes on Silicon Solar Cells. Proceedings of the 41 International Si/mposium on Microelectronics (IMAPS 2008), Rhode Island, USA, November 2008. 

IMAPS International Microelectronics and Packaging Society http //www.imaps.org/... 

B.L. Booth, Optical Waveguide and Fiber Array Connectivity and Packaging Solutions , invited paper presented at the Optoelectronics Device Packaging Topical Workshop and Exhibition sponsored by International Microelectronics and Packaging Society (IMAPS), Radisson Hotel, Bethlehem, PA, October 11-14, 2004 proceedings to be published. 

N. Van Veen and D. Schwarzbach, Soldeijetting, A Software Driven Technology for Maskless Waferbumping. Proceedings, IMAPS International Symposium on Microelectronics (Chicago), 1999, pp. 154-159. 

ISHM International Society for Hybrid Microelectronics (now IMAPS)... 

M. Duffy et al., RF Characterization of No-Clean Solder Rux Residues, IMAPS International Symposium on Microelectronics, 2001... 

Harrison, M.R. Vincent, J. IDEALS improved design fife and environmentally aware manufacturing of electronics assemblies by lead-free soldering. Proc. IMAPS Europe 99, Harrogate, GB, June 1999. Stam, F.A. Davitt, E. Barrett, J. Reliabihty testing of SnAgCu solder surface mount assembly. Proc. IMAPS 32nd International Symposium on Microelectronics, October 1999 259-263. 

T. Muller, E. Milke, and E. K. Chung, New developments in wire bonding for future packages, presented at IMAPS 2007, the 40th International Symposium on Microelectronics Celebrating 40 Years of Excellence , November 2007, San Jose, CA. 

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