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International Electronics Manufacturing

Hu A, Zhang X, Sachs E, Renteln P. IEEE Proceeding of the 15th International Electronics Manufacturing Technology Symposium 1993. p 235-240. [Pg.506]

Cagan, M. Ridley, D. Proc. IEEE CHMT International Electronic Manufacturing Symp., 1987, p 154. [Pg.280]

Zhang, H., and Kuo, T. (1996), Graph-Based Approach to Disassembly Model for End-Of-life Product Recycling, in Proceedings of the 1996 lEEE/CMPT International Electronic Manufacturing Technology Symposium (Austin, TX), pp. 247—254. [Pg.543]

International Electronic Manufacturing Technology Symposium (lEMT), Omiya, Dec. 7995, pp. 93-96... [Pg.217]

Jackson, G.J., Durairaj, R. Ekere, N.N. (2002). Characterisation of Lead-Free Solder Pastes for Low-Cost Flip-Chip Bumping. Proceedings of the 27 Annual lEEE/CPMJ/SEMI/ International Electronics Manufacturing Technology (lEMT) Symposium, San Jose, CA, USA, July 2002, pp. 223-228. [Pg.337]

D. Shangguan and A. Achari, Evaluation of Lead-Free Eutectic Sn-Ag Solder for Automotive Electronics Packaging Applications, Proceedings of the International Electronics Manufacturing Technology Symposium, Sept 1994, p 25-37... [Pg.23]

J.R. Lloyd, C. Zhang, H.L. Tan, D. Shangguan, and A. Achari, Measurement of Thermal Conductivity and Specific Heat of Lead-Free Solder, Proceedings of the 1995 lEEE/CPMT International Electronics Manufacturing Technology Symposium, Oct 1995,p 252-262... [Pg.24]

Tin Whisker Accelerated Test Project, International Electronics Manufacturing Initiative (INEMI), Herndon, VA, http // www.nemi.org/projects/ese/ tin whisker.html (accessed March 2005)... [Pg.163]

Torii, A. Takizawa, M. Sawano, M. The application of flip chip bonding technology using anisotropic conductive film to the mobile communication terminals. Proceedings of the International Electronics Manufacturing Technology/International Microelectronics Conference, Tokyo, Japan, April 1998 94-99. [Pg.764]

Endoh, K. Nozawa, K. Hashimoto, N. Development of the MAPLE Method . Proceedings of the Japan International Electronics Manufacturing Technology Symposium, Kanazawa, Japan, 1993 187-191. [Pg.764]

Hatada, K. Fujimoto, K. Ochi, T. Ishida, Y. Applications of new assembly method Micron Bump Bonding Method . Proceedings of the 89 lEEE/CHMT Japan International Electronic Manufacturing Technology Symposium, Nara, Japan, April 1989 45-48. [Pg.768]

Investigations of Au-Sn alloys on different end metallisations, Anhock, S, et al., Proc. 22nd lEEE/CPMT International Electronics Manufacturing Technology Symposium, Berlin 27-29 April, 1988, 156-165. [Pg.189]

See other pages where International Electronics Manufacturing is mentioned: [Pg.302]    [Pg.382]    [Pg.436]    [Pg.24]    [Pg.1809]    [Pg.102]    [Pg.438]    [Pg.45]    [Pg.47]    [Pg.90]    [Pg.493]    [Pg.764]    [Pg.765]   


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