Anisotropic conductive film

The aligned-DNA, transparent, self-standing, and flexible film is of interest as a new naturally-occurring functional material, as well as an anisotropic conductive film. For example, the DNA-lipid film is effective as an adsorption filter of carcinogens such as acridine orange and ethidium bromide. The aligned-DNA film also shows polarization of light. [Pg.73]

Here the joining of an adhesive bonding a tape carrier package, in which a semiconductor chip has been incorporated, to a liquid crystal display panel through an anisotropic conductive film is shown. [Pg.64]

Ishibashi, K., and Kimura, J., A New Anisotropic Conductive Film with Arrayed Conductive Particles, AMP Journal of Technology, vol. 5, June 1996, p. 2430. [Pg.183]

Adhesive/Supplier ThreeBond 3370C/ThreeBond Anisolm AC-2056/Hitachi Anisotropic conductive Film 7393/3 M... [Pg.268]

Hitachi Anisotropic Conductive Film ANISOLM AC-2056, Technical Data Sheet. July 3,... [Pg.287]

M Product Data Sheet 3M Anisotropic Conductive Film Adhesive 7393. May, 2009. The Light Bulb Goes Digital. Fortune. Febmary 8, 2010 33-8. [Pg.287]

WeibuU analysis case study - anisotropic conductive film in flip-chip bonded devices 325... [Pg.289]

Table 6.5 Properties of anisotropic conductive film adhesives" ...

In the present study a version of the zone solidification method was employed to obtain anisotropically conducting films. [Pg.176]

Newly developed anisotropic conductive resins have generated several new termination technologies for high-density flexible circuits. Film-type and paste-type anisotropic materials are developed with suitable applicators. The film-type material, called anisotropic conductive film (ACF), has been widely used for the mounting of driver IC chips on the flexible substrate and connections between the flexible substrates and the glass substrates of the LCD devices. The latest material has 30 m pitch connections in one direction for the IC chips on the gold-plated pads of the flexible circuits. Examples of the basic properties are provided in Table 64.5... [Pg.1550]

M.J. Yim and K.W. Paik, Design and Understanding of Anisotropic Conductive Films (ACEs) for LCD Packaging, IEEE Transactions on Components Packaging and Manufacturing Technology, Part A, Vol 21, 1998,p 226-234... [Pg.275]

S.C. Tan et al.. Thermal Stability Performance of Anisotropic Conductive Film at Different Bonding Temperatures, Microelectronics Reliability, Vol 44,2004, p 495-503... [Pg.275]

C. Y. Yin et al., The Effect of Reflow Process on the Contact Resistance and Reliability of Anisotropic Conductive Film Interconnection for Rip Chip on Rex Applications, Microelectronics Reliability, Vol 43, 2003, p 625-633... [Pg.275]

ACF anisotropic conductive film LCCC leadless ceramic chip carriers... [Pg.282]

Shiozawa, N., Isaka, K., Ohta, T. (1994). Electric properties of connections by anisotropic conductive films. Adhesives in Electronics 94, International Conference on Adhesives Joining Technology Electronics Manufacture, VDI/VDE-IT. [Pg.480]

Kim JW, Jung SB (2007) Effect of bonding force on the reliability of the flip chip packages employing anisotropic conductive film with reflow process. Mater Sci Eng A 452-453 267... [Pg.1313]

Kim JW, Lee YC, Jung SB (2008c) Effect of bonding conditions on conduction behaviour of anisotropic conductive film interconnection. Met Mater Int 14 373... [Pg.1313]

Nitto Denko Corporation developed an anisotropic conductive film for fine-pitch flip-chip applications [33]. This ACF (1) is connectable between bumpless chips and a fine-pitch printed circuit board (PCB) (2) has high electrical conductivity (3) is repairable (easy to peal off chips from a printed circuit board at elevated temperatures) (4) has high reliability and (5) can be stored at room temperature. The other notable features are it is usable at pitches down to 25 pm the conductive elements are micrometallic columns as opposed to random-shaped particles this adhesive matrix consists of a thermoplastic polymer resin and the conductive columns are coated with an insulator and a high- Tg polymer that completely separates the columns from the adhesive (Fig. 8). [Pg.737]

FIG. 8 Illustration of a scheme for fine-pitch, flip-chip interconnection, (a) An anisotropic conductive film filled with micrometallic columns, (b) A typical cross-sectional structure of a chip without bumps and the mating chip carrier, (c) A cross section of an interconnect formed between an unbumped chip and the mating chip carrier. (From Ref. 33.)... [Pg.738]

Torii, A. Takizawa, M. Sawano, M. The application of flip chip bonding technology using anisotropic conductive film to the mobile communication terminals. Proceedings of the International Electronics Manufacturing Technology/International Microelectronics Conference, Tokyo, Japan, April 1998 94-99. [Pg.764]

Hotta, Y. Maeda, M. Asai, F. Eriguchi, F. Development of 0.025 mm pitch anisotropic conductive film. Proceedings of the 48th IEEE Electronic Components and Technology Conference,... [Pg.765]

Kim, K.M. The variability of anisotropic conductive film (ACF) as a flip chip interconnection technology. Proceedings of the 50th Electronics Components and Technology Conference, Las Vegas, NV, May 2000 1122-1132. [Pg.765]

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