Interfaces silicon/glass

Table 2. Reflection of light at an interface Index of refraction and percentage of energy reflected at an air-medium interface for glass, silicon and HgCdTe.

An interface or housing for micro fluidic applications was designed and fabricated. The device, made of PEEK, allows facile non-permanent coupling of standard capillary tubing to silicon/glass micro mixer chips. No additional adhesive material was used to for a secure and tight interconnect [70],... 

Diffused conductors maintain the hermeticity of the sealed cavity, but, due to the large sodium contamination of the silicon-glass interface, large leakage currents destroy the electrical insulation between the different conductors. 

Diffused and buried feed-throughs preserve the advantage of the previous approach while avoiding the negative effects at the silicon-glass interface [47]. 

Labossiere, P.E.W., Dunn, M.L., and Cunningham, S.J., Application of bimaterial interface comer failure mechanics to silicon/glass anodic bonds, Jourruil of the Mechanics and Physics of Solids 2002, 50,405-433. 

Many sputtered metals do not adhere particularly well to typical device substrate materials such as silicon, glass, and polymers. For example, noble metals such as Au can only rely on van der Waals forces for adhesion, and these forces are relatively weak. Metals such as Cr, Al, and Ti readily form a suboxide interface layer on glass and so they are often used as adhesion layers. 

In contrast to many other surface analytical techniques, like e. g. scanning electron microscopy, AFM does not require vacuum. Therefore, it can be operated under ambient conditions which enables direct observation of processes at solid-gas and solid-liquid interfaces. The latter can be accomplished by means of a liquid cell which is schematically shown in Fig. 5.6. The cell is formed by the sample at the bottom, a glass cover - holding the cantilever - at the top, and a silicone o-ring seal between. Studies with such a liquid cell can also be performed under potential control which opens up valuable opportunities for electrochemistry [5.11, 5.12]. Moreover, imaging under liquids opens up the possibility to protect sensitive surfaces by in-situ preparation and imaging under an inert fluid [5.13]. 

A Fig. 4 a —g. Some interface analysis techniques applied to polymers. Mostly the interface of a double layer system of polymer A/polymer B on a substrate (silicon wafer (Si) or glass) is investigated. In some cases deuterated (D) versus protonated (H) polymer films are used. Techniques and abbreviations are explained in the text and in Table 2... 

Silicon wafer has been extensively used in the semiconductor industry. CMP of silicon is one of the key technologies to obtain a smooth, defect-free, and high reflecting silicon surfaces in microelectronic device patterning. Silicon surface qualities have a direct effect on physical properties, such as breakdown point, interface state, and minority carrier lifetime, etc. Cook et al. [54] considered the chemical processes involved in the polishing of glass and extended it to the polishing of silicon wafer. They presented the chemical process which occurs by the interaction of the silicon layer and the... 

This simple reactor concept is based on a microstructured silicon chip (Figure 3.18) covered by a Pyrex-glass plate by anodic bonding [73, 74]. The silicon microstructure comprises, in addition to inlet and outlet structures, a multi-channel array. Only the Pyrex-glass plate acts as cover and inlet and outlet streams interface the silicon chip from the rear. 

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