Anodic Bonding of Glass and Silicon

Anodic bonding of the bottom glass wafer and the silicon wafer... 

Anodic Bonding, Fig. 3 Microreactor chip assembly by anodic bonding of silicon and glass... 

Chen et al recently reported the fabrication and characterization of a high power self-breathing PEMFC with optimally designed wet KOH etched flow-fields and electrodes [49]. Ni/Cu/Au layers are used for current collecting, the 1.5 /im-thick in-between layer instead of a thick Au layer allowing to reduce the fabrication cost. The MEA is composed of a classical Nafion -1135 membrane with Pt-alloy sprayed carbon paper on both sides. The two silicon electrodes are sandwiched and pressed at RT with the MEA, and then sealed with epoxy. A base-chip formed by drilled Pyrex glass anodically bonded with KOH eched silicon acted both as H2 inlet/outlet manifolds and as a support for a... 

Silicon material is normally of standard wafer sizes and thicknesses. As the anode part of the bonding pair, the silicon should be low in resistivity. However, some applications require an insulating layer to prevent electrical leakage in silicon. In this case, a thin layer of silicon dioxide or silicon nitride should be deposited on the silicon surface. The insulating layer does not prevent anodic bonding of silicon with glass. However, a thicker insulating layer... 

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