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Intel corporation

Figure 5 Atomic force microscope images of an aluminum film deposited on ambient (a) and heated (b) Si substrates. The scales are 15 pm x 15 pm (a) and 20 pm x 20 pm (b). The grain size can be clearly observed (Courtesy of M. Lawrence A. Dass, Intel Corporation). Figure 5 Atomic force microscope images of an aluminum film deposited on ambient (a) and heated (b) Si substrates. The scales are 15 pm x 15 pm (a) and 20 pm x 20 pm (b). The grain size can be clearly observed (Courtesy of M. Lawrence A. Dass, Intel Corporation).
Intel Corporation (2009) Fact Sheet, Fun facts exactly how small (and cool) is 32 nanometers ... [Pg.262]

Intel, 1991] Intel (1991). i860 Microprocessor Family Programmer Reference Manual. Intel Corporation. [Pg.547]

Microcomputer Research Labs, Intel Corporation 2200 Mission College Blvd. [Pg.1]

This trend conforms to a pattern foreseen in 1965 by Gordon Moore (1929- ), cofounder of the Intel Corporation. Moore predicted that the number of circuits on a silicon chip would double every year, a projection he later changed to a doubling every 18 to 24 months. Progress in chip design has followed Moore s Law with remarkable accuracy ever since. If that law continues to hold true, one can expect processors with a billion transistors per chip sometime before the year 2015. [Pg.93]

Intel Corporation Strategic Eacilities Technology Development RA1-220... [Pg.760]

Figure 4.8. The evolution of semiconductor clean rooms from 1968 O ft) to the present (right). Photos reproduced with permission from Intel Corporation (http //www.intel.com). Figure 4.8. The evolution of semiconductor clean rooms from 1968 O ft) to the present (right). Photos reproduced with permission from Intel Corporation (http //www.intel.com).
Figure 4.13. Scaling of transistor size. The top line indicates the technology node, whereas the bottom line indicates the physical size of the gate. It should be noted that the technology node no longer refers to physical dimensions of the transistor, but is rather an industry term related to a new fabrication process every 2 years, in accord with Moore s Law. By definition, the technology node refers to half the distance (half-pitch) between cells in a DRAM memory chip. It is noteworthy that the gate length, L, officially moved into the nanoregime in the year 2000. Reproduced with permission from Intel Corporation (http //www.intel.com). Figure 4.13. Scaling of transistor size. The top line indicates the technology node, whereas the bottom line indicates the physical size of the gate. It should be noted that the technology node no longer refers to physical dimensions of the transistor, but is rather an industry term related to a new fabrication process every 2 years, in accord with Moore s Law. By definition, the technology node refers to half the distance (half-pitch) between cells in a DRAM memory chip. It is noteworthy that the gate length, L, officially moved into the nanoregime in the year 2000. Reproduced with permission from Intel Corporation (http //www.intel.com).
Figure 4.14. Cross-section high-resolution transmission electron microscopy (HRTEM) images of gate oxides for MOSFETs. Provided is an illustration of film thicknesses that result in identical capacitance for Si02( = 3.8), relative to a high- c dielectric k = 23.9) gate oxide. Hence, increased gate capacitance will result from thinner films comprising high- c dielectric materials. Reproduced with permission from Intel Corporation (http //www.intel.com). Figure 4.14. Cross-section high-resolution transmission electron microscopy (HRTEM) images of gate oxides for MOSFETs. Provided is an illustration of film thicknesses that result in identical capacitance for Si02( = 3.8), relative to a high- c dielectric k = 23.9) gate oxide. Hence, increased gate capacitance will result from thinner films comprising high- c dielectric materials. Reproduced with permission from Intel Corporation (http //www.intel.com).
With the computer industry being as profitable as it is, there are many companies making CPUs for PCs today. The market leader in the manufacture of chips is Intel Corporation. Intel s competition includes Motorola, Advanced... [Pg.74]

Intel Corporation, Portland Technology Department, Hillsboro, Oregon, USA " Department of Chemical and Biomolecular Engineering, University of Maryland, College Park, Maryland, USA... [Pg.409]

Department of Chemical Engineering, India Institute of Technology—Bombay, Powai, Mumbai, India 124 Idaho Avenue, Unit 304, Santa Monica, CA, USA OFS Laboratories, Murray Hill, New Jersey, USA Intel Corporation, DCI Lithography, RA2, Hillsboro, Oregon, USA... [Pg.409]

Robert P. Meagley, Ph.D. Fab Materials Operation, Intel Corporation, Hillsboro, Oregon... [Pg.444]

Figure 7.4 Intel s wire-bonded stacked Chip Scale Packaged flash memory (courtesy of Intel Corporation)141... Figure 7.4 Intel s wire-bonded stacked Chip Scale Packaged flash memory (courtesy of Intel Corporation)141...
Intel Corporation. Intel stack Chip Scale Packaging products. Intel Flash Memory Home, [online]. Available http //www.intel.com/design/flcomp/prodbref/298051. htm. [Pg.160]

Figure 1.1 Plot of the number of transistors versus year for microprocessors manufactured by Advanced Micro Devices, Inc. and Intel Corporation microprocessors. ... Figure 1.1 Plot of the number of transistors versus year for microprocessors manufactured by Advanced Micro Devices, Inc. and Intel Corporation microprocessors. ...
Eor information on transistor count number versus year of manufacture for AMD s microprocessors, please see http //www.amd.com for Intel Corporation s microprocessors, please see http // www.intel.com/museum/archives/history docs/Moore.htm/Intel Microprocessor Transistor Count Chart. [Pg.6]

The causes of this impasse derive from the peculiar physical and economic laws that govern the design of ICs. The most celebrated of these laws stipulates that as transistors or other components are made smaller and are packed more densely on the surface of a silicon chip, the cost of producing the chip remains nearly constant, so much so that the number of transistors on a state-of-the-art chip doubles every year or two, as already alluded to. In effect, the cost per transistor steadily declines over time. This extraordinary fact is the basis of Moore s law, formulated in 1965 by Gordon E. Moore, one of the founders of the Intel Corporation. The law reflects the fantastic progression of circuit fabrication that has unleashed previously unimagined computational power. ... [Pg.155]

The first scanning projection system was developed under the auspices of a joint project between Perkin Elmer and Intel Corporation. [Pg.660]

Fernando Roa Colorado School of Mines, Golden, CO 80401, USA Current Address Intel Corporation, Chandler, AZ 85223, USA... [Pg.1]

As noted, the share price is a key parameter of the option pricing model. An increase in the underlying share price will result in a rise of the convertible price, and a decrease in the share price will result in a fall of the convertible price. Figure 9.9 illustrates the comparison between the convertible bond price and share price of Intel Corporation. [Pg.184]

Dalton J., Ippolito C., Poncet L, and Ralfaele S.R. 2005. Using RFID technologies to reduce blood transfusion errors. White Paper by Intel Corporation, Autentica, Cisco Systems, and San Raffaele Hospital 8. [Pg.67]

Intel Corporation s Environmental, Health and Safety Report... [Pg.16]


See other pages where Intel corporation is mentioned: [Pg.203]    [Pg.509]    [Pg.337]    [Pg.238]    [Pg.203]    [Pg.651]    [Pg.759]    [Pg.760]    [Pg.761]    [Pg.203]    [Pg.217]    [Pg.390]    [Pg.471]    [Pg.151]    [Pg.154]    [Pg.12]    [Pg.233]   
See also in sourсe #XX -- [ Pg.238 ]

See also in sourсe #XX -- [ Pg.574 , Pg.728 ]




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