Integrated circuit processing

W. R. Runyan and K. E. Bean, Semiconductor Integrated Circuit Processing Technology, Addison-Wesley, Reading, Mass., 1990. See discussion and references. 

When used as an interlevel dielectric, even greater demands are placed on the polyimide. Because integrated circuit processing includes as a final step a metal sinter at 400 C, the interlevel insulator film must withstand such exposures without degradation of electrical, chemical, or mechanical properties. In addition, the deposition, cure, and etch process must provide for reliable interconnection between the metal layers above and beneath the film (the "via contact") [8]. Issues of ion motion, moisture uptake, and electrical conduction both in bulk and at interfaces must also be considered carefully. 

Law, M.E. and Cea, S.M. (1998) Continuum Based Modeling of Silicon Integrated Circuit Processing An Object Oriented Approach. Comput. Mater. Sci., 12, 289-308. 

Vyvoda,M. A., Abrams, C.E, and Graves, IEEE Trans. Plus. Sci. 27(5), 1433-1440 (1999). Vyvoda, M. A., Surface Evolution during Integrated Circuit Processing, Ph.D. thesis. University... 

Obtained values for various materials common to silicon integrated circuit processes C12)... 

Figure 8.6 Integrated circuit process water system. (Bell Laboratories, Murray Hill, NJ)...

The discussions in this paper provide fundamental and overview material suitable for the new researcher in the field of integrated circuit processing, as well as provides the user of ion implantation with some relevant design information and some recent applications to some new devices and materials. 

Wafer Design and Characterization for Integrated-Circuit Processes... 

Photoresist stripping and residue removal will probably be the first microelectronics supercritical fluid applications integrated into IC (integrated circuit) processing. 

Microsensor arrays can be obtained by applying a combination of the integrated circuit process and microelectromechanical (MEMS) techniques. Using this array, we can enhance the selectivity and reliability of the system, employing statistical techniques. 

Defects in an integrated circuit process fall into three broad categories. They are ... 

Defects, although common in integrated circuit processes, are difficult to quantify via test methods. Therefore, the industry has developed abstractions of defects called faults. Faults attempt to model the way defects manifest themselves in the test environment. 

Greiner R, Allerdissen M, Voigt A, Richter A (2012) Fluidic microchemomechanical integrated circuits processing chemical information. Lab Chip 12 5034-5044 Hart RA, da Silva AK (2012) Self-optimizing, thermally adaptive microftuidic flow structures. Microfluid Nanofluid 14 121-132... 

GL Kerber, IE Cooper, HW Fry, GR King, RS Morris, JW Spargo, AG Toth. An all refractory NbN Josephson junction medium scale integrated circuit process. J Appl Phys 68 4853, 1990. 

SL Thomasson, AW Moopeim, R Ehnadjian, JM Murduck, JW Spargo, LA Abelson, HW Chan. AU refractory NbN integrated circuit process. IEEE Trans Appl Supercond 3 2058, 1993. 

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