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Heating thermal diffusivity

In order to select materials that will maintain acceptable mechanical characteristics and dimensional stability one must be aware of both the normal and extreme thermal operating environments to which a product will be subjected. TS plastics have specific thermal conditions when compared to TPs that have various factors to consider which influence the product s performance and processing capabilities. TPs properties and processes are influenced by their thermal characteristics such as melt temperature (Tm), glass-transition temperature (Tg), dimensional stability, thermal conductivity, specific heat, thermal diffusivity, heat capacity, coefficient of thermal expansion, and decomposition (Td) Table 1.2 also provides some of these data on different plastics. There is a maximum temperature or, to be more precise, a maximum time-to-temperature relationship for all materials preceding loss of performance or decomposition. Data presented for different plastics in Figure 1.5 show 50% retention of mechanical and physical properties obtainable at room temperature, with plastics exposure and testing at elevated temperatures. [Pg.17]

Thermal conductivity is a measure of the ability of a material to conduct heat. Thermal diffusivity is a measure of a material s ability to conduct heat relative to its ability to store heat (defined as thermal conductivity divided by heat capacity see next section). Heat can migrate relatively quickly through a material with high thermal conductivity, while heat flow into a material with high thermal diffusivity will result in a relatively rapid temperature increase. Typical values of thermal conductivity are presented in Table 24.1. [Pg.507]

Thermal expansivity is a measure of the expansion of a sample as a result of heating, thermal diffusivity is a measure of the rate at which a temperature disturbance applied to one part of a sample travels to another and kinematic viscosity reflects the viscosity-density ratio. [Pg.313]

The coefficient of linear thermal expansion, specific heat, thermal diffusivity, thermal conductivity for 1-D and 2-D SiC/RBSN at four temperatures in nitrogen measured parallel and perpendicular to the fibers are summarizedin Tables III and IV. In general, through-the thickness thermal conductivity value at room temperature for SiC/RBSN composites is low when compared with a value 7 W/m-k for the unreinforced RBSN or with a value of 30 W/m-k for the sintered silicon nitrides [13]. Both weak bonding between the SiC... [Pg.159]

Wenk, H.R., Wenk, E., 1969. Physical constants of alpine rocks (density, porosity, specific heat, thermal diffusivity and crmductivity). In Beitrage zur Geologic der Schweiz, 45. Leemaim AG, Zurich, pp. 343 357. [Pg.488]

This definition is in terms of a pool of liquid of depth h, where z is distance normal to the surface and ti and k are the liquid viscosity and thermal diffusivity, respectively [58]. (Thermal diffusivity is defined as the coefficient of thermal conductivity divided by density and by heat capacity per unit mass.) The critical Ma value for a system to show Marangoni instability is around 50-100. [Pg.112]

The coefficients, L., are characteristic of the phenomenon of thermal diffusion, i.e. the flow of matter caused by a temperature gradient. In liquids, this is called the Soret effect [12]. A reciprocal effect associated with the coefficient L. is called the Dufour effect [12] and describes heat flow caused by concentration gradients. The... [Pg.702]

Tables 2,3, and 4 outline many of the physical and thermodynamic properties ofpara- and normal hydrogen in the sohd, hquid, and gaseous states, respectively. Extensive tabulations of all the thermodynamic and transport properties hsted in these tables from the triple point to 3000 K and at 0.01—100 MPa (1—14,500 psi) are available (5,39). Additional properties, including accommodation coefficients, thermal diffusivity, virial coefficients, index of refraction, Joule-Thorns on coefficients, Prandti numbers, vapor pressures, infrared absorption, and heat transfer and thermal transpiration parameters are also available (5,40). Thermodynamic properties for hydrogen at 300—20,000 K and 10 Pa to 10.4 MPa (lO " -103 atm) (41) and transport properties at 1,000—30,000 K and 0.1—3.0 MPa (1—30 atm) (42) have been compiled. Enthalpy—entropy tabulations for hydrogen over the range 3—100,000 K and 0.001—101.3 MPa (0.01—1000 atm) have been made (43). Many physical properties for the other isotopes of hydrogen (deuterium and tritium) have also been compiled (44). Tables 2,3, and 4 outline many of the physical and thermodynamic properties ofpara- and normal hydrogen in the sohd, hquid, and gaseous states, respectively. Extensive tabulations of all the thermodynamic and transport properties hsted in these tables from the triple point to 3000 K and at 0.01—100 MPa (1—14,500 psi) are available (5,39). Additional properties, including accommodation coefficients, thermal diffusivity, virial coefficients, index of refraction, Joule-Thorns on coefficients, Prandti numbers, vapor pressures, infrared absorption, and heat transfer and thermal transpiration parameters are also available (5,40). Thermodynamic properties for hydrogen at 300—20,000 K and 10 Pa to 10.4 MPa (lO " -103 atm) (41) and transport properties at 1,000—30,000 K and 0.1—3.0 MPa (1—30 atm) (42) have been compiled. Enthalpy—entropy tabulations for hydrogen over the range 3—100,000 K and 0.001—101.3 MPa (0.01—1000 atm) have been made (43). Many physical properties for the other isotopes of hydrogen (deuterium and tritium) have also been compiled (44).
Thermal imaging is sensitive to iafrared radiation that detects temperature changes over the surface of a part when heat has been appHed. Thermal diffusion ia a soHd is affected by variatioa ia composition or by the preseace of cracks, voids, delamiaatioas, etc the effects are detected by surface temperature changes. Defects cannot be detected if their depth below the surface is more than two to three times their diameter. Nondestmctive testing has been primarily used for composites and analysis of adhesive bonds or welds. Several studies are documented ia the Hterature (322—327). [Pg.156]

The specific heat of coal can be deterrnined by direct measurement or from the ratio of the thermal conductivity and thermal diffusivity. The latter method gives values decreasing from 1.25J/(g-K)(0.3cal/(g-K)) at 20°C to 0.4J/(g-K)(0.1 cal/(g-K)) at 800°C. The specific heat is affected by the oxidation of the coal (46). [Pg.221]

Material Density, kg/nP Emissivity Specific heat, kJ/(kg-K) Thermal conductivity, W/(m-K) Thermal diffusivity, mVs X lO "... [Pg.381]

Mutual Diffusivity, Mass Diffusivity, Interdiffusion Coefficient Diffusivity is denoted by D g and is defined by Tick s first law as the ratio of the flux to the concentration gradient, as in Eq. (5-181). It is analogous to the thermal diffusivity in Fourier s law and to the kinematic viscosity in Newton s law. These analogies are flawed because both heat and momentum are conveniently defined with respec t to fixed coordinates, irrespective of the direction of transfer or its magnitude, while mass diffusivity most commonly requires information about bulk motion of the medium in which diffusion occurs. For hquids, it is common to refer to the hmit of infinite dilution of A in B using the symbol, D°g. [Pg.592]

Solidification involves heavy heat loads transferred essentially at a steady temperature difference. It also involves the varying values of hq-uid- and sohd-phase thickness and thermal diffusivity. en these are substantial and/or in the case of a hqmd flowing over a changing sohd... [Pg.1057]

Grady and Asay [49] estimate the actual local heating that may occur in shocked 6061-T6 Al. In the work of Hayes and Grady [50], slip planes are assumed to be separated by the characteristic distance d. Plastic deformation in the shock front is assumed to dissipate heat (per unit area) at a constant rate S.QdJt, where AQ is the dissipative component of internal energy change and is the shock risetime. The local slip-band temperature behind the shock front, 7), is obtained as a solution to the heat conduction equation with y as the thermal diffusivity... [Pg.242]

Here U = T — T )Cp/L is the appropriately rescaled temperature field T measured from the imposed temperature of the undercooled melt far away from the interface. The indices L and 5 refer to the liquid and solid, respectively, and the specific heat Cp and the thermal diffusion constant D are considered to be the same in both phases. L is the latent heat, and n is the normal to the interface. In terms of these parameters,... [Pg.889]

In our treatment of directional solidification above, only one diffusion field was treated explicitly, namely the compositional diffusion. If a simple material grows dendritically (thermal diffusion) one may worry about small amounts of impurities. This was reconsidered [132], confirming a qualitative previous result [133] that impurities may increase the dendritic growth rate. Recently some direct simulation results have been obtained with two coupled diffusion fields, one for heat and one for matter, but due to long computing times they are not yet in the state of standard applications [120,134]. [Pg.900]

However, a potential may give rise to more than one type of flux. There are cross-effects A temperature difference can also result in diffusion, called thermal diffusion, and a concentration difference can result in a heat current. The general relation between fluxes 7, and the driving potentials A) is of the form of linear relations... [Pg.928]


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See also in sourсe #XX -- [ Pg.45 ]




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